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Home Products Integrated Circuits (ICs)Memory - Configuration Proms for FPGAs~~XCF08PVO48C0973~~

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XCF08PVO48C0973 - AMD

Name: AMD XCF08PVO48C0973
Brand: AMD
SKU: XCF08PVO48C0973
Price: 0.691 USD
Availability: InStock
Rating: 5 (1 reviews)

Manufacturer Part Number: XCF08PVO48C0973

Manufacturer: AMD Xilinx

Allelco Part Number: 98D-XCF08PVO48C0973

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 11,824 pcs available, New & Original

Parts Description: CONFIG MEMORY, 8MX1, SERIAL

Package: Bulk

Data sheet: -

RoHs Status

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In stock: 11824

Unit Price: $1.82
Subtotal: $0.00

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Quantity	Unit Price	Ext. Price
1+	$1.82	$1.82
200+	$0.726	$145.20
500+	$0.702	$351.00
1000+	$0.691	$691.00

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

XCF08PVO48C0973 Tech Specifications
AMD - XCF08PVO48C0973 technical specifications, attributes, parameters and parts with similar specifications to AMD - XCF08PVO48C0973

Product Attribute	Attribute Value
Manufacturer	AMD Xilinx
Series	*

Product Attribute	Attribute Value
Package	Bulk

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	Not applicable
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	Vendor Undefined
ECCN	EAR99
HTSUS	8542.32.0051

Frequently Asked Questions(FAQ)

How does the XCF08PVO48C0973 configuration PROM support system initialization in FPGA designs, and what role does its volatile memory architecture play during power-up sequencing?: The XCF08PVO48C0973 serves as a configuration PROM that stores the bitstream required to initialize an FPGA upon power-up. While the device itself is non-volatile, it interfaces with the FPGA’s configuration logic to deliver the correct data sequence during startup. This ensures deterministic boot behavior, which is critical for safety-critical or real-time systems where unpredictable startup states must be avoided. The architecture supports single-wire programming modes, reducing pin count and simplifying PCB layout while maintaining reliable transfer of configuration data to the target FPGA.

What are the key differences between using the XCF08PVO48C0973 and a flash-based configuration memory solution when designing with AMD Spartan-6 FPGAs?: The XCF08PVO48C0973 uses a serial interface (SPI or SelectMAP) to load configuration data into the FPGA, offering moderate speed compared to parallel flash solutions. Unlike some flash devices, it does not require external buffers or address decoding, which reduces component count and board complexity. However, its 8 Mbit capacity may limit support for larger FPGA configurations, making it more suitable for mid-range devices. Flash alternatives often provide higher density and faster read speeds but may demand additional control logic for sector management and wear leveling, increasing design overhead.

Can the XCF08PVO48C0973 be reprogrammed in-circuit, and what precautions should be taken to ensure reliable updates without corrupting the stored bitstream?: Yes, the XCF08PVO48C0973 can be reprogrammed in-system via a serial interface, typically under control of a microcontroller or host processor. To ensure reliability, users must implement robust write verification protocols, including checksum validation and retry mechanisms on failed operations. Power stability during programming is critical—voltage dips can lead to partial writes or corruption. Additionally, the device includes protection features such as block protection bits that must be managed carefully to avoid accidental overwrites of critical configuration sectors.

What impact does temperature range have on the retention characteristics of the XCF08PVO48C0973, and how does this influence long-term system reliability in industrial applications?: The XCF08PVO48C0973 is specified for operation across an extended temperature range, typically -40°C to +85°C. Within this window, data retention exceeds 20 years under nominal conditions. However, elevated temperatures accelerate charge leakage in floating-gate transistors, potentially shortening retention time. In industrial environments with thermal cycling, designers should account for derating factors by avoiding sustained operation near maximum junction temperature. Periodic configuration reloads or redundancy schemes may be necessary in high-reliability applications to mitigate risk of silent data loss.

How does the operating voltage of the XCF08PVO48C0973 compare to newer CPLD or configuration memory devices, and what implications does this have for power-sensitive embedded systems?: The XCF08PVO48C0973 operates at 3.3V core logic levels, which aligns with legacy FPGA families like the Spartan-3 series. Newer configuration memories increasingly support 1.8V or even lower voltages, reducing dynamic power consumption significantly. When integrating the XCF08PVO48C0973 into modern low-power designs, level shifters may be required if interfacing with sub-3.0V logic domains, adding trace length and signal integrity considerations. For battery-powered or always-on IoT endpoints, this voltage mismatch can contribute to higher quiescent current and reduced overall efficiency.

In what scenarios would the XCF08PVO48C0973 be preferred over an on-chip configuration memory block in a modern FPGA, despite increased BOM cost and footprint?: The XCF08PVO48C0973 is advantageous when multiple FPGA variants share the same PCB layout or when secure, tamper-resistant configuration storage is needed outside the FPGA itself. It enables field updates without replacing hardware, supports version-controlled firmware rollouts, and decouples configuration logic from silicon-level constraints. Additionally, in mixed-signal or radiation-hardened designs where FPGA internal resources are reserved for analog functions or error correction, external configuration provides greater flexibility and isolation from process variations.

What are the typical latency and throughput characteristics of the XCF08PVO48C0973 when streaming configuration data to a Spartan-6 FPGA, and how do these affect system boot time?: At a clock frequency of 50 MHz, the XCF08PVO48C0973 can sustain approximately 6.25 Mbits/sec throughput in SPI mode. Given its 8 Mbit capacity, full configuration transfer takes around 1.3 seconds under ideal conditions. Boot time also depends on the FPGA’s internal handshake protocol and initialization sequence. For applications requiring sub-second boot, this device may necessitate code compression, partial reconfiguration, or use of faster external memories. Designers should factor in margin for clock jitter and interface setup times to meet real-world timing budgets.

How does the package type (VQFN-48) of the XCF08PVO48C0973 influence thermal performance and routing density in high-layer-count PCBs?: The VQFN-48 package features a small 6x6 mm footprint with exposed thermal pad, enabling compact layouts but presenting challenges in heat dissipation due to limited copper attachment area. On dense PCBs with limited top-layer access, thermal vias under the package are essential to conduct heat to inner planes. Routing signals around the periphery requires careful spacing to avoid interference, especially for high-speed lines like configuration clock or data lines. The tight pitch (0.5 mm ball/pad) demands precision assembly to prevent tombstoning or solder bridging during reflow.

What precautions should be taken when storing the XCF08PVO48C0973 prior to integration to preserve data integrity and prevent electrostatic discharge damage?: The XCF08PVO48C0973 should be stored in anti-static packaging with humidity control to minimize oxidation on bond pads. Ambient conditions should remain below 60% relative humidity and within -40°C to +85°C to prevent moisture-induced delamination. Unused pins must not be left floating; they should be tied through appropriate pull-up or pull-down resistors per datasheet recommendations. Handling during assembly requires grounded wrist straps and ESD-safe workstations, as static discharge can permanently damage floating-gate cells.

How does the XCF08PVO48C0973 handle configuration errors during partial reconfiguration workflows, and what mechanisms exist to detect and recover from corrupted bitstreams?: The XCF08PVO48C0973 itself does not validate configuration data; error detection relies on the FPGA’s internal CRC checks and handshake signals. If a corrupted segment is loaded, the FPGA typically enters a fail-safe state and halts operation. Recovery requires a secondary bootloader that can reload the full bitstream from a redundant image stored elsewhere—either in another memory device or in a secure flash partition. The XCF08PVO48C0973 supports dual-bank architectures in some implementations, allowing fallback to a known-good configuration if primary data fails integrity checks.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCF08PVO48C0973

Product Attribute
Part Number	XCF08PVOG48C	XCF08PVO48C	XCF08PVO48C.	XCF08PFS48C
Manufacturer	AMD	AMD	AMD	AMD
Series	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

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All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

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