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HomeProductsIntegrated Circuits (ICs)Memory - Configuration Proms for FPGAsXCF128XFT64C
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XCF128XFT64C - AMD

Manufacturer Part Number
XCF128XFT64C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCF128XFT64C
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
9,760 pcs available, New & Original
Parts Description
IC PROM SRL 128M GATE 64-FTBGA
Package
64-FTBGA (10x13)
Data sheet
XCF128XFT64C.pdf
RoHs Status
 
Our certification
In stock: 9760
  • Unit Price: $104.30
  • Subtotal: $0.00

Want a better price?
Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $104.30 $104.30
200+ $40.36 $8,072.00
500+ $38.94 $19,470.00
1000+ $38.24 $38,240.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

XCF128XFT64C Tech Specifications
AMD - XCF128XFT64C technical specifications, attributes, parameters and parts with similar specifications to AMD - XCF128XFT64C

Product Attribute Attribute Value
Manufacturer AMD Xilinx
Voltage - Supply 1.7V ~ 2V
Supplier Device Package 64-FTBGA (10x13)
Series -
Programmable Type In System Programmable
Package / Case 64-TBGA
Product Attribute Attribute Value
Package Tray
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Memory Size 128Mb
Base Product Number XCF128

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1B1
HTSUS 8542.32.0071

Parts Introduction

Manufacturer Part Number

XCF128XFT64C

Manufacturer

Xilinx

Introduction

Configuration PROM for FPGA devices designed for high-density data storage

Product Features and Performance

In System Programmable memory

128MB storage capacity

Surface-mount technology

64-TBGA package for compact PCB design

Product Advantages

Enhances the performance of FPGA systems

Optimized for high-density configurations

Robust storage solution compatible with Xilinx FPGAs

Key Technical Parameters

Memory Size: 128MB

Voltage - Supply: 1.7V to 2V

Operating Temperature range: -40°C to 85°C

Package / Case: 64-TBGA

Supplier Device Package: 64-FTBGA (10x13)

Quality and Safety Features

Built for harsh environments with an operating temperature of -40°C to 85°C

Compatibility

Designed for use with Xilinx FPGA platforms

Application Areas

High-density FPGA configuration storage

Complex programmable logic device configuration

Product Lifecycle

Obsolete status indicates no longer in production

Potential for limited availability and support

Replacements or upgrades may be available

Several Key Reasons to Choose This Product

Large 128MB size suitable for complex FPGA designs

System-level programmability for ease of updates

Low voltage operation for energy-efficient designs

Robust temperature range offering reliability in varied environments

Compact TBGA packaging supports space-constrained applications

Frequently Asked Questions(FAQ)

What are the key design considerations when selecting the XCF128XFT64C for in-system programmable applications in industrial environments?
The XCF128XFT64C, with its 128MB serial PROM and 1.7V to 2V operating voltage range, is well-suited for field-upgradable systems requiring reliable configuration storage. Its in-system programmability enables firmware updates without removing the device, reducing downtime in industrial settings. The operating temperature range of -40°C to 85°C ensures functionality across harsh environments, but designers must ensure stable power sequencing during programming cycles to avoid data corruption. Additionally, the 64-FTBGA package demands careful PCB layout with proper thermal relief and impedance control due to high-density routing requirements.
How does the XCF128XFT64C compare to parallel-configuration PROMs in terms of board space and signal integrity for FPGA-based designs?
Compared to parallel-configuration PROMs, the XCF128XFT64C uses a serial interface, significantly reducing pin count and enabling a compact 64-FTBGA footprint (10x13 mm). This minimizes PCB routing complexity and improves signal integrity by eliminating high-speed parallel bus crosstalk. However, the trade-off is slower configuration time, which may affect boot-up performance in time-critical applications. For designs prioritizing board real estate and EMI reduction over initialization speed, the XCF128XFT64C offers a compelling advantage.
What precautions are necessary during PCB assembly due to the moisture sensitivity level (MSL) of the XCF128XFT64C?
The XCF128XFT64C has an MSL rating of 3, allowing a floor life of 168 hours after dry packaging is opened. If exposed beyond this window, the device must undergo baking at 125°C for 24 hours to prevent moisture-induced delamination during reflow soldering. Designers should implement strict inventory rotation and consider using dry cabinets for storage in high-humidity environments to maintain reliability.
Can the XCF128XFT64C be used in automotive applications, given its temperature rating and RoHS status?
While the XCF128XFT64C supports an operating temperature range of -40°C to 85°C, which overlaps with some automotive under-hood requirements, it is RoHS non-compliant and lacks AEC-Q100 qualification. This limits its use in safety-critical automotive systems. It may be suitable for non-critical infotainment or diagnostic modules where full automotive compliance is not mandated, but lifecycle and sourcing risks should be evaluated.
How does the 1.7V to 2V supply voltage range of the XCF128XFT64C impact power supply design in low-voltage FPGA systems?
The XCF128XFT64C’s 1.7V to 2V supply range aligns with modern low-voltage FPGA I/O banks, enabling direct interfacing without level shifters. However, power supply noise must be tightly controlled, as voltage fluctuations near the lower threshold can cause read errors during configuration. A low-noise LDO with ±2% accuracy and adequate decoupling (e.g., 100nF MLCCs near the package) is recommended to ensure stable operation during high-current programming pulses.
What are the implications of the XCF128XFT64C being REACH Unaffected but RoHS non-compliant for global product deployment?
The XCF128XFT64C’s RoHS non-compliance may restrict its use in EU markets unless a valid exemption applies, such as for industrial or medical equipment not covered under standard RoHS directives. While REACH Unaffected status simplifies chemical substance reporting, manufacturers must still conduct supply chain due diligence. Designers targeting global markets should evaluate regional regulations and consider alternative compliant devices if long-term availability is a concern.
How does the serial interface of the XCF128XFT64C affect configuration time compared to higher-speed alternatives?
The XCF128XFT64C uses a serial interface, which typically results in longer configuration times—often in the range of several hundred milliseconds—compared to parallel or quad-SPI PROMs. For FPGAs requiring fast boot times, this delay may necessitate architectural workarounds, such as partial reconfiguration or shadow loading. Engineers should model the full power-on sequence to ensure system-level timing requirements are met.
What layout guidelines are critical for the 64-FTBGA package of the XCF128XFT64C to ensure reliable solder joint formation and signal performance?
The 64-FTBGA package of the XCF128XFT64C requires a symmetrical pad layout with proper solder mask defined (SMD) pads to prevent bridging. Thermal vias beneath the center pad should be filled and plated over to improve heat dissipation and avoid outgassing during reflow. Signal traces from high-speed pins should maintain controlled impedance and minimize length mismatches, especially for clock and data lines, to preserve signal integrity during high-frequency programming operations.
Can the XCF128XFT64C be reprogrammed in the field multiple times, and what are the endurance implications?
Yes, the XCF128XFT64C supports in-system programming and can be reprogrammed multiple times, though the exact endurance is typically in the range of 1,000 to 10,000 cycles depending on operating conditions. Frequent reprogramming in field-deployed systems may necessitate wear-leveling strategies or backup configuration images to mitigate risk of failure. Designers should monitor programming cycles in mission-critical applications and plan for eventual replacement.
How does the XCF128XFT64C compare to flash-based configuration memory in terms of reliability and cost for mid-volume production?
The XCF128XFT64C offers higher reliability in radiation-prone or high-temperature environments compared to standard flash memory due to its hardened architecture, but it typically carries a higher unit cost. For mid-volume production where field updates and long-term data retention are priorities, the XCF128XFT64C provides a robust solution. However, for cost-sensitive applications with infrequent updates, commodity SPI flash may offer better economies of scale despite lower endurance.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCF128XFT64C

Product Attribute XCF128XFTG64C XCF16PFS48C XCF08PVOG48C XCF08PVO48C0973
Part Number XCF128XFTG64C XCF16PFS48C XCF08PVOG48C XCF08PVO48C0973
Manufacturer AMD AMD AMD AMD
Base Product Number - DAC34H84 MAX500 ADS62P42
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Memory Size - - - -
Voltage - Supply - - - -
Programmable Type - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Series - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)

XCF128XFT64C Datasheet PDF

Download XCF128XFT64C pdf datasheets and AMD documentation for XCF128XFT64C - AMD.

PCN Obsolescence/ EOL
End of Life 10/JAN/2022.pdf Mult Device EOL Rev3 9/May/2016.pdf
PCN Part Status Change
2.73KHz.pdf
HTML Datasheet
Platform Flash XL Revision.pdf Platform Flash XL User Guide.pdf XCF128XFT(G)64C Datasheet.pdf
Environmental Information
Xilinx REACH211 Cert.pdf

Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
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  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
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  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
AMD

XCF128XFT64C

AMD
32D-XCF128XFT64C

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