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HomeProductsIntegrated Circuits (ICs)Memory - Configuration Proms for FPGAsXCF128XFTG64C
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XCF128XFTG64C - AMD

Manufacturer Part Number
XCF128XFTG64C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCF128XFTG64C
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
14,273 pcs available, New & Original
Parts Description
IC PROM SRL 128M GATE 64-FTBGA
Package
64-FTBGA (10x13)
Data sheet
XCF128XFTG64C.pdf

PCN Part Status Change

2.73KHz.pdf

Environmental Information

Xilinx REACH211 Cert.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 14273
  • Unit Price: $55.00
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $55.00 $55.00
200+ $24.35 $4,870.00
500+ $23.67 $11,835.00
1000+ $23.33 $23,330.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

XCF128XFTG64C Tech Specifications
AMD - XCF128XFTG64C technical specifications, attributes, parameters and parts with similar specifications to AMD - XCF128XFTG64C

Product Attribute Attribute Value
Manufacturer AMD Xilinx
Voltage - Supply 1.7V ~ 2V
Supplier Device Package 64-FTBGA (10x13)
Series -
Programmable Type In System Programmable
Package / Case 64-TBGA
Product Attribute Attribute Value
Package Tray
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Memory Size 128Mb
Base Product Number XCF128

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071

Parts Introduction

XCF128XFTG64C Image
XCF128XFTG64C (1)

Manufacturer Part Number

XCF128XFTG64C

Manufacturer

xilinx

Introduction

The XCF128XFTG64C is a memory configuration PROM designed for programming FPGAs, with 128MB memory size and in-system programmability.

Product Features and Performance

In-system programmable

Memory size of 128MB

Voltage supply range from 1.7V to 2V

Operating temperature range from -40°C to 85°C

Surface mount technology

64-TBGA package

Product Advantages

High memory capacity for comprehensive FPGA configuration storage

Support for a wide range of operating temperatures ensuring reliability in varied environments

Low voltage operation for energy efficiency

Key Technical Parameters

Programmable Type: In System Programmable

Memory Size: 128MB

Voltage - Supply: 1.7V ~ 2V

Operating Temperature: -40°C ~ 85°C

Mounting Type: Surface Mount

Package / Case: 64-TBGA

Quality and Safety Features

Designed for robust performance in extreme temperature conditions

Built with xilinx's reliability standards ensuring long term functionality and safety

Compatibility

Compatible with xilinx FPGA devices requiring 128MB configuration PROMs

Application Areas

Used in telecommunications

Data processing units

Industrial automation systems

Product Lifecycle

Status: Obsolete

No direct replacements or upgrades available through xilinx

Several Key Reasons to Choose This Product

Large storage capacity suitable for complex FPGA configurations

Capable of operating under a wide range of environmental conditions

Low power consumption enhancing the overall energy efficiency of the system

Obsolete status makes it ideal for legacy systems maintenance

Frequently Asked Questions(FAQ)

How does the XCF128XFTG64C compare to other AMD PROMs in terms of supply voltage requirements and temperature range for industrial applications?
The XCF128XFTG64C operates across a wide supply voltage range of 1.7V to 2.0V, which aligns with low-voltage digital systems and offers flexibility during power optimization phases. Its operating temperature specification spans from -40°C to +85°C, making it suitable for automotive and industrial environments where thermal extremes are common. This broad temperature tolerance reduces the need for additional thermal management compared to components limited to narrower ranges, especially when integrated into sealed or enclosed designs.
What design considerations should be made when selecting the XCF128XFTG64C for FPGA configuration in space-constrained PCB layouts?
The XCF128XFTG64C is housed in a 64-pin TBGA package measuring 10x13 mm, offering high pin density ideal for compact system designs. However, BGA assembly requires careful attention to solder joint inspection and rework due to its small pitch and buried connections. Designers must ensure adequate via stitching, controlled impedance routing for configuration signals, and compliance with MSL 3 handling requirements during manufacturing. Thermal vias under the package may help dissipate heat in high-frequency programming scenarios.
Is the XCF128XFTG64C compatible with standard FPGA configuration protocols such as SPI?
Yes, the XCF128XFTG64C supports In-System Programmable functionality and is typically used with Xilinx FPGAs over SPI interfaces. It stores configuration bitstreams that initialize FPGA logic upon power-up. While the datasheet confirms compatibility with standard SPI timing, users should verify signal integrity and pull-up/pull-down configurations on CS#, SCK, MOSI, and MISO lines to prevent initialization failures, particularly at the upper end of the 85°C operational limit.
What is the significance of the Moisture Sensitivity Level (MSL) rating of 3 for the XCF128XFTG64C in production environments?
With an MSL 3 classification, the XCF128XFTG64C requires baking before reflow if stored beyond 168 hours under non-controlled humidity conditions. This precaution prevents moisture-induced popcorning during thermal cycling, which could compromise solder joints and device reliability. Manufacturers must follow JEDEC J-STD-033 guidelines for handling, including desiccant packaging and humidity indicator cards during storage and transport.
How does the memory size of the XCF128XFTG64C impact firmware and configuration data capacity in embedded FPGA applications?
The XCF128XFTG64C provides 128 megabits (16 MB) of serial flash memory, sufficient for storing complete FPGA configuration images along with boot code, calibration tables, or diagnostic logs in many mid-to-high-end FPGA systems. For larger designs exceeding this capacity, multiple devices or external NOR flash may be required, increasing board complexity. However, for most modern Xilinx FPGAs up to Kintex-7 or Artix-7 families, 128Mb remains a practical upper bound for single-device configuration storage.
Can the XCF128XFTG64C be reprogrammed multiple times in-system without removing it from the board?
Yes, the XCF128XFTG64C supports In-System Programming (ISP), allowing firmware updates, FPGA reconfiguration, or debugging modifications while mounted on the target PCB. However, each erase cycle affects floating-gate transistor endurance—typically rated for tens of thousands of cycles—so frequent rewriting should be avoided unless supported by wear-leveling algorithms in the host controller.
What precautions are necessary when integrating the XCF128XFTG64C near noisy power rails or high-speed digital circuits?
Due to its low 1.7–2.0V supply range, the XCF128XFTG64C is susceptible to noise coupling from adjacent high-speed traces or switching regulators. A dedicated LDO with <10mV ripple and adequate bypass capacitance (e.g., 1µF ceramic + 10µF tantalum) near the VCC pin is recommended. Additionally, guard rings or ground planes beneath the package can reduce substrate noise pickup, improving data retention and programming stability.
Does the XCF128XFTG64C require any external protection circuitry for ESD events during socketed or plugged-in operations?
While the device includes internal ESD protection diodes, they are not rated for direct human-body model (HBM) discharges above ±2kV. In socketed systems where hot-plugging occurs, transient voltage suppressors (TVS) or ESD diodes rated for >±8kV HBM should be placed close to connector pins, especially on configuration lines like DIN and PROG#. This mitigates risk during maintenance or field upgrades.
How does the RoHS3 compliance status of the XCF128XFTG64C affect global market distribution and regulatory documentation?
RoHS3 compliance means the XCF128XFTG64C meets current European Union restrictions on hazardous substances, including exemptions for lead-free soldering and restricted use of certain phthalates. This simplifies export to EU markets and avoids additional certification steps, though full compliance documentation—including material composition declarations—may still be required for aerospace or medical end-products with stricter environmental standards.
What is the typical latency behavior of the XCF128XFTG64C during FPGA startup compared to other serial PROMs?
During FPGA configuration, the XCF128XFTG64C introduces minimal delay relative to its capacity; however, read access times depend on clock frequency (typically 50–100 MHz). Compared to parallel flash solutions, serial devices like this one trade speed for pin count savings but may extend total configuration time slightly. Actual boot latency varies with FPGA family and initialization sequence, so empirical measurement under target conditions is advised.
Are there known limitations when using the XCF128XFTG64C with newer FPGA architectures beyond legacy Xilinx families?
The XCF128XFTG64C is optimized for older-generation Xilinx FPGAs and may lack support for advanced security features like AES encryption or multi-boot in newer UltraScale+ or Versal devices. Designers targeting these platforms should verify compatibility with the specific FPGA’s Configuration User Guide, as newer architectures often require higher-capacity or authenticated flash parts for secure operation.
How does the base product number XCF128 relate to other variants in the XCF series, and what differentiates the XCF128XFTG64C?
The base part XCF128 refers to a family of 128Mb serial PROMs from AMD/Xilinx, differing primarily in package type, speed grade, and voltage options. The XCF128XFTG64C specifically denotes a 64-ball fine-pitch BGA variant with extended temperature support and standard 1.7–2.0V operation. Other members might offer faster access times or wider voltage ranges, so cross-referencing application-specific requirements is essential before substitution.
What impact does the ECCN classification (3A991B1A) have on import/export logistics involving the XCF128XFTG64C?
Classified under ECCN 3A991B1A, this component falls under "specially designed" integrated circuits for telecommunications or general electronics, not subject to strict export controls but requiring compliance with U.S. regulations such as EAR. Exporters should obtain proper licensing when shipping to embargoed regions or end-users in sensitive sectors, though routine commercial shipments generally face no barriers.
Should decoupling capacitors be placed directly under the XCF128XFTG64C’s power pins, and what values are recommended?
Yes, placing 100nF ceramic capacitors as close as possible to the VCC and GND balls of the XCF128XFTG64C minimizes inductance and stabilizes supply during high-current switching events. Values around 1µF bulk capacitance may supplement this for sustained loads, though total effective capacitance must avoid resonance with package inductance. Avoid large electrolytic caps due to poor high-frequency response in dense ICs.
How does the absence of ECC support in the XCF128XFTG64C influence data integrity strategies in safety-critical systems?
Without built-in error correction, the XCF128XFTG64C relies on external mechanisms—such as checksums, redundant storage, or watchdog resets—to detect corruption during configuration loading. In mission-critical applications (e.g., avionics), this limitation necessitates architectural safeguards, as undetected bit errors could lead to functional failure post-FPGA initialization despite correct-looking operation.
What role does the PROG# pin play during operation of the XCF128XFTG64C, and how should it be managed in end systems?
The PROG# pin initiates a mass erase cycle when pulled low and held during power-up or reset. Proper pull-up resistance ensures normal operation but must be weak enough to allow microcontroller-driven programming without excessive current draw. Typical values range from 1kΩ to 10kΩ, depending on system pull-up strength elsewhere. Leaving it floating risks accidental erasure during brownout conditions.
In what scenarios would replacing the XCF128XFTG64C with a QSPI-compatible flash improve system performance?
If the target FPGA supports Quad-SPI (QSPI) mode and the application demands faster configuration times or concurrent data streaming, a quad-bit capable flash like Micron’s N25Q128A would outperform the XCF128XFTG64C in throughput. However, this requires hardware modification (additional data lines) and software adaptation, making the XCF128XFTG64C preferable in cost-sensitive or legacy designs constrained by pin availability.
How should thermal derating be considered when operating the XCF128XFTG64C at 85°C ambient temperature?
Although the XCF128XFTG64C is rated for up to 85°C, prolonged exposure near this limit may accelerate oxide degradation in floating-gate transistors, potentially reducing data retention from years to months. For long-term reliability, maintaining ambient temperatures below 70°C or ensuring airflow across the PCB helps preserve charge integrity, especially after multiple program/erase cycles.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCF128XFTG64C

Product Attribute XCF128XFT64C XCF08PVOG48C XCF08PVO48C. XCF08PVO48C0973
Part Number XCF128XFT64C XCF08PVOG48C XCF08PVO48C. XCF08PVO48C0973
Manufacturer AMD AMD AMD AMD
Series - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Programmable Type - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Base Product Number - DAC34H84 MAX500 ADS62P42
Mounting Type - Surface Mount Through Hole Surface Mount
Voltage - Supply - - - -
Memory Size - - - -

XCF128XFTG64C Datasheet PDF

Download XCF128XFTG64C pdf datasheets and AMD documentation for XCF128XFTG64C - AMD.

Datasheets
Cylindrical Battery Holders.pdf
PCN Obsolescence/ EOL
End of Life 10/JAN/2022.pdf Mult Device EOL Rev3 9/May/2016.pdf
PCN Part Status Change
2.73KHz.pdf
Environmental Information
Xilinx REACH211 Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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XCF128XFTG64C Image

XCF128XFTG64C

AMD
32D-XCF128XFTG64C

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