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HomeProductsIntegrated Circuits (ICs)Specialized ICsXCF16PFG48BRT
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XCF16PFG48BRT - AMD Xilinx

Manufacturer Part Number
XCF16PFG48BRT
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCF16PFG48BRT
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
10,140 pcs available, New & Original
Parts Description
DAC91001
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
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Our certification
In stock: 10140

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Specifications

XCF16PFG48BRT Tech Specifications
AMD Xilinx - XCF16PFG48BRT technical specifications, attributes, parameters and parts with similar specifications to AMD Xilinx - XCF16PFG48BRT

Product Attribute Attribute Value
Part Number XCF16PFG48BRT
Package DAC91001
Description DAC91001
Stock Condition Get 10140 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer AMD Xilinx
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

How does the XCF16PFG48BRT support configuration flexibility in FPGA-based systems, and what role does its non-volatile memory play during system initialization?
The XCF16PFG48BRT incorporates a 16 Mbit serial configuration flash memory that enables reprogrammable storage of FPGA bitstreams directly on the PCB. This non-volatile capability allows the device to retain configuration data even when power is removed, ensuring reliable startup sequences without external boot controllers. During system initialization, the XCF16PFG48BRT automatically loads the pre-programmed FPGA configuration from its internal memory into the host Spartan-3 FPGA, reducing boot time and minimizing dependency on external configuration sources.
What are the key electrical characteristics of the XCF16PFG48BRT that influence its integration into low-power embedded designs?
The XCF16PFG48BRT operates at a core voltage of 1.8 V and supports I/O voltages ranging from 2.5 V to 3.3 V, making it compatible with mainstream digital logic families. Its static current consumption is typically below 10 µA in standby mode, which contributes to efficient power management in battery-powered or thermally constrained applications. These voltage tolerances allow direct interfacing with common microcontrollers and peripherals while maintaining signal integrity across mixed-voltage environments.
In high-reliability industrial systems, how does the BGA package of the XCF16PFG48BRT impact long-term solder joint reliability under thermal cycling?
The XCF16PFG48BRT uses a 48-ball fine-pitch BGA package (Fg48), which provides compact footprint and high pin density but introduces mechanical stress sensitivity during thermal expansion mismatches. Under repeated thermal cycling—common in industrial environments—the coefficient of thermal expansion (CTE) difference between silicon die and PCB laminate can lead to fatigue cracking at ball joints. Designers must implement proper via stitching, controlled via-in-pad routing, and sufficient thermal relief to mitigate this risk.
How does the XCF16PFG48BRT compare to other Xilinx configuration solutions like the XC18V04 or XC17 series in terms of capacity and application suitability?
The XCF16PFG48BRT offers 16 Mbits of storage, which is sufficient for most Spartan-3 family FPGAs, whereas the XC18V04 provides only 512 Kbits and is better suited for smaller CPLDs. Compared to the XC17 series, the XCF16PFG48BRT lacks built-in security features such as readback protection and one-time programmable fuses, making it less ideal for secure applications but more cost-effective for general-purpose configuration tasks. For larger Spartan-3 devices exceeding 16 Mbit requirements, alternative solutions like the XCF32P may be required.
What programming interface options are supported by the XCF16PFG48BRT, and how do they affect system design complexity?
The XCF16PFG48BRT supports standard JTAG (IEEE 1149.1) for in-circuit programming and serial SPI-like communication via its dedicated DIN/PROG/CCLK pins. While JTAG simplifies debugging and mass programming, it requires additional test points and TAP controller overhead. The parallel programming mode using DIN and CCLK offers faster configuration times (~5–10 ms) but demands precise timing control and pull-up resistors on control lines. Designers must balance speed, trace routing complexity, and debug accessibility when selecting an interface strategy.
Can the XCF16PFG48BRT operate reliably in automotive-grade temperature ranges, and what environmental constraints should be considered?
The XCF16PFG48BRT is specified for commercial-grade operation (-40°C to +85°C junction temperature), not full automotive AEC-Q100 qualification. While it may function in mild industrial settings within this range, exposure to extended thermal cycles, humidity, or vibration without conformal coating or robust mechanical anchoring could compromise solder integrity over time. For harsh environments, additional shielding, thermal management, and reliability testing are strongly recommended.
How does the pin count and ball pitch of the XCF16PFG48BRT influence PCB layout decisions compared to larger BGA alternatives?
With 48 balls and a fine-pitch ball grid array (typically 0.8 mm or 1.0 mm pitch), the XCF16PFG48BRT occupies minimal board area while still supporting all essential configuration signals. However, its small size limits routing flexibility for high-speed signals and increases difficulty in achieving impedance-controlled traces without advanced layer stackups. In contrast, larger packages like Fg676 offer more routing channels but consume significantly more space—making the XCF16PFG48BRT optimal for space-constrained designs where configuration memory is integrated locally.
What precautions should be taken during firmware updates involving the XCF16PFG48BRT to avoid bricking the FPGA?
Firmware updates require careful handling of the PROG pin to prevent accidental erasure. Asserting PROG low during power-up forces reconfiguration, so the pin must remain stable until the new bitstream is fully loaded. Additionally, power sequencing must ensure that the XCF16PFG48BRT’s supply ramps up before the host FPGA powers on to avoid contention on shared I/O lines. Using a pull-up resistor on PROG and implementing watchdog timers in the update routine further reduce the risk of incomplete programming.
How does the XCF16PFG48BRT handle configuration error detection, and what mechanisms exist for recovery?
The XCF16PFG48BRT does not include built-in CRC verification or error correction; instead, it relies on the host Spartan-3 FPGA to validate the loaded configuration using internal CRC checks. If corruption occurs, the FPGA enters an unconfigured state, triggering a reinitialization sequence. To enable recovery, designers often implement a secondary configuration source or use dual-bank flash architectures—though the XCF16PFG48BRT itself lacks dual-bank support, requiring external circuitry for redundancy.
Is it feasible to cascade multiple XCF16PFG48BRT devices for higher-density configuration storage, and what challenges arise?
Cascading XCF16PFG48BRT parts is technically possible by sharing CCLK and DIN lines with chip-select (CS) signaling, but this increases configuration time linearly and complicates timing synchronization. Moreover, each device adds propagation delay and potential signal integrity issues due to stub effects on high-frequency clock lines. Given that 16 Mbits typically suffices for Spartan-3 devices, cascading is rarely justified unless targeting future scalability or redundancy—and even then, alternative high-capacity flash components are preferable.
What role does the XCF16PFG48BRT play in reducing bill-of-materials (BOM) complexity in FPGA reference designs?
By integrating configuration storage internally, the XCF16PFG48BRT eliminates the need for separate external EEPROM or flash chips solely for FPGA configuration. This reduces component count, simplifies board layout, and lowers overall system cost. It also decreases susceptibility to interface protocol mismatches and improves manufacturability since fewer external components require tuning and validation. However, this benefit applies only when the target FPGA fits within the 16 Mbit addressable space.
How does the manufacturing origin and RoHS compliance of the XCF16PFG48BRT affect supply chain planning for consumer electronics projects?
The XCF16PFG48BRT is manufactured by Xilinx and complies with RoHS directives, meaning it contains no lead, mercury, or other restricted substances above regulatory thresholds. This ensures compatibility with global environmental regulations and simplifies sourcing in regions like the EU and North America. However, lead-free soldering processes demand higher reflow temperatures (~240°C vs. ~210°C for tin-lead), which can exacerbate thermomechanical stress on BGA joints—especially critical given the XCF16PFG48BRT’s small form factor.
Can the XCF16PFG48BRT be used in radiation-hardened or aerospace applications without modification?
No, the XCF16PFG48BRT is not designed for radiation-hardened environments. Standard CMOS flash memory is vulnerable to single-event upsets (SEUs) caused by cosmic rays or solar particles, which can corrupt stored configuration data. Aerospace or satellite systems requiring SEU immunity must use specialized rad-hard memory components or implement error-correction codes (ECC) with external monitoring—neither of which are native features of the XCF16PFG48BRT.
What are the typical configuration file size limitations imposed by the XCF16PFG48BRT, and how do they constrain FPGA selection?
The XCF16PFG48BRT stores exactly 2 MBytes (16 Mbits) of data, which aligns closely with the maximum configuration size of mid-range Spartan-3 FPGAs such as the Spartan-3E 250. Devices requiring more than 2 MB (e.g., certain Spartan-3AN models) cannot be configured using this part. Engineers must verify that their selected FPGA’s .bit file size, including padding and header information, does not exceed available capacity to avoid truncation or failed programming.
How does the absence of write protection features in the XCF16PFG48BRT impact security-sensitive applications?
Unlike some modern configuration PROMs with hardware write-protect pins or password-based locking, the XCF16PFG48BRT lacks active security mechanisms. Once programmed, the contents can theoretically be read back through JTAG if the host FPGA permits it, exposing intellectual property. While physical obfuscation or external encryption can mitigate this, the lack of native protection makes the XCF16PFG48BRT unsuitable for applications requiring tamper resistance or anti-cloning measures without additional layers of defense.

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Electrostatic Discharge Protection and Handling

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AMD Xilinx

XCF16PFG48BRT

AMD Xilinx
32D-XCF16PFG48BRT

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