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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersSTM32L471ZET6
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STM32L471ZET6 - STMicroelectronics

Manufacturer Part Number
STM32L471ZET6
Manufacturer
STMicroelectronics
Allelco Part Number
98D-STM32L471ZET6
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
34,350 pcs available, New & Original
Parts Description
IC MCU 32BIT 512KB FLASH 144LQFP
Package
144-LQFP (20x20)
Data sheet
STM32L471ZET6.pdf

PCN Packaging

2.73KHz.pdf

PCN Design/Specification

STM32L4/4+ DS Update 30/May/2018.pdf

PCN Assembly/Origin

2.73KHz.pdf

HTML Datasheet

STM32L471xx.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 34350
  • Unit Price: $7.626
  • Subtotal: $0.00

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1+ $7.626 $7.63
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

STM32L471ZET6 Tech Specifications
STMicroelectronics - STM32L471ZET6 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - STM32L471ZET6

Product Attribute Attribute Value
Manufacturer STMicroelectronics
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
Supplier Device Package 144-LQFP (20x20)
Speed 80MHz
Series STM32L4
RAM Size 128K x 8
Program Memory Type FLASH
Program Memory Size 512KB (512K x 8)
Peripherals Brown-out Detect/Reset, DMA, PWM, WDT
Package / Case 144-LQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 114
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 24x12b; D/A 2x12b
Core Size 32-Bit Single-Core
Core Processor ARM® Cortex®-M4
Connectivity CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, SWPMI, UART/USART
Base Product Number STM32L471

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

What are the key performance trade-offs when selecting the STM32L471ZET6 for a low-power battery-operated IoT sensor node?
The STM32L471ZET6 offers significant power savings through its multiple low-power modes, including Stop and Standby, which can reduce current consumption to under 1 µA in Stop mode. However, this comes with a trade-off in wake-up time—typically several microseconds from Stop mode—which may impact real-time responsiveness in duty-cycled applications. Its 512KB Flash and 128KB RAM support complex firmware but increase package size and cost compared to smaller alternatives like the STM32L431. The ARM Cortex-M4 core with FPU enables efficient signal processing but requires careful clock management to balance performance against power draw. For ultra-low-power designs, designers must weigh the value of integrated peripherals (e.g., DAC, ADC, and comparators) against the need for external components that might simplify thermal or noise budgets.
How does the STM32L471ZET6 compare to the STM32L431RE in terms of memory capacity and peripheral integration for motor control applications?
The STM32L471ZET6 provides 512KB Flash and 128KB RAM, offering substantial code space and data buffers for advanced motor control algorithms such as field-oriented control (FOC) or sensorless commutation. In contrast, the STM32L431RE has only 256KB Flash and 64KB RAM, which may restrict algorithm complexity or require frequent flash wear-leveling optimizations. Additionally, the L471 includes more robust connectivity options like CAN bus and QSPI, beneficial for industrial communication stacks, whereas the L431 lacks these. While both share the same core and frequency, the L471’s larger memory enables direct implementation of floating-point math without software emulation overhead, improving real-time performance in torque regulation loops.
Can the STM32L471ZET6 reliably operate in automotive environments requiring extended temperature ranges?
No, the STM32L471ZET6 is rated for industrial temperature range operation from -40°C to +85°C, which aligns with many commercial and industrial systems but falls short of AEC-Q100 Grade 1 qualification required for full automotive environments extending down to -40°C with high reliability over 15+ years. While it can function in harsh non-automotive settings such as outdoor gateways or factory automation, automotive-grade variants like the STM32G4 or STM32H7 series would be more appropriate where thermal cycling, EMI robustness, and functional safety certification are mandated.
What considerations apply when using the STM32L471ZET6 with an external crystal versus relying on its internal oscillator?
The STM32L471ZET6 includes a calibrated internal 16 MHz RC oscillator accurate to ±1% over temperature, suitable for most timing-critical tasks without crystals. However, using an external crystal improves long-term stability (<±50 ppm drift) and reduces phase noise in communications protocols like UART or I2C at high baud rates. External crystals add cost, board space, and susceptibility to mechanical stress during assembly or operation. Designers should consider whether the application demands precise timing for wireless modules (e.g., LoRaWAN) or synchronization in multi-device networks; otherwise, the internal oscillator suffices with periodic calibration routines to correct drift.
Is it possible to reprogram the STM32L471ZET6 via SWD while powered at 1.71 V?
Yes, the STM32L471ZET6 supports Serial Wire Debug (SWD) programming across the full supply voltage range of 1.71 V to 3.6 V. At 1.71 V, logic thresholds remain within spec, ensuring reliable communication with debug probes like ST-Link V3. However, lower voltages increase propagation delay slightly, so programmers may experience marginally longer timeout margins during flash erase/write cycles. It's advisable to maintain stable VDD during programming to avoid reset glitches. This flexibility simplifies prototyping on single-cell Li-ion-powered boards without requiring a boost regulator solely for programming.
How does the STM32L471ZET6 handle brown-out detection and what are the implications for system resilience?
The STM32L471ZET6 features configurable brown-out reset (BOR) levels settable in software to match the minimum operating voltage (1.71 V). During undervoltage conditions, BOR triggers a hardware reset, preventing erratic behavior caused by insufficient supply. However, if the system enters a low-power mode below the BOR threshold, it will not automatically recover unless manually reinitialized. Engineers must ensure that brown-out recovery sequences account for peripheral state loss and implement watchdog timers to detect hangs post-reset—critical in unattended deployments where fault isolation cannot rely on human intervention.
What are the limitations of the STM32L471ZET6’s DMA architecture when handling concurrent SPI and UART traffic?
The STM32L471ZET6 integrates seven DMA channels capable of offloading data transfers from peripherals like SPI, USART, and I2C. However, each channel can only serve one peripheral stream at a time, and shared resources such as the DMA request router may become bottlenecks during high-throughput scenarios involving simultaneous SPI master operations and UART logging. If both interfaces exceed 20 Mbps combined transfer rates, arbitration delays could introduce jitter or missed interrupts. Careful mapping of high-priority transfers to dedicated channels and disabling unused peripherals during bursts helps mitigate contention, but complex multi-protocol workloads may benefit from external FIFO buffers or protocol simplification.
Can the STM32L471ZET6 drive high-current loads directly, or does it require external drivers?
The STM32L471ZET6 GPIO pins can source/sink up to 25 mA per pin and 125 mA total across all I/Os, which is sufficient for driving LEDs, small relays, or enabling MOSFET gates. However, for loads exceeding these limits—such as solenoids, motors, or LCD backlights—external drivers like transistors or MOSFETs are mandatory. Attempting to exceed ratings risks permanent damage due to bond wire or pad degradation. Using push-pull outputs with level-shifting circuitry also ensures compatibility between 3.3 V MCU logic and higher-voltage actuator stages, maintaining design margin while preserving MCU integrity.
How does the STM32L471ZET6 support secure firmware updates in edge computing devices?
The STM32L471ZET6 includes optional cryptographic accelerators accessible via the ARM TrustZone framework and supports AES-128/256 encryption, SHA-2 hashing, and RNG for generating unique device keys. These enable signed firmware updates verified before flash programming, reducing risk of malicious payloads. However, unlike higher-end STM32 lines with tamper detection or secure boot ROM, the L471 lacks hardware memory protection units (MPUs) with region locking, meaning software must enforce update isolation manually. Secure key storage relies on OTP (one-time programmable) memory areas, limiting key rotation frequency—a consideration in environments where compromise likelihood justifies additional hardware security modules.
What is the typical current consumption of the STM32L471ZET6 running at 80 MHz with all peripherals disabled?
Under nominal conditions at 25°C and VDD = 3.3 V, the STM32L471ZET6 consumes approximately 2.5 mA when executing code from Flash at 80 MHz with all clocks enabled but peripherals disabled. This increases to around 1.8 mA if the internal flash wait states are optimized and dynamic voltage scaling (via SMPS) is used. In Run mode, actual consumption varies based on instruction mix and cache efficiency, but sustained execution at peak frequency typically draws between 2–3 mA. Designers aiming for sub-milliamp average currents must employ aggressive sleep scheduling and leverage the device’s low-power run mode (down to 1.8 µA at 32 kHz HSI).
Does the STM32L471ZET6 include built-in protection against ESD events common in industrial field installations?
Yes, the STM32L471ZET6 incorporates Electrostatic Discharge (ESD) protection diodes on all I/O pins compliant with JEDEC JESD22-A114 standards, typically rated at ±8 kV contact discharge. However, this applies only to transient events; repeated exposure or high-energy surges may still degrade pin integrity over time. For robust industrial installations, external TVS diodes and proper PCB layout with star grounding and decoupling capacitors are recommended. ESD immunity alone does not substitute for comprehensive surge protection schemes required in IEC 61000-4-5-compliant designs.
How does the STM32L471ZET6 compare to the STM32F407VGT6 in terms of power efficiency and core architecture?
The STM32L471ZET6 uses an ARM Cortex-M4F core with a digital signal processing (DSP) extension and optional floating-point unit (FPU), similar to the STM32F407VGT6, but optimized for lower leakage current. While both run at up to 80 MHz, the L4 series achieves significantly better energy-per-operation metrics—up to 65 DMIPS/mW compared to ~20 DMIPS/mW in the F4 line. The F407 consumes more static power due to older process geometry and lacks advanced low-power modes like Standby with RTC backup. Thus, the L471 excels in energy-constrained applications despite comparable computational throughput.
Can the STM32L471ZET6 interface with parallel displays using its EBI peripheral?
Yes, the STM32L471ZET6 supports External Bus Interface (EBI) allowing direct connection to parallel LCD controllers or memory-mapped displays without requiring additional bridges. Up to 24-bit address/data bus width is supported, enabling 64 Mbytes of external SRAM or ROM access. However, implementing EBI demands precise timing configuration and careful PCB routing due to strict setup/hold requirements. Shared signals with other peripherals (e.g., FSMC) must be multiplexed carefully, and clock domain crossings require synchronization logic. While powerful, EBI adds firmware complexity compared to simpler SPI-driven TFT libraries common in embedded GUI frameworks.
What precautions should be taken when migrating firmware from a smaller STM32L4 variant to the STM32L471ZET6?
When upgrading to the STM32L471ZET6 from a smaller member like the L431, developers must verify stack usage against the increased RAM (128 KB vs. 64 KB), though code size expansion may still fit within 512 KB Flash. Interrupt vector table offsets and peripheral register maps remain consistent, simplifying porting, but attention is needed to linker scripts accommodating larger heaps. Additionally, unused peripherals enabled in legacy code may consume unnecessary power, so disabling them explicitly improves efficiency. Lastly, test timing-sensitive sections under worst-case conditions since higher clock accuracy in the L471 doesn’t guarantee identical latency profiles without recalibration.
Is the STM32L471ZET6 suitable for real-time control loops requiring deterministic interrupt response?
Yes, the STM32L471ZET6 supports nested vectored interrupt controller (NVIC) with tail-chaining and late arrival optimizations, enabling sub-microsecond interrupt latency under optimal conditions. With all pending interrupts cleared and no flash stalls, worst-case latency remains below 12 cycles (~150 ns at 80 MHz). However, deep nesting or long ISRs can mask critical events. To ensure determinism, prioritize ISR length, disable global interrupts only briefly, and use DMA for bulk data transfers. Real-time kernels like FreeRTOS can schedule tasks predictably, provided interrupt priorities are assigned conservatively and shared resources protected via mutexes or atomic operations.
How does the STM32L471ZET6 support dual-bank flash execution for live firmware updates?
The STM32L471ZET6 features dual-bank flash architecture (Bank 1 and Bank 2), allowing one bank to execute code while updating the other. This enables in-application programming (IAP) without halting execution. The System Memory Bootloader or custom routines can copy new firmware into the inactive bank, then perform a soft reset with bootloader remapping. However, flash erase/write cycles are limited (~10k endurance per sector), necessitating wear leveling for frequent updates. Bank switching requires careful linker configuration and vector table relocation, and atomicity must be ensured during transition to avoid partial execution states.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics STM32L471ZET6

Product Attribute STM32L471ZET6TR STM32L471ZEJ3TR STM32L471VET6 STM32L471VET6TR
Part Number STM32L471ZET6TR STM32L471ZEJ3TR STM32L471VET6 STM32L471VET6TR
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Speed - - - -
Program Memory Size - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
RAM Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Oscillator Type - - - -
Number of I/O - - - -
Connectivity - - - -
Peripherals - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Series - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Data Converters - - - -
Program Memory Type - - - -
Core Size - - - -
EEPROM Size - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Core Processor - - - -

STM32L471ZET6 Datasheet PDF

Download STM32L471ZET6 pdf datasheets and STMicroelectronics documentation for STM32L471ZET6 - STMicroelectronics.

PCN Packaging
2.73KHz.pdf
PCN Design/Specification
STM32L4/4+ DS Update 30/May/2018.pdf
PCN Assembly/Origin
2.73KHz.pdf
HTML Datasheet
STM32L471xx.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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STM32L471ZET6 Image

STM32L471ZET6

STMicroelectronics
98D-STM32L471ZET6

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