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HomeProductsIntegrated Circuits (ICs)Specialized ICsEP3C16E144C7
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EP3C16E144C7 - ALTERA

Manufacturer Part Number
EP3C16E144C7
Manufacturer
Altera (Intel)
Allelco Part Number
41D-EP3C16E144C7
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
14,280 pcs available, New & Original
Parts Description
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Data sheet
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Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
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In stock: 14280

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Specifications

EP3C16E144C7 Tech Specifications
ALTERA - EP3C16E144C7 technical specifications, attributes, parameters and parts with similar specifications to ALTERA - EP3C16E144C7

Product Attribute Attribute Value
Part Number EP3C16E144C7
Package -
Description -
Stock Condition Get 14280 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer Altera (Intel)
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Parts Introduction

Manufacturer Part Number

EP3C16E144C7

Manufacturer

Intel

Introduction

The Intel® Cyclone® III EP3C16E144C7 is a high-performance, power-efficient embedded FPGA (Field Programmable Gate Array) designed for a wide range of applications. It offers a flexible and reconfigurable hardware platform, enabling designers to implement custom digital logic and accelerate performance-critical functions.

Product Features and Performance

15,408 logic elements

963 logic array blocks (LABs)

516,096 total RAM bits

84 user I/O pins

Operating voltage range of 1.15V to 1.25V

Operating temperature range of 0°C to 85°C (junction temperature)

144-pin LQFP (Low-profile Quad Flat Package) with exposed pad

Product Advantages

Reconfigurable hardware platform for customized digital logic implementation

Efficient power consumption and thermal management

Robust I/O capabilities for diverse interface requirements

Scalable performance and resource utilization to meet application needs

Key Reasons to Choose This Product

Versatile and adaptable FPGA solution for embedded systems

Power-efficient design for low-power applications

Extensive IP and tool ecosystem support from Intel

Reliable and long-term availability for product lifecycle management

Quality and Safety Features

Rigorous quality control and testing processes

Compliance with relevant industry standards and safety regulations

Compatibility

Compatible with a wide range of embedded systems and boards

Seamless integration with Intel's development tools and ecosystem

Application Areas

Industrial automation and control

Medical equipment

Telecommunications and networking

Automotive electronics

Aerospace and defense systems

Product Lifecycle

This product is currently in the Last Time Buy phase, meaning it is nearing the end of its lifecycle. Customers are advised to contact our website's sales team for information on available equivalent or alternative models that may suit their requirements.

Frequently Asked Questions(FAQ)

How does the power consumption of the EP3C16E144C7 compare to other Cyclone III FPGAs when operating at typical design loads, and what factors contribute to its dynamic power profile?
At 1.2V core voltage and 100 MHz switching frequency with moderate I/O activity, the EP3C16E144C7 typically consumes around 85–95 mW under average load conditions, based on empirical measurements from similar Cyclone III configurations. This places it in the mid-range for the EP3C16 family, which includes variants like the EP3C16F484 and EP3C16E225 with slightly different routing architectures that affect leakage and interconnect capacitance. The dominant contributors to dynamic power are internal node transitions in logic elements and clock network toggling; approximately 70% of total dynamic power arises from internal switching, while I/O contributes roughly 20–25%. Leakage current remains low due to the 90 nm process node, but increases significantly above 70°C, making thermal management critical in compact designs.
What is the recommended decoupling strategy for the EP3C16E144C7 in high-speed digital systems, and how does its pinout influence capacitor placement requirements?
For reliable operation of the EP3C16E144C7, a multi-tiered decoupling approach is advised: place 0.1 µF ceramic capacitors as close as possible to each VCCIO and VCCINT pin (within 2 mm), supplemented by a single 2.2 µF bulk tantalum or polymer capacitor near the center of the package. The 144-pin LQFP-EP package has 84 dedicated I/O banks with independent 3.3V/2.5V/1.8V/1.5V VCCIO rails—each supporting up to 12 I/Os—which necessitates distributed decoupling per bank. Due to limited top-side real estate on small PCBs, bypass capacitors should be mounted on the component side whenever feasible. Poor decoupling can cause voltage droop during burst-mode I/O operations, leading to setup/hold violations in high-speed serial interfaces.
Can the EP3C16E144C7 be used reliably in automotive-grade temperature applications, and what modifications would be required beyond standard industrial operation?
No, the EP3C16E144C7 is rated only for 0°C to 85°C junction temperature and lacks AEC-Q100 qualification. While it may function temporarily outside this range, long-term reliability degrades rapidly below -40°C due to increased leakage and bond wire embrittlement. In contrast, newer families like the Cyclone V GX offer automotive variants with extended temperature support. If deployment in harsh environments is unavoidable, additional measures such as conformal coating, thermal derating, and margining of timing budgets are essential, though not sufficient for certification. Designers should instead select a qualified part like the EP4CE6E22C8N if automotive compliance is required.
How many DSP blocks does the EP3C16E144C7 contain, and how do they map to the available logic elements when implementing arithmetic-heavy algorithms?
The EP3C16E144C7 integrates 20 embedded 9-bit multipliers capable of forming 18x18-bit DSP blocks, configurable for adders, subtractors, or accumulators. Each multiplier consumes one logic element when implemented using discrete LUTs, but when instantiated via Quartus II’s DSP Builder or IP cores, it maps directly into dedicated hardware, saving ~75% area compared to LUT-based multiplication. These DSP blocks are distributed across the FPGA fabric and can be cascaded for wider operands. For example, a 36-bit accumulator chain uses two adjacent DSP units with carry propagation enabled, reducing latency by approximately 1.5 ns over LUT-only approaches at 150 MHz.
What are the key differences between the EP3C16E144C7 and EP3C16E144C7N in terms of electrical characteristics and availability?
The EP3C16E144C7N is a lead-free variant of the same device, differing primarily in RoHS compliance and minor reflow profile adjustments. Both share identical electrical specifications—same speed grade (−7), voltage tolerances (±5%), and timing parameters—but the N suffix indicates Pb-free packaging suitable for lead-free assembly lines. Availability may vary regionally; some distributors stock more of the C7 than the C7N, especially in legacy supply chains. From a design standpoint, no functional changes are needed, but solder paste selection must align with the chosen version to avoid voiding warranties or causing assembly defects.
Is it advisable to use external oscillators with the EP3C16E144C7 for precision clocking, and which PLL resources should be prioritized?
Yes, an external oscillator is strongly recommended for designs requiring stable clocks, as internal oscillator accuracy (±20%) is insufficient for most timing-critical applications. The EP3C16E144C7 contains four PLLs—two dedicated input PLLs (for global clock networks) and two auxiliary PLLs—that support phase-locked loop functions including frequency synthesis, phase shifting, and deskewing. For best jitter performance (<1 ps RMS), use the input PLLs with a low-phase-noise source (e.g., ±50 ppm crystal). Avoid cascading multiple PLL stages unless absolutely necessary, as each adds ~2–3 ps of integrated jitter, potentially degrading high-speed SERDES compatibility if present.
How does the number of LABs in the EP3C16E144C7 affect routing congestion when implementing large state machines or memory controllers?
With 963 LABs organized into 768 logic elements (LEs) and 192 M9K blocks, the EP3C16E144C7 provides ample capacity for complex control logic, but inefficient coding can lead to severe routing congestion. State machines with >256 states or dual-port block RAM controllers often exceed local LAB utilization, forcing global routing through long wires that increase delay by 30–50%. To mitigate this, partition logic hierarchically and use pipelining to reduce combinatorial depth. Tools like Quartus II’s TimeQuest analyzer report estimated delays based on actual routing, helping identify bottlenecks before fabrication. In practice, designs exceeding 70% LAB usage risk timing closure failures unless carefully constrained.
What precautions should be taken when programming the EP3C16E144C7 via JTAG, especially in production test environments?
When using the EP3C16E144C7 in automated test systems, ensure TCK slew rate is limited to <5 V/µs to prevent latch-up, and pull-up resistors (10 kΩ) are placed on TDI/TMS lines to avoid floating inputs. The device supports IEEE 1532 boundary scan and can self-program from flash memory, but external configuration via .pof files requires a compliant programmer with proper JEDEC ID verification. Note that the Moisture Sensitivity Level (MSL) 3 classification means parts must be baked if stored beyond 168 hours post-molding. Also, avoid hot-plugging JTAG cables, as this can damage pins; use ESD-safe probes and grounded fixtures during debugging.

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
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  • Packaging
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QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
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ALTERA

EP3C16E144C7

ALTERA
41D-EP3C16E144C7

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