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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersSTM32L471ZGJ6
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STM32L471ZGJ6 - STMicroelectronics

Manufacturer Part Number
STM32L471ZGJ6
Manufacturer
STMicroelectronics
Allelco Part Number
98D-STM32L471ZGJ6
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
33,927 pcs available, New & Original
Parts Description
IC MCU 32BIT 1MB FLASH 144UFBGA
Package
144-UFBGA (10x10)
Data sheet
STM32L471ZGJ6.pdf

Datasheets

STM32L471xx.pdf
RoHs Status
ROHS3 Compliant
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In stock: 33927
  • Unit Price: $10.915
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Specifications

STM32L471ZGJ6 Tech Specifications
STMicroelectronics - STM32L471ZGJ6 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - STM32L471ZGJ6

Product Attribute Attribute Value
Manufacturer STMicroelectronics
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
Supplier Device Package 144-UFBGA (10x10)
Speed 80MHz
Series STM32L4
RAM Size 128K x 8
Program Memory Type FLASH
Program Memory Size 1MB (1M x 8)
Peripherals Brown-out Detect/Reset, DMA, PWM, WDT
Package / Case 144-UFBGA
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 114
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 24x12b; D/A 2x12b
Core Size 32-Bit Single-Core
Core Processor ARM® Cortex®-M4
Connectivity CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, SWPMI, UART/USART
Base Product Number STM32L471

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
HTSUS 0000.00.0000

Frequently Asked Questions(FAQ)

How does the STM32L471ZGJ6 compare to other STM32L4 series microcontrollers in terms of power efficiency and performance balance for battery-powered IoT applications?
The STM32L471ZGJ6 offers a refined trade-off between performance and low-power operation typical of the STM32L4 family. With an 80MHz ARM Cortex-M4 core and 1MB Flash, it delivers sufficient processing headroom for real-time signal handling in edge devices while maintaining deep-sleep current levels around 2 µA when using internal regulators. Compared to higher-density variants like the STM32L476, which features more peripherals and higher RAM, the L471ZGJ6 provides optimized memory allocation (128KB RAM) that reduces static leakage without compromising typical workload throughput. This balance makes it suitable for applications where energy budget constraints are critical but moderate computational load must still be supported.
What design considerations should be made when selecting decoupling capacitors for the STM32L471ZGJ6 operating at its full voltage range of 1.71V to 3.6V?
Given the wide supply range and high-speed I/O switching (including multiple high-speed serial interfaces), stable power delivery is essential. A minimum of two ceramic capacitors—one 100 nF X7R or X5R type for high-frequency noise suppression and one 10 µF MLCC with low ESR—should be placed as close as possible to the VDD/VSS pins. At 1.71V, the risk of transient voltage droop increases due to lower margin, so capacitor selection must ensure adequate hold-up during fast load changes. Avoid Y5V dielectrics near the lower end of the voltage range due to capacitance drop under bias.
Can the STM32L471ZGJ6 reliably operate in industrial temperature environments (-40°C to +85°C) when using internal oscillators, and what calibration strategy ensures timing accuracy?
Yes, the device is qualified over this full commercial-industrial range. However, the internal RC oscillator’s frequency drift can exceed ±2% across temperature and process variations. For time-critical tasks such as UART baud rate generation or PWM synchronization, users should rely on external crystal oscillators or enable the internal HSI16 with periodic trimming via the RTC or DFSDM peripherals. Alternatively, the internal MSI clock source allows multiple calibrated speeds, enabling software-based compensation through factory-trimmed coefficients stored in the option bytes.
What is the impact of Flash memory programming cycles on system longevity when frequently updating firmware on the STM32L471ZGJ6?
The STM32L471ZGJ6 supports up to 20,000 write/erase cycles per sector, distributed across 128 sectors of 2 KB each. Frequent updates targeting small code segments help extend lifespan, but writing to the same location repeatedly accelerates wear. Best practice involves reserving dedicated flash areas for configuration data and implementing wear-leveling logic in user space. Additionally, reducing update frequency by batching writes or using RAM buffers before committing to flash significantly improves long-term reliability compared to single-byte or interrupt-driven flash operations.
How do the 114 GPIOs of the STM32L471ZGJ6 distribute across available packages, and what limitations apply when using all I/O simultaneously with high-speed peripherals?
In the 144-UFBGA (10x10) package, GPIOs are mapped to specific ballout positions aligned with alternate function capabilities. While 114 pins are available, simultaneous use with high-bandwidth interfaces like QSPI, SAI, or MMC/SD imposes constraints due to pin multiplexing. For instance, certain balls serve dual roles for SPI and I2C; activating both may require careful configuration. Moreover, driving large capacitive loads or using push-pull outputs at full swing consumes more power, which affects thermal performance in compact designs. Layout planning must account for shared signal paths and avoid crosstalk between analog inputs (e.g., ADC channels) and digital aggressors.
Is the STM32L471ZGJ6 suitable for CAN bus communication at 1 Mbps in automotive-grade lighting control systems, and what additional hardware components are required?
The STM32L471ZGJ6 includes a full-featured FlexCAN interface compliant with ISO 11898-2, supporting data rates up to 1 Mbps over standard twisted-pair cabling. However, it lacks built-in transceivers, so an external CAN transceiver such as the TJA1050 or MCP2551 is mandatory. Signal integrity depends on PCB trace impedance matching and termination resistors (~120Ω). Without proper layout and EMI shielding, electromagnetic interference could corrupt frames, especially in noisy environments. Therefore, although the MCU itself is capable, system-level compliance testing is necessary before deployment.
What are the key differences between using DMA versus polling for transferring data from the ADC to RAM on the STM32L471ZGJ6 in a multitasking RTOS environment?
When sampling the 24-channel, 12-bit ADC at maximum resolution, DMA offloads CPU cycles by automatically moving samples to memory without intervention. Polling wastes CPU time checking conversion completion flags every few microseconds, limiting responsiveness in concurrent tasks. On the STM32L471ZGJ6, enabling ADC-to-RAM transfers via DMA reduces interrupt overhead and enables higher effective sample rates. However, misconfigured DMA channels may cause buffer overruns if the destination FIFO fills faster than the application consumes data. Thus, proper task scheduling and double-buffering strategies are essential regardless of transfer method.
Why might designers choose the STM32L471ZGJ6 over ARM Cortex-M0+ alternatives despite its higher cost, and how does its memory architecture support complex firmware stacks?
Although Cortex-M0+ MCUs offer lower unit pricing, the STM32L471ZGJ6’s Cortex-M4 with FPU and DSP instructions enables efficient execution of floating-point math and signal processing algorithms common in sensor fusion or motor control. Its 1MB Flash and 128KB RAM provide ample space for non-trivial RTOS kernels, middleware, and application logic without external memory. The tightly integrated peripheral matrix avoids latency penalties seen in systems relying on external SRAM or Flash. This integration lowers BOM count, simplifies PCB routing, and improves real-time determinism—critical advantages in embedded control loops.
How should bootloader security features be configured on the STM32L471ZGJ6 to prevent unauthorized firmware access while allowing field updates?
The STM32L471ZGJ6 supports read-out protection (RDP) levels and active readout protection (PCROP) via option bytes. Setting Level 1 RDP prevents mass erase unless debug ports are unlocked, while PCROP restricts code execution to designated flash regions, protecting intellectual property. To allow secure over-the-air (OTA) updates, implement a dual-bank flash scheme or reserve a protected area for bootloader code. Firmware signing using AES-256 or RSA keys stored in the cryptographic processor further ensures authenticity. Unauthorized attempts to extract keys will trigger tamper detection and erase sensitive data.
What precautions are necessary when soldering the 144-UFBGA package of the STM32L471ZGJ6 to avoid solder bridging and ensure reliable connections?
Due to the dense 10x10 mm pitch and fine ball diameter (<0.4 mm), stencil aperture design must minimize paste volume to prevent bridging. Using laser-cut stencils with trapezoidal apertures helps control deposition. Reflow profiling should maintain peak temperatures below 245°C for less than 30 seconds to avoid damaging internal bond wires. Post-assembly inspection via automated optical inspection (AOI) or x-ray is recommended, especially for hidden joints beneath the component. Additionally, conformal coating after assembly can protect against moisture ingress, which is particularly relevant given the device’s MSL 3 rating and long storage sensitivity window (168 hours).
How does the internal voltage regulator mode affect power consumption in low-voltage operation modes on the STM32L471ZGJ6?
The STM32L471ZGJ6 operates in three regulator modes: Main (MR), Low-Power (LR), and Ultra-Low-Power (ULP). In MR mode, the internal regulator runs at full swing, consuming ~5 mA at 80 MHz. Switching to LR mode cuts dynamic current by about 50% but limits CPU frequency to 40 MHz. ULP mode uses a sub-threshold regulator, drawing as little as 100 µA total system current at 1.8 V. However, wake-up times increase from tens of microseconds to hundreds, impacting responsiveness. Designers must weigh these trade-offs based on duty cycle requirements in sleep-dominated applications.
Can the STM32L471ZGJ6 drive multiple high-current LEDs simultaneously without external drivers, and what thermal implications arise?
Each GPIO on the STM32L471ZGJ6 can sink/source up to 25 mA continuously, but the total package current is limited by thermal dissipation. Driving more than 10–15 LEDs at 10 mA each risks exceeding the junction temperature derating curve under ambient conditions above 60°C. Even with proper heatsinking, localized hot spots may form due to UFBGA’s limited exposed pad area. External MOSFETs or constant-current LED drivers are preferable for arrays requiring >50 mA aggregate current. This approach isolates thermal stress from the MCU and improves brightness consistency across varying supply voltages.
What role does the Watchdog Timer (WDT) play in ensuring system stability when using the STM32L471ZGJ6 in unattended monitoring applications?
The independent watchdog (IWDG) and windowed watchdog (WWDG) provide hardware-based recovery mechanisms. The IWDG resets the MCU if software fails to periodically refresh its counter, preventing hangs caused by infinite loops or stack overflows. On the STM32L471ZGJ6, the IWDG uses an internal low-power RC oscillator, making it functional even in STOP modes. WWDG adds timing precision for time-sensitive operations but requires tighter software discipline. Proper initialization and periodic servicing during normal operation minimize false resets, ensuring continuous operation in remote deployments like environmental sensors or asset trackers.
How should developers manage clock domains when integrating the STM32L471ZGJ6 with external memory or high-speed peripherals?
The STM32L471ZGJ6 supports multiple clock sources—HSI16, HSE, MSI, and PLL—that feed different buses (SYSCLK, AHB, APB). When connecting external SDRAM or parallel Flash, ensure SYSCLK aligns with memory timings specified by the vendor. For example, accessing an SDRAM running at 50 MHz requires SYSCLK ≥ 100 MHz to meet setup/hold constraints. Clock tree configuration tools like CubeMX help map frequencies correctly, avoiding metastability issues during cross-domain transfers. Additionally, synchronizing DMA transfers with peripheral clocks minimizes jitter in sampled data streams.
What are the implications of using the STM32L471ZGJ6’s internal DAC in battery-operated audio recording systems?
The STM32L471ZGJ6 integrates two 12-bit DACs capable of generating analog signals directly without external components. However, their output impedance is relatively high (~1 kΩ), necessitating a buffer amplifier for driving low-impedance loads. More critically, internal DACs consume significant current during conversion—up to 3 mA—which conflicts with ultra-low-power goals. In audio recording scenarios, where input is typically handled by the ADC, using the DAC would be inefficient. Instead, consider using the DAC only for simple reference voltages or test tones, reserving external op-amps for active signal conditioning.
How does the presence of SWPMI on the STM32L471ZGJ6 benefit communication with low-cost sensors in space-constrained layouts?
SWPMI (Single-Wire Protocol Master Interface) enables half-duplex communication over a single data line, reducing pin count compared to full I2C or SPI. On the STM32L471ZGJ6, this is ideal for connecting temperature sensors, pressure transducers, or EEPROMs where distance is short and routing density is high. SWPMI supports clock stretching and multi-master arbitration, offering flexibility similar to I2C but with simpler wiring. However, it operates at lower speeds (~100 kbps max), so it’s unsuitable for streaming video or high-throughput data acquisition. Careful timing management is required to avoid collisions in multi-device topologies.
What steps are needed to validate EMC performance when deploying the STM32L471ZGJ6 in proximity to RF transmitters?
Since the STM32L471ZGJ6 lacks integrated RF shielding, radiated emissions and susceptibility become design-critical. Implement proper ground planes, minimize loop areas in power traces, and use ferrite beads on supply lines near noisy components. Place bulk capacitors close to the IC to suppress conducted emissions. Conduct pre-compliance testing using spectrum analyzers and near-field probes to identify coupling paths. If operating near ISM bands (e.g., 2.4 GHz Wi-Fi), add filtering to I/O lines and consider enclosing the board in a conductive enclosure grounded to the chassis. Failure to address these issues may result in regulatory non-compliance despite correct MCU functionality.
How does the STM32L471ZGJ6’s program memory organization support incremental firmware development and debugging workflows?
The 1MB Flash is divided into 2-KB sectors, allowing selective erasure during programming without affecting adjacent code. This granularity supports over-the-air (OTA) updates where only modified functions need rewriting, saving time and preserving calibration data. Combined with the built-in CRC calculator and RDP features, developers can verify firmware integrity before activation. Debugging benefits from the SWD interface supporting real-time variable monitoring and breakpoints without halting entire system clocks. These characteristics streamline CI/CD pipelines and reduce downtime in production environments where field reprogramming is expected.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics STM32L471ZGJ6

Product Attribute STM32L471ZEJ6 STM32L471ZEJ6TR STM32L471ZGT6 STM32L471ZET6TR
Part Number STM32L471ZEJ6 STM32L471ZEJ6TR STM32L471ZGT6 STM32L471ZET6TR
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of I/O - - - -
EEPROM Size - - - -
RAM Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Speed - - - -
Data Converters - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Program Memory Size - - - -
Series - - - -
Connectivity - - - -
Program Memory Type - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Core Size - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Peripherals - - - -
Oscillator Type - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Core Processor - - - -

STM32L471ZGJ6 Datasheet PDF

Download STM32L471ZGJ6 pdf datasheets and STMicroelectronics documentation for STM32L471ZGJ6 - STMicroelectronics.

Datasheets
STM32L471xx.pdf
PCN Packaging
Material Barrier Bag 17/Dec/2020.pdf
PCN Assembly/Origin
Enhanced Traceability 31/May/2021.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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STM32L471ZGJ6 Image

STM32L471ZGJ6

STMicroelectronics
98D-STM32L471ZGJ6

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