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HomeProductsIntegrated Circuits (ICs)Specialized ICsXCF16PFSG48
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XCF16PFSG48 - AMD Xilinx

Manufacturer Part Number
XCF16PFSG48
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCF16PFSG48
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
4,110 pcs available, New & Original
Parts Description
DAC91001
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
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In stock: 4110

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Specifications

XCF16PFSG48 Tech Specifications
AMD Xilinx - XCF16PFSG48 technical specifications, attributes, parameters and parts with similar specifications to AMD Xilinx - XCF16PFSG48

Product Attribute Attribute Value
Part Number XCF16PFSG48
Package DAC91001
Description DAC91001
Stock Condition Get 4110 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer AMD Xilinx
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

How does the XCF16PFSG48 support high-speed configuration in FPGA-based systems, and what are the implications for system startup time?
The XCF16PFSG48 is a serial PROM designed to store configuration data for Xilinx FPGAs, enabling fast and reliable boot-up sequences. With a typical configuration time of under 100 ms at 100 MHz SPI clock rates, it reduces system initialization latency compared to parallel NOR flash alternatives. This makes it particularly suitable for time-sensitive embedded applications where minimizing power-on-to-active duration is critical.
What is the maximum operating voltage range for the XCF16PFSG48, and how does this affect compatibility with industrial-grade power supplies?
The XCF16PFSG48 operates within a supply voltage range of 2.7 V to 3.6 V, making it compatible with standard 3.3 V digital systems commonly used in industrial and automotive environments. This tolerance accommodates minor voltage drops or fluctuations in unregulated power rails, enhancing robustness without requiring additional voltage regulation circuitry.
Can the XCF16PFSG48 be used in radiation-hardened or harsh-environment applications, and what limitations should be considered?
While the XCF16PFSG48 offers industrial temperature operation (up to +85°C), it is not inherently radiation-tolerant or qualified for space-grade use. Its reliability in high-radiation environments is limited by standard CMOS processes. For aerospace or defense applications requiring single-event upset (SEU) immunity, hardened alternatives such as antifuse-based FPGAs with specialized configuration memory are recommended.
How does the XCF16PFSG48 compare to the XCF32PFSG48 in terms of capacity and application suitability?
The XCF16PFSG48 provides 16 Mbit of storage, whereas the XCF32PFSG48 doubles this to 32 Mbit. This difference allows the larger part to support higher-density FPGA configurations or multiple firmware images. When selecting between them, designers must evaluate whether the additional capacity justifies board space, cost, and potential pin compatibility issues, especially if routing constraints favor smaller footprints.
What security features does the XCF16PFSG48 offer against unauthorized configuration access or reverse engineering?
The XCF16PFSG48 supports basic protection mechanisms including password protection and block locking via Xilinx’s Secure Configuration architecture. However, it lacks hardware-based cryptographic authentication like AES-256 encryption. Thus, while it prevents accidental overwrites, sensitive intellectual property remains vulnerable to extraction via JTAG or side-channel analysis unless paired with secure boot protocols implemented at the FPGA level.
Is the XCF16PFSG48 compatible with partial reconfiguration workflows, and what are the performance considerations?
Yes, the XCF16PFSG48 can support partial reconfiguration (PR) of Xilinx FPGAs, provided the host device implements PR-aware logic and timing control. However, PR operations require precise synchronization with the FPGA’s internal state machine, and frequent rewrites may degrade endurance beyond 10,000 cycles per block. Designers should avoid using PR-intensive modes unless absolutely necessary to preserve longevity.
What is the expected write endurance of the XCF16PFSG48, and how does usage pattern impact its operational lifespan?
The XCF16PFSG48 typically exhibits an endurance rating of 10,000 erase/write cycles per sector. In most design scenarios, configuration updates occur infrequently—often only during manufacturing or field upgrades—so wear is negligible. Nevertheless, repeated firmware updates in maintenance-heavy systems could approach this limit over several years, necessitating cycle monitoring or fail-safe update procedures.
How does the TFBGA packaging of the XCF16PFSG48 influence PCB layout complexity and signal integrity requirements?
The TFBGA (Thin Fine-Pitch Ball Grid Array) package with 48 balls presents challenges due to small pitch (0.8 mm) and limited thermal dissipation. Proper PCB design requires controlled impedance routing for the SPI lines, adequate decoupling near VCC/GND pads, and careful thermal management to prevent solder joint fatigue. Automated optical inspection (AOI) is often needed during assembly to detect misalignment or voids.
Can the XCF16PFSG48 operate reliably in cold-temperature environments below −40°C, and what precautions are advised?
No, the XCF16PFSG48 is rated for industrial temperatures from −40°C to +85°C, but full functionality below −40°C cannot be guaranteed. At sub-zero conditions, capacitance changes in traces and increased resistance in interconnects may affect signal rise times. For cryogenic applications, alternative non-volatile memories with wider thermal specs should be evaluated.
Does the XCF16PFSG48 support dual-bank configuration switching, and how does this benefit system redundancy?
The XCF16PFSG48 supports dual-bank architecture, allowing one bank to remain active while the other stores an alternate configuration image. This enables seamless failover during corrupted image loads or planned maintenance. Combined with FPGA-side bank switching logic, it enhances system availability in mission-critical infrastructure such as telecommunications or industrial controllers.
What are the key differences between the XCF16PFSG48 and newer SPI Flash alternatives like Micron’s N25Q128A in terms of latency and power consumption?
The XCF16PFSG48 is optimized for direct Xilinx FPGA interface compatibility with minimal protocol overhead, resulting in lower configuration latency than generic SPI flashes requiring translation layers. However, newer devices like the N25Q128A offer faster read speeds (up to 104 MHz) and lower standby current (typically 1 µA vs. 5 µA). Designers must balance integration simplicity against absolute performance when selecting between vendor-specific and universal solutions.
Is the XCF16PFSG48 suitable for battery-powered edge devices, and what factors dominate its power profile?
Yes, the XCF16PFSG48 is appropriate for low-power edge applications due to its low quiescent current (typically <1 µA in standby). However, power draw spikes during configuration bursts can reach tens of milliamps for brief durations. To minimize overall energy consumption, designers should defer configuration until necessary and ensure clean power delivery to avoid brownout-induced retries.
How does the XCF16PFSG48 handle power sequencing requirements during FPGA initialization?
The XCF16PFSG48 expects stable VCC before asserting the PROGRAM# pin, typically within 100 ms of power-up. If power ramps too slowly or with excessive ripple, the device may enter undefined states, causing failed configurations. Designers should implement soft-start circuits and monitor rail stability to meet Xilinx’s recommended power-on reset (POR) timing diagrams.
What role does the XCF16PFSG48 play in protecting FPGA bitstreams from corruption during field updates?
By storing configuration data in non-volatile memory, the XCF16PFSG48 preserves the latest valid bitstream across power cycles. Coupled with CRC checks and rollback mechanisms in the FPGA fabric, it helps maintain system integrity during firmware updates. However, without end-to-end error correction, transient noise on the SPI bus during programming could still corrupt data—requiring external safeguards like checksum validation.
Can multiple XCF16PFSG48 devices be daisy-chained for multi-FPGA configurations, and what limitations apply?
Yes, multiple XCF16PFSG48 chips can share the same SPI bus through individual CS# (chip select) lines, enabling scalable multi-device setups. However, cumulative propagation delays and shared clock skew may degrade timing margins at high frequencies. Additionally, firmware must manage CS# transitions precisely to avoid contention or partial writes across devices.
How does the XCF16PFSG48 perform under electromagnetic interference (EMI) conditions common in motor-driven industrial equipment?
The XCF16PFSG48 demonstrates moderate EMI resilience due to built-in noise filtering on input pins, but aggressive transients from brushed motors or variable frequency drives can still induce glitches. Robust designs incorporate ferrite beads on SPI lines, proper grounding planes, and shielding around the memory component to maintain configuration integrity in electrically noisy environments.
What documentation or reference designs accompany the XCF16PFSG48, and how do they aid implementation?
Xilinx provides detailed application notes such as XAPP1035, which outlines best practices for PCB layout, timing budgets, and verification test points. These resources help engineers avoid common pitfalls like signal ringing or power bounce during programming. Leveraging these guides significantly reduces debug time and increases first-pass success in production deployments.
Should the XCF16PFSG48 be preferred over onboard BPI flash for mid-range FPGA platforms, and why?
The XCF16PFSG48 offers advantages over BPI flash in smaller form factor, simpler interface, and tighter integration with Xilinx toolchains. While BPI flash supports larger configurations, the XCF16PFSG48 is ideal for platforms where size, cost, and boot speed outweigh raw capacity needs. It strikes a practical balance for many embedded control and communication applications without requiring external memory controllers.

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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Brazil 7
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0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
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AMD Xilinx

XCF16PFSG48

AMD Xilinx
32D-XCF16PFSG48

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