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HomeProductsIntegrated Circuits (ICs)Specialized ICsEP3C16E144I7
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EP3C16E144I7 - ALTERA

Manufacturer Part Number
EP3C16E144I7
Manufacturer
Altera (Intel)
Allelco Part Number
41D-EP3C16E144I7
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
17,730 pcs available, New & Original
Parts Description
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Data sheet
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Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
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Our certification
In stock: 17730

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Specifications

EP3C16E144I7 Tech Specifications
ALTERA - EP3C16E144I7 technical specifications, attributes, parameters and parts with similar specifications to ALTERA - EP3C16E144I7

Product Attribute Attribute Value
Part Number EP3C16E144I7
Package -
Description -
Stock Condition Get 17730 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer Altera (Intel)
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Parts Introduction

Manufacturer Part Number

EP3C16E144I7

Manufacturer

intel

Introduction

The intel EP3C16E144I7 is a high-performance, low-power Cyclone® III series embedded FPGA (Field Programmable Gate Array) that offers a unique combination of features and capabilities. This FPGA is designed for a wide range of applications, including industrial automation, medical equipment, and communication systems.

Product Features and Performance

963 Logical Array Blocks (LABs) and 15,408 Logic Elements (LEs) for advanced logic implementation

516,096 total RAM bits for data storage and processing

84 user-configurable I/O pins for flexible interfacing

Operating voltage range of 1.15V to 1.25V for efficient power management

Wide operating temperature range of -40°C to 100°C (TJ) for enhanced reliability

Product Advantages

Versatile FPGA architecture that can be customized for specific application requirements

Low power consumption for energy-efficient operation

Extensive on-chip memory resources for data-intensive applications

Robust temperature tolerance for use in challenging environmental conditions

Key Reasons to Choose This Product

Exceptional performance and flexibility for a wide range of embedded applications

Efficient power management for extended battery life or reduced cooling requirements

Reliable operation in extreme temperature environments

Seamless integration with other intel components for comprehensive system solutions

Quality and Safety Features

Rigorous quality control and testing procedures to ensure reliability and long-term stability

Compliance with relevant industry standards and safety regulations

Compatibility

The intel EP3C16E144I7 is compatible with a variety of development tools and software environments, allowing for easy integration into diverse system designs.

Application Areas

Industrial automation and control systems

Medical equipment and instrumentation

Telecommunications and networking equipment

Automotive and transportation systems

Product Lifecycle

The intel EP3C16E144I7 is currently in the Last Time Buy phase, indicating that the product is nearing discontinuation. Customers are advised to contact our website's sales team for information on available equivalent or alternative models.

Frequently Asked Questions(FAQ)

What are the key power supply considerations when designing with the EP3C16E144I7 FPGA in a low-voltage embedded system?
The EP3C16E144I7 operates across a narrow voltage range of 1.15V to 1.25V, which aligns with modern low-power embedded requirements but demands precise regulation. Designers must implement a stable, low-noise voltage rail capable of delivering sufficient current for both core logic and I/O banks without exceeding thermal limits. Voltage deviations beyond ±5% can cause timing violations or functional instability, especially during dynamic reconfiguration. Decoupling capacitors near the package pins and careful PCB layout are essential to minimize noise coupling into sensitive internal nodes.
How does the number of I/O pins (84) on the EP3C16E144I7 compare to alternative Cyclone III FPGAs like the EP3C10E144I7 in terms of flexibility for mixed-signal applications?
While both EP3C16E144I7 and EP3C10E144I7 share the same 144-pin LQFP package and similar pinout density, the EP3C16E144I7 offers significantly higher logic capacity—15,408 LEs versus 8,208 LEs—but only slightly more I/Os (84 vs. 80). In mixed-signal designs requiring moderate logic processing alongside ADC interfacing or sensor conditioning, the EP3C10E144I7 may suffice with its lower resource count and reduced power consumption. However, if digital signal processing tasks exceed 963 LABs or require more parallel interfaces, the EP3C16E144I7 provides necessary headroom without sacrificing I/O availability per pin.
What is the impact of operating temperature range (-40°C to 100°C) on reliability when using the EP3C16E144I7 in industrial automation systems?
The extended commercial-to-industrial temperature range supports deployment in harsh environments such as factory floors or outdoor enclosures. However, junction temperatures above 85°C reduce mean time between failures due to increased electromigration in interconnects. Thermal management must ensure airflow or heatsinking keeps TJ below 90°C under full load. At 100°C ambient, derating of logic speed by approximately 10–15% is typical, necessitating timing margin in constraint files. Proper solder joint inspection under MSL 3 handling protocols also prevents moisture-induced popcorning during thermal cycling.
Can the EP3C16E144I7 support multiple voltage domains simultaneously for interfacing with legacy 3.3V peripherals?
Yes, but not natively through its core supply. The EP3C16E144I7’s core runs at 1.2V, while many I/O standards like LVCMOS33 require 3.3V signaling. Each I/O bank can be configured independently with external level translators or dedicated transceiver circuits. Using on-chip PLLs with external clock buffers allows clean generation of reference clocks compatible with 3.3V devices. Careful isolation of analog sections and use of Schmitt-trigger inputs mitigate noise from slow-edge transitions common in older serial buses like SPI or UART.
How should memory resources be allocated when implementing a soft processor core like Nios II with the EP3C16E144I7?
The EP3C16E144I7 contains 516,096 total RAM bits, typically organized as block RAMs suitable for instruction/data caches and on-chip SRAM. A typical Nios II/e soft core consumes ~1,000–1,500 LEs and benefits from dedicated RAM blocks rather than distributed logic-based memory. Allocating at least 64 KB for program storage and 32 KB for data ensures adequate performance without exhausting block RAMs needed for other functions like FIFO buffering or lookup tables. Unused RAM should be disabled to conserve power and avoid routing congestion.
What are the implications of the Moisture Sensitivity Level (MSL) 3 rating for the EP3C16E144I7 in high-volume manufacturing?
With an MSL 3 classification requiring storage in dry pack bags with desiccant and humidity indicator cards, the EP3C16E144I7 demands strict adherence to JEDEC J-STD-033 handling procedures. After opening the packaging, assembly must occur within 168 hours if floor life exceeds 72 hours at 30°C/60% RH. Failure to comply risks delamination during reflow soldering, leading to catastrophic failure. Automated pick-and-place machines equipped with humidity-controlled staging areas are recommended for reliable production yield.
How does the package size (144-EQFP, 20x20 mm) influence thermal dissipation compared to larger QFNs?
The 144-EQFP package offers good electrical connectivity via 0.5mm pitch leads but has limited exposed pad area relative to larger BGA variants. Heat generated by 15,408 logic elements dissipates primarily through conduction to the PCB via the exposed pad underside. Without additional thermal vias or copper pours under the package, maximum continuous power dissipation drops sharply above 1.5W. Designers should calculate worst-case power using static and dynamic figures from Quartus Prime PowerPlay Analyzer and apply derating curves provided in the device handbook.
Is the EP3C16E144I7 suitable for real-time control loops requiring deterministic response times under 100 µs?
Yes, provided the logic design avoids shared bus contention and uses dedicated hardware accelerators where possible. The EP3C16E144I7’s 963 LABs enable pipelined architectures that achieve sub-microsecond latency for fixed-function tasks such as PWM generation or encoder decoding. However, software running on Nios II must be optimized to minimize interrupt jitter. Worst-case execution time analysis using static timing reports is critical—timing closure at 150 MHz yields worst-case path delays under 6.7 ns, supporting loop rates up to 15 kHz with proper scheduling.
How do the RoHS compliance and REACH status affect global certification efforts involving the EP3C16E144I7?
As a fully RoHS-compliant part with REACH unaffected status, the EP3C16E144I7 meets environmental regulations in Europe, North America, and Asia without restrictions on hazardous substances like lead, cadmium, or certain phthalates. This simplifies supply chain documentation and avoids customs delays associated with non-compliant imports. Manufacturers can confidently integrate it into products targeting CE marking, FCC Part 15, and China RoHS without additional material disclosure burdens beyond standard component-level declarations.
What trade-offs exist between using the EP3C16E144I7 versus discrete CPLDs for glue logic in legacy system upgrades?
While CPLDs offer simpler programming models and lower cost for small-scale state machines, the EP3C16E144I7 provides vastly greater flexibility with 15,408 LEs capable of emulating complex protocols and offering programmable delays unmatched by fixed-logic CPLDs. However, power consumption rises from tens of milliwatts in CPLDs to over 300 mW in active mode for the EP3C16E144I7. For applications demanding future-proofing or protocol updates post-deployment, the FPGA justifies its higher bill-of-materials cost through reduced mechanical redesign cycles and enhanced diagnostic capabilities.

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
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QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
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ALTERA

EP3C16E144I7

ALTERA
41D-EP3C16E144I7

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