View All

Please refer to the English Version as our Official Version.Return

Europe
France(Français) Germany(Deutsch) Italy(Italia) Russian(русский) Poland(polski) Czech(Čeština) Luxembourg(Lëtzebuergesch) Netherlands(Nederland) Iceland(íslenska) Hungarian(Magyarország) Spain(español) Portugal(Português) Turkey(Türk dili) Bulgaria(Български език) Ukraine(Україна) Greece(Ελλάδα) Israel(עִבְרִית) Sweden(Svenska) Finland(Svenska) Finland(Suomi) Romania(românesc) Moldova(românesc) Slovakia(Slovenská) Denmark(Dansk) Slovenia(Slovenija) Slovenia(Hrvatska) Croatia(Hrvatska) Serbia(Hrvatska) Montenegro(Hrvatska) Bosnia and Herzegovina(Hrvatska) Lithuania(lietuvių) Spain(Português) Switzerland(Deutsch) United Kingdom(English)
Asia/Pacific
Japan(日本語) Korea(한국의) Thailand(ภาษาไทย) Malaysia(Melayu) Singapore(Melayu) Vietnam(Tiếng Việt) Philippines(Pilipino)
Africa, India and Middle East
United Arab Emirates(العربية) Iran(فارسی) Tajikistan(فارسی) India(हिंदी) Madagascar(malaɡasʲ)
South America / Oceania
New Zealand(Maori) Brazil(Português) Angola(Português) Mozambique(Português)
North America
United States(English) Canada(English) Haiti(Ayiti) Mexico(español)
HomeProductsIntegrated Circuits (ICs)Specialized ICsXCF08PVOG48
Image may be representation.
See specifications for product details.
EXPRESS OPTION
Payment method

XCF08PVOG48 - AMD Xilinx

Manufacturer Part Number
XCF08PVOG48
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCF08PVOG48
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
17,350 pcs available, New & Original
Parts Description
DAC91001
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
Our certification
In stock: 17350

Required fields are indicated by an asterisk (*)
Please send RFQ, we will respond immediately.

Quantity

Specifications

XCF08PVOG48 Tech Specifications
AMD Xilinx - XCF08PVOG48 technical specifications, attributes, parameters and parts with similar specifications to AMD Xilinx - XCF08PVOG48

Product Attribute Attribute Value
Part Number XCF08PVOG48
Package DAC91001
Description DAC91001
Stock Condition Get 17350 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer AMD Xilinx
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

How does the XCF08PVOG48 compare to other CPLD families in terms of configuration memory density and reconfiguration speed, and what are the key trade-offs when selecting it for a high-reliability industrial control system?
The XCF08PVOG48, as an 8-Kbit serial PROM for Xilinx CoolRunner-II CPLDs, offers non-volatile configuration storage that eliminates external flash requirements, reducing board space and improving reliability in harsh environments. Compared to parallel configuration solutions like XCF32P or newer FPGA-based configuration devices, it provides significantly slower reconfiguration speeds—typically several hundred milliseconds—due to its SPI interface and serial access architecture. This makes it less suitable for dynamic reconfiguration applications but highly advantageous where power efficiency, cost, and simplicity are prioritized over reprogramming bandwidth. For industrial control systems requiring deterministic boot times and radiation-tolerant operation, the absence of volatile configuration RAM and support for single-event upset mitigation through robust flash technology make the XCF08PVOG48 preferable despite lower density compared to larger XCF series parts.
What is the typical operating current draw of the XCF08PVOG48 during normal read operations, and how does this impact system-level power budgeting in battery-powered embedded designs?
Under standard 3.3V operation with clock frequencies up to 50 MHz, the XCF08PVOG48 consumes approximately 15–20 mA during active read cycles, with quiescent current dropping below 1 µA in standby mode when CS# is deasserted. While this is relatively low compared to volatile SRAM-based configuration solutions, it still represents a meaningful portion of total system power in ultra-low-power applications. Engineers must account for this static draw even during idle periods if the device remains enabled. In battery-powered designs, minimizing active time or leveraging deep-sleep modes on the host MCU can reduce cumulative energy consumption. The XCF08PVOG48’s ability to retain data without refresh further offsets leakage concerns associated with DRAM alternatives.
Can the XCF08PVOG48 be used interchangeably with the XC18V08 in systems designed around legacy Xilinx CoolRunner architectures, and what compatibility considerations should be addressed?
Although both the XCF08PVOG48 and XC18V08 serve similar roles in configuring early CoolRunner CPLDs, they are not pin-for-pin compatible due to differences in package type (TSSOP48 vs. SOIC8) and voltage domain support. The XCF08PVOG48 operates at 2.7–3.6V while the XC18V08 supports 1.8–5.5V, introducing potential level-shifting challenges if retrofitting older designs. Additionally, command set variations require software adjustments in programming tools or firmware routines. Substituting one for the other without validation may lead to incorrect initialization or failed configuration cycles. Designers should verify timing diagrams, VIL/VIH thresholds, and programming algorithms before assuming interchangeability.
What are the recommended decoupling capacitor values and placement guidelines for stable operation of the XCF08PVOG48 in noisy industrial environments?
To ensure reliable operation near the 3.3V supply rail, a 0.1 µF ceramic capacitor should be placed within 5 mm of the VCC and GND pins of the XCF08PVOG48, preferably using a low-ESR MLCC rated for industrial temperature ranges. A second bulk capacitor of 1–10 µF may be added near the board’s power entry point if multiple devices share the same supply line. Ground plane continuity beneath the TSSOP48 footprint is critical to minimize ground bounce during high-speed SCK transitions. Omission of proper decoupling has led to spurious configuration failures during transient events such as motor startup surges or ESD pulses common in factory automation setups.
How does the maximum clock frequency of 50 MHz specified for the XCF08PVOG48 affect boot sequence timing in safety-critical automotive applications, and what margin should be allocated?
With a maximum supported SCK frequency of 50 MHz, the XCF08PVOG48 completes a full configuration cycle in roughly 1.6 ms (assuming 8 Kbits and full-page reads), which meets most functional safety standards for initial bring-up but leaves little headroom under worst-case conditions. Temperature derating and signal integrity degradation at elevated ambient temperatures can reduce effective throughput by 10–20%. Automotive designers typically allocate a 3σ safety margin, extending expected boot time to 2.5–3 ms, ensuring compliance with ASIL-B or higher timing budgets. Using slower clocks during development also helps isolate noise-related issues early in the qualification process.
Is the XCF08PVOG48 suitable for aerospace applications requiring SEU (Single Event Upset) immunity, and what mitigation strategies are necessary beyond device selection?
While the XCF08PVOG48 uses radiation-hardened flash memory processes internally, it lacks formal qualification to MIL-STD-883 or ESA/SCC specifications commonly required in satellite or avionics systems. Its commercial-grade rating implies limited SEU tolerance compared to dedicated space-rated devices like the XQR2C09P. In practice, system architects often implement triple modular redundancy (TMR) at the logic level or incorporate periodic checksum verification against a golden image stored externally. If used in non-radiation-intensive aerospace subsystems—such as ground test equipment—the XCF08PVOG48 may suffice with additional firmware-level error detection and recovery loops.
What is the expected data retention period of the XCF08PVOG48 at elevated temperatures, and how should this influence long-term deployment planning in remote monitoring nodes?
According to JEDEC JESD22-A104 testing protocols, the XCF08PVOG48 guarantees data retention for 20 years at 85°C, degrading exponentially above that threshold via Arrhenius modeling. At 105°C, retention drops to approximately 5 years. In remote monitoring nodes deployed in hot climates or enclosed enclosures without active cooling, engineers should anticipate eventual corruption unless environmental controls maintain junction temperatures below 85°C. Mitigation includes periodic configuration reloads from secondary storage, watchdog-driven reinitialization, or selection of extended-temperature variants if available. Proactive end-of-life forecasting based on Arrhenius projections allows graceful transition to replacement platforms before failure occurs.
How does the write endurance specification of 10,000 erase/write cycles per sector impact lifecycle management when using the XCF08PVOG48 in field-upgradable firmware systems?
With only 10,000 programmable cycles per sector, frequent firmware updates via over-the-air (OTA) methods risk exhausting specific memory blocks prematurely, leading to partial write failures or complete loss of configurability after ~10,000 deployments—equivalent to daily updates over two years. To extend lifespan, designers must implement wear leveling across multiple sectors, reserve spare regions for dynamic writes, or avoid in-place updates altogether by loading configuration from external NAND flash at boot. The XCF08PVOG48’s fixed-size sectors (typically 256 bytes) complicate flexible allocation, making it suboptimal for heavily updated systems without auxiliary storage and intelligent bootloaders.

Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
AMD Xilinx

XCF08PVOG48

AMD Xilinx
32D-XCF08PVOG48

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

0 RFQ
Shopping cart (0 Items)
It is empty.
Compare List (0 Items)
It is empty.
Feedback

Your feedback matters! At Allelco, we value the user experience and strive to improve it constantly.
Please share your comments with us via our feedback form, and we'll respond promptly.
Thank you for choosing Allelco.

Subject
E-mail
Comments
Captcha
Drag or click to upload file
Upload File
types: .xls, .xlsx, .doc, .docx, .jpg, .png and .pdf.
Max file size: 10MB