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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersSTM32G0B0KET6
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STM32G0B0KET6 - STMicroelectronics

Manufacturer Part Number
STM32G0B0KET6
Manufacturer
STMicroelectronics
Allelco Part Number
98D-STM32G0B0KET6
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
31,622 pcs available, New & Original
Parts Description
CONTROLLER / PROCESSOR
Package
32-LQFP (7x7)
Data sheet
STM32G0B0KET6.pdf

PCN Assembly/Origin

Assembly Site 28/Feb/2023.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 31622
  • Unit Price: $5.295
  • Subtotal: $0.00

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Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $5.295 $5.30
10+ $4.631 $46.31
30+ $4.227 $126.81
100+ $3.889 $388.90
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

STM32G0B0KET6 Tech Specifications
STMicroelectronics - STM32G0B0KET6 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - STM32G0B0KET6

Product Attribute Attribute Value
Manufacturer STMicroelectronics
Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V
Supplier Device Package 32-LQFP (7x7)
Speed 64MHz
Series STM32G0
RAM Size 144K x 8
Program Memory Type FLASH
Program Memory Size 512KB (512K x 8)
Peripherals DMA, I²S, POR, PWM, Voltage Detect, WDT
Package / Case 32-LQFP
Product Attribute Attribute Value
Package Bulk
Oscillator Type External, Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 29
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 13x12b SAR
Core Size 32-Bit
Core Processor ARM® Cortex®-M0+
Connectivity I²C, IrDA, LINbus, SPI, UART/USART

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected

Frequently Asked Questions(FAQ)

How does the STM32G0B0KET6 compare to other STM32G0 series microcontrollers in terms of flash memory capacity and core architecture, and what implications does this have for code density and power efficiency in embedded applications?
The STM32G0B0KET6 features a 512KB FLASH memory configuration and operates on an ARM® Cortex®-M0+ core running at up to 64MHz. Within the STM32G0 family, variants like the STM32G070 and STM32G081 offer higher flash densities (up to 1MB), which may be preferable for complex firmware or RTOS-based designs. However, the G0B0 series targets cost-sensitive applications where moderate program memory suffices. The Cortex-M0+ core in the STM32G0B0KET6 provides a balance between performance and power consumption, making it suitable for battery-powered devices. Its 64MHz clock speed supports real-time tasks while maintaining low active current, approximately 10–20 µA/MHz depending on peripheral usage. Designers selecting this part must ensure their application code fits within 512KB; otherwise, they may need to consider higher-density alternatives from the same family.
What are the key trade-offs when using the STM32G0B0KET6 in a system requiring both high-speed communication and low-power sleep modes?
The STM32G0B0KET6 integrates multiple communication interfaces—I2C, SPI, UART/USART, LINbus, IrDA, and SmartCard—enabling flexible connectivity. However, enabling these peripherals during operation increases dynamic power draw. For instance, a full-duplex UART transmission at 1 Mbps can consume over 5 mA at 3.3V. To optimize power, developers should disable unused peripherals via clock gating and leverage the MCU’s ultra-low-power modes such as Stop mode (~1.3 µA with RTC running). Additionally, switching between internal and external oscillators affects wake-up latency and power; the internal RC oscillator allows faster transitions but with ±2% frequency accuracy, whereas an external crystal improves timing precision at the cost of board space and quiescent current. Thus, the optimal configuration depends on whether the application prioritizes responsiveness or energy efficiency.
Can the STM32G0B0KET6 support real-time operating systems (RTOS) effectively given its RAM size and peripheral set?
Yes, the STM32G0B0KET6 is capable of running lightweight RTOS environments such as FreeRTOS or Zephyr, provided that application requirements remain within its constraints. With 144KB of RAM available, sufficient memory exists for task stacks, heaps, and middleware buffers in many typical use cases. For example, FreeRTOS typically requires only a few kilobytes of RAM beyond the kernel overhead. However, memory-intensive operations—such as large logging buffers or complex data structures—could exhaust available SRAM. Developers should conduct static analysis using tools like CubeMX or IAR Embedded Workbench to estimate memory usage early in development. Furthermore, the presence of DMA and PWM peripherals reduces CPU load, enhancing determinism critical for RTOS scheduling. This makes the STM32G0B0KET6 suitable for industrial control, sensor networks, and IoT edge nodes where moderate complexity meets strict timing needs.
How does the voltage range of 2V to 3.6V impact analog front-end design when using the STM32G0B0KET6’s integrated 12-bit SAR ADC?
The STM32G0B0KET6 supports a supply voltage range of 2V to 3.6V, which directly influences the reference voltage for its 13-channel, 12-bit SAR ADC. At 3.3V operation, the ADC can achieve a theoretical resolution of ~0.8 mV per step, but at 2.0V, the effective LSB becomes ~0.49 mV. However, lower supply voltages reduce noise immunity and increase susceptibility to electromagnetic interference. Designers must ensure that analog inputs are filtered appropriately and that signal conditioning circuits maintain linearity across the full voltage swing. Additionally, since the ADC reference typically tracks VDD, any ripple on the power rail will degrade conversion accuracy. In low-voltage designs, using an external precision bandgap reference may improve stability but adds component count and cost. Therefore, while the STM32G0B0KET6 offers flexibility in power management, analog subsystem design must account for supply variations to meet measurement precision requirements.
What considerations apply when interfacing the STM32G0B0KET6 with external memory or executing code from off-chip flash?
The STM32G0B0KET6 includes an external memory interface (FSMC) supporting parallel NOR/NAND flashes and PSRAM, though its primary execution domain remains internal FLASH due to faster access times. Executing code from external memory introduces latency—typically 50–100 ns compared to <10 ns for internal FLASH—which can disrupt real-time behavior unless compensated by cache or prefetch mechanisms not present in this device. Moreover, boot configuration pins (BOOT0/BOOT1) determine whether the MCU starts from internal FLASH or external memory. If external boot is required, careful attention must be paid to signal integrity, especially address/data bus routing near clock lines. Also, since the STM32G0B0KET6 lacks an MMU, virtual-to-physical mapping is fixed at compile time, limiting memory protection features available in more advanced MCUs. Thus, designers should reserve external memory primarily for data storage rather than executable code unless absolutely necessary.
How does thermal performance affect reliability when operating the STM32G0B0KET6 continuously at maximum junction temperature?
Operating the STM32G0B0KET6 at sustained ambient temperatures up to 85°C implies junction temperatures could exceed 125°C under poor thermal conditions, especially if mounted on a densely populated PCB without adequate airflow. Although ST specifies absolute maximum ratings well above typical operating limits, prolonged exposure near these extremes accelerates electromigration and reduces MTBF (mean time between failures). Thermal resistance from junction to ambient (ΘJA) for the 32-LQFP package is approximately 60–80°C/W, meaning even modest power dissipation (e.g., 50 mW) can raise die temperature significantly above ambient. Designers should verify worst-case power budgets using IBIS models or empirical measurements. Where possible, minimize dynamic current by optimizing clock frequencies and disabling unused blocks. Adequate copper pour and vias under the package further aid heat dissipation, ensuring long-term reliability within automotive or industrial environments.
In what scenarios would choosing the STM32G0B0KET6 over a lower-cost Cortex-M0 device provide tangible benefits?
The STM32G0B0KET6 justifies its price premium over simpler M0 devices in applications demanding higher integration, richer peripherals, and enhanced security. Unlike bare-bones M0 chips lacking hardware CRC or cryptographic modules, the STM32G0B0KET6 includes built-in CRC calculation units and optional AES-128 encryption, which are essential for secure firmware updates or protected sensor data transmission. Additionally, its support for multiple communication protocols (LIN, IrDA, SmartCard) enables direct interoperability with legacy automotive or industrial buses without requiring external transceivers. The inclusion of DMA channels also reduces CPU overhead in data-intensive tasks like ADC sampling or UART reception. While basic M0 parts suffice for simple LED blinking or GPIO monitoring, the STM32G0B0KET6 delivers scalable architecture for evolving product lines needing future-proof connectivity and moderate processing demands.
How should interrupt latency be managed when using the STM32G0B0KET6 in safety-critical applications?
The STM32G0B0KET6, based on the ARM Cortex-M0+, has a fixed interrupt response latency of 12 cycles plus pipeline effects, translating to roughly 187.5 ns at 64 MHz. This meets most non-automotive functional safety standards (e.g., IEC 60730 Class B), but deterministic timing must still be enforced through software practices. Developers should prioritize ISRs using NVIC grouping to minimize nesting delays, avoid floating-point operations inside interrupts unless FPU is enabled (not supported here), and keep interrupt service routines short—preferring deferred processing via tasklets or queues. Additionally, disabling global interrupts briefly during critical sections can preserve timing guarantees, albeit at the risk of missing lower-priority events. Since the STM32G0B0KET6 lacks dual-core redundancy or lockstep execution, single-point failure modes require mitigation through watchdog timers and error-correcting codes in flash if applicable.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics STM32G0B0KET6

Product Attribute STM32G0B0CET6 STM32G0B0RET6TR STM32G0B0CET6TR STM32G0B0RET6
Part Number STM32G0B0CET6 STM32G0B0RET6TR STM32G0B0CET6TR STM32G0B0RET6
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Core Processor - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Connectivity - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Speed - - - -
Number of I/O - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Program Memory Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
EEPROM Size - - - -
Peripherals - - - -
Oscillator Type - - - -
Series - - - -
Core Size - - - -
Program Memory Type - - - -
Data Converters - - - -
RAM Size - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

STM32G0B0KET6 Datasheet PDF

Download STM32G0B0KET6 pdf datasheets and STMicroelectronics documentation for STM32G0B0KET6 - STMicroelectronics.

PCN Assembly/Origin
Assembly Site 28/Feb/2023.pdf

Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
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This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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Certifications & Memberships

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STM32G0B0KET6 Image

STM32G0B0KET6

STMicroelectronics
98D-STM32G0B0KET6

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