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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~LCMXO2-4000HC-5FTG256C~~

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LCMXO2-4000HC-5FTG256C - Lattice Semiconductor Corporation

Name: Lattice Semiconductor Corporation LCMXO2-4000HC-5FTG256C
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-4000HC-5FTG256C
Price: 5.19 USD
Availability: InStock
Rating: 5 (6 reviews)

Manufacturer Part Number: LCMXO2-4000HC-5FTG256C

Manufacturer: Lattice Semiconductor

Allelco Part Number: 98D-LCMXO2-4000HC-5FTG256C

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 32,429 pcs available, New & Original

Parts Description: IC FPGA 206 I/O 256FTBGA

Package: 256-FTBGA (17x17)

Data sheet: LCMXO2-4000HC-5.pdf

Datasheets
MachXO2 Family Datasheet.pdf

Getting Started Guide
Product Selector Guide.pdf

PCN Other
I2C Read-Back Failure Feb/2015.pdf

PCN Design/Specification
Datasheet Chg 21/Mar/2016.pdf Multiple Devices Cu Wire 01/Jul/2013.pdf

PCN Packaging
All Dev Pkg Mark Chg 12/Nov/2018.pdf

PCN Assembly/Origin
Alternate Qualified Test Site 30/Sep/2013.pdf

RoHs Status: ROHS3 Compliant

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Unit Price: $14.15
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Quantity	Unit Price	Ext. Price
1+	$14.15	$14.15
200+	$5.48	$1,096.00
500+	$5.28	$2,640.00
1000+	$5.19	$5,190.00

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

LCMXO2-4000HC-5FTG256C Tech Specifications
Lattice Semiconductor Corporation - LCMXO2-4000HC-5FTG256C technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation - LCMXO2-4000HC-5FTG256C

Product Attribute	Attribute Value
Manufacturer	Lattice Semiconductor
Voltage - Supply	2.375V ~ 3.465V
Total RAM Bits	94208
Supplier Device Package	256-FTBGA (17x17)
Series	MachXO2
Package / Case	256-LBGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	4320
Number of LABs/CLBs	540
Number of I/O	206
Mounting Type	Surface Mount
Base Product Number	LCMXO2-4000

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991D
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

How does the LCMXO2-4000HC-5FTG256C compare to other MachXO2 family members in terms of logic capacity and power efficiency for low-power embedded designs?: The LCMXO2-4000HC-5FTG256C offers 4,320 logic elements and 94,208 total RAM bits, positioning it as a mid-range device within the MachXO2 series. Compared to higher-density variants like the LCMXO2-7000HE, it provides sufficient logic resources for moderate control tasks while consuming significantly less static power—typically under 5 mW in standby mode due to its ultra-low power architecture. This makes it particularly suitable for battery-powered or thermally constrained applications where power efficiency outweighs raw performance requirements.

What are the key timing constraints and clock domain considerations when implementing high-speed interfaces with the LCMXO2-4000HC-5FTG256C?: With a maximum operating frequency of approximately 320 MHz in typical configurations, the LCMXO2-4000HC-5FTG256C supports most common embedded protocols including SPI, I2C, and parallel interfaces up to 100 Mbps. However, designers must account for propagation delays through programmable interconnects, which can add 2–5 ns per routing segment. For synchronous designs crossing clock domains, explicit synchronization logic using dual-flop stages or FIFO structures is strongly recommended, especially when interfacing asynchronous peripherals to the main system clock running at ≤100 MHz.

Can the LCMXO2-4000HC-5FTG256C be used reliably in industrial temperature environments, and what derating practices apply to its voltage supply and I/O characteristics?: While the part specifies an operating junction temperature range of 0°C to 85°C, industrial-grade systems often require operation down to -40°C. At lower temperatures, increased propagation delay and reduced maximum frequency may occur due to slower transistor switching. Additionally, input leakage currents decrease with temperature, but output drive strength remains relatively stable across the full range. Voltage margins should include a 10% safety factor above the minimum VCC of 2.375V, particularly during cold start-up transients.

How does the number of available I/O pins on the LCMXO2-4000HC-5FTG256C impact board layout decisions, and what termination strategies are recommended for unconnected inputs?: With 206 general-purpose I/Os distributed across the 256-ball FTBGA package, the LCMXO2-4000HC-5FTG256C provides ample connectivity for complex peripherals. Unused pins should be terminated to prevent floating conditions that could increase dynamic power consumption or cause unintended glitching. Best practice dictates pulling unused inputs to ground via 10 kΩ resistors if they’re configured as CMOS inputs, or leaving them unterminated only if driven by LVCMOS-compatible buffers. Outputs not connected should be set to tri-state to minimize capacitive loading.

What trade-offs exist between using internal versus external oscillator sources when designing with the LCMXO2-4000HC-5FTG256C?: The LCMXO2-4000HC-5FTG256C supports internal phase-locked loop (PLL) generation from an onboard crystal reference, enabling clean clock synthesis without external components. However, this approach limits flexibility and adds jitter compared to precision external oscillators like ±25 ppm TCXOs. For time-critical applications such as USB enumeration or Ethernet PHY synchronization, an external source is preferable despite added BOM cost and board space. Internal PLLs suffice for general-purpose logic sequencing or slow serial communication.

How many configuration bits are required to program the LCMXO2-4000HC-5FTG256C, and what security features protect against unauthorized firmware extraction?: Configuration data for the LCMXO2-4000HC-5FTG256C resides in non-volatile flash memory requiring approximately 128 Kbits (16 KB) per device, depending on design complexity. Lattice provides optional AES-128 encryption during configuration loading, preventing bitstream reverse engineering. Without encryption, the configuration stream is susceptible to eavesdropping via JTAG or SPI interfaces. Designers must weigh intellectual property protection needs against boot latency penalties introduced by decryption overhead.

What is the expected mean time between failures (MTBF) for the LCMXO2-4000HC-5FTG256C in continuous operation, and how do radiation-induced errors affect reliability?: Based on industry-standard models for SRAM-based FPGAs, MTBF exceeds 1 million hours under nominal conditions at 25°C ambient. However, single-event upsets (SEUs) caused by cosmic rays can flip configuration bits, potentially corrupting logic state. While the LCMXO2-4000HC-5FTG256C lacks built-in SEU mitigation, designers can implement frame scrubbing routines or use error-correcting code (ECC)-enabled block RAM to detect and correct soft errors in memory-intensive applications deployed in high-radiation environments.

In what scenarios would the LCMXO2-4000HC-5FTG256C outperform a CPLD alternative, and vice versa?: The LCMXO2-4000HC-5FTG256C excels in designs requiring moderate sequential logic, embedded memory blocks, or soft processor integration—such as protocol bridging or state machine orchestration—where reprogrammability and higher density justify the slightly higher power envelope. Conversely, CPLDs remain preferable for simple glue logic, wide-input latching, or deterministic response times under 100 ns, where fixed interconnect and instant-on behavior reduce latency unpredictability. Selection hinges on algorithmic complexity versus timing predictability demands.

What precautions are necessary during programming and debugging to avoid damaging the LCMXO2-4000HC-5FTG256C or corrupting user logic?: To prevent damage, ensure VCCIO matches the programmer’s supply rail (±5%) and never exceed absolute maximum ratings during configuration. Avoid hot-plugging the device unless using dedicated power sequencing circuits. During JTAG debugging, disable automatic reconfiguration to preserve volatile state. Also, verify that pull-up/pull-down resistors on configuration pins (e.g., INIT_B, DONE) comply with Lattice’s recommended values to guarantee reliable startup and prevent partial programming failures.

How does the package size and pinout of the LCMXO2-4000HC-5FTG256C influence thermal management and signal integrity in compact PCB layouts?: The 17x17 mm FTBGA package presents thermal challenges due to limited surface area for heat dissipation; however, the die is internally attached to the substrate, allowing conduction to adjacent layers. For thermal relief, allocate adequate copper pour on inner layers connected to a solid ground plane. Signal integrity requires careful routing: keep high-speed lines short (<5 mm) and maintain consistent impedance (typically 50 Ω differential pairs). Bypass capacitors should be placed within 2 mm of power pins to suppress high-frequency noise generated by internal switching activity.

Is the LCMXO2-4000HC-5FTG256C suitable for automotive applications, and what qualification standards must be met for production deployment?: Although the part is RoHS3 compliant and meets commercial-grade specifications, it is not inherently AEC-Q100 qualified. Automotive customers typically require extended temperature testing (-40°C to +125°C), accelerated life testing, and process change notifications. Unless explicitly certified by Lattice Semiconductor, the LCMXO2-4000HC-5FTG256C cannot be used directly in safety-critical automotive systems without additional validation and failure mode analysis.

What role do Look-Up Tables (LUTs) play in implementing arithmetic functions within the LCMXO2-4000HC-5FTG256C, and how do they affect resource utilization?: Each LAB in the LCMXO2-4000HC-5FTG256C contains four 6-input LUTs capable of implementing any combinational function up to 6 variables. Complex arithmetic like multiplication benefits from dedicated carry chains, which optimize speed and reduce LUT usage by 50% compared to ripple-carry approaches. Division and floating-point operations consume significantly more LABs due to iterative algorithms, making them impractical without external DSP blocks—hence their avoidance in resource-constrained FPGA families like MachXO2.

Parts with Similar Specifications

The three parts on the right have similar specifications to Lattice Semiconductor Corporation LCMXO2-4000HC-5FTG256C

Product Attribute
Part Number	LCMXO2-4000HC-5FTG256I	LCMXO2-4000HC-5BG256I	LCMXO2-4000HC-6BG256C	LCMXO2-4000HC-5FG484C
Manufacturer	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation
Number of I/O	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Number of Logic Elements/Cells	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Series	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Number of LABs/CLBs	-	-	-	-
Voltage - Supply	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Total RAM Bits	-	-	-	-

LCMXO2-4000HC-5FTG256C Datasheet PDF

Download LCMXO2-4000HC-5FTG256C pdf datasheets and Lattice Semiconductor Corporation documentation for LCMXO2-4000HC-5FTG256C - Lattice Semiconductor Corporation.

Datasheets: MachXO2 Family Datasheet.pdf
Getting Started Guide: Product Selector Guide.pdf
PCN Other: I2C Read-Back Failure Feb/2015.pdf
PCN Design/Specification: Datasheet Chg 21/Mar/2016.pdf Multiple Devices Cu Wire 01/Jul/2013.pdf
PCN Packaging: All Dev Pkg Mark Chg 12/Nov/2018.pdf
PCN Assembly/Origin: Alternate Qualified Test Site 30/Sep/2013.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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