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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~LCMXO2-7000HC-4TG144I~~

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LCMXO2-7000HC-4TG144I - Lattice Semiconductor Corporation

Name: Lattice Semiconductor Corporation LCMXO2-7000HC-4TG144I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-7000HC-4TG144I
Price: 20.61 USD
Availability: InStock
Rating: 5 (1 reviews)

Manufacturer Part Number: LCMXO2-7000HC-4TG144I

Manufacturer: Lattice Semiconductor

Allelco Part Number: 32D-LCMXO2-7000HC-4TG144I

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 2,364 pcs available, New & Original

Parts Description: IC FPGA 114 I/O 144TQFP

Package: 144-TQFP (20x20)

Data sheet: LCMXO2-7000HC-4.pdf

Datasheets
MachXO2 Family Datasheet.pdf

PCN Packaging
All Dev Pkg Mark Chg 12/Nov/2018.pdf

PCN Assembly/Origin
Alternate Qualified Test Site 30/Sep/2013.pdf

Manuals
Leaded Pkg PCB Layout Guide.pdf

PCN Design/Specification
MachXO2 Family Datasheet 30/Sep/2013.pdf QFP Dev Marking Chgs 28/Sep/2020.pdf

RoHs Status: ROHS3 Compliant

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Specifications

LCMXO2-7000HC-4TG144I Tech Specifications
Lattice Semiconductor Corporation - LCMXO2-7000HC-4TG144I technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation - LCMXO2-7000HC-4TG144I

Product Attribute	Attribute Value
Manufacturer	Lattice Semiconductor
Voltage - Supply	2.375V ~ 3.465V
Total RAM Bits	245760
Supplier Device Package	144-TQFP (20x20)
Series	MachXO2
Package / Case	144-LQFP
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells	6864
Number of LABs/CLBs	858
Number of I/O	114
Mounting Type	Surface Mount
Base Product Number	LCMXO2-7000

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Parts Introduction

LCMXO2-7000HC-4TG144I (1)

Manufacturer Part Number

LCMXO2-7000HC-4TG144I

Manufacturer

Lattice Semiconductor

Introduction

Lattice MachXO2 series FPGA designed for low power, small footprint, and cost-sensitive applications

Product Features and Performance

858 Look-Up Tables (LUTs) for logic functions

6864 logic cells for design flexibility

245760 total RAM bits for data storage

114 available general-purpose I/O pins

Versatile power supply voltage range from 2.375V to 3.465V

Surface mount 144-LQFP package for compact PCB design

Extended operating temperature range of -40°C to 100°C suitable for industrial applications

Product Advantages

Low power consumption ideal for power-sensitive devices

Small footprint suited for space-constrained applications

Robust temperature range for use in harsh environments

Reconfigurable logic cells support complex logic designs

Non-volatile configuration memory enhances device security

Key Technical Parameters

Number of LABs/CLBs: 858

Number of Logic Elements/Cells: 6864

Total RAM Bits: 245760

Number of I/O: 114

Voltage Supply Range: 2.375V to 3.465V

Mounting Type: Surface Mount

Operating Temperature: -40°C to 100°C (TJ)

Package/Case: 144-LQFP

Supplier Device Package: 144-TQFP (20x20)

Quality and Safety Features

Strict adherence to industry quality and safety standards

Robust construction for operation in industrial temperature ranges

Compatibility

Compatible with Lattice programming and development tools

Broad interoperability with various standard interfaces

Application Areas

Industrial automation

Consumer electronics

Telecommunications infrastructure

Automotive electronics

Defense and aerospace systems

Product Lifecycle

Product status is active

Not approaching discontinuation

Future upgrade paths are available through the MachXO2 product family

Several Key Reasons to Choose This Product

High-density logic cell count offering design versatility

Integrated memory for efficient data handling

Multiple I/O options for flexible connectivity

Low power consumption to extend battery life in portable devices

Robust performance across a wide temperature range for reliability in demanding applications

Lattice Semiconductor's commitment to long-term product availability and support

Frequently Asked Questions(FAQ)

How does the LCMXO2-7000HC-4TG144I handle power sequencing requirements during startup, and what design considerations are necessary to ensure reliable initialization?: The LCMXO2-7000HC-4TG144I requires that the core voltage (VCCINT) and I/O bank voltages (VCCIOx) be stable within the 2.375V to 3.465V range before configuration begins. While the device supports hot-swap and partial power sequencing, best practice dictates a monotonic rise of VCCINT prior to or simultaneously with VCCIO banks to prevent unintended I/O contention. A delay of at least 100 µs between power stabilization and asserting PROGRAMN is recommended to allow internal power-on reset circuits to settle. Designers should incorporate power supervisors with precise thresholds (±2% tolerance) to meet these timing margins, especially in multi-rail systems where brownout recovery could trigger unintended reconfiguration.

What is the effective usable logic capacity of the LCMXO2-7000HC-4TG144I when implementing a moderately complex state machine with embedded memory and I/O buffering?: With 6,864 logic elements and 245,760 bits of embedded block RAM, the LCMXO2-7000HC-4TG144I can typically support designs requiring up to 4,000–5,000 utilized LUTs while reserving sufficient resources for routing overhead, clock management, and I/O logic. For example, a dual-channel SPI controller with FIFOs and error-checking logic might consume approximately 1,200 LUTs and two EBR blocks (18 Kb total), leaving ample headroom for additional control logic. However, dense interconnect patterns or high-fanout nets can reduce effective utilization by 15–20% due to placement constraints, so floorplanning early in the design flow is advised.

How does the LCMXO2-7000HC-4TG144I compare to the LCMXO2-4000HE in terms of real-world performance for low-power industrial sensor interfaces?: The LCMXO2-7000HC-4TG144I offers approximately 70% more logic elements (6,864 vs. 4,100) and double the block RAM (245,760 vs. 122,880 bits) compared to the LCMXO2-4000HE, enabling more complex data preprocessing or protocol handling within a single device. In a typical 3.3V industrial sensor hub application sampling four analog channels via SPI ADCs, the LCMXO2-7000HC-4TG144I can implement real-time filtering and timestamping without external glue logic, whereas the LCMXO2-4000HE may require offloading to a microcontroller. Both devices share the same static power profile (~35 µW/MHz), but the larger device’s ability to consolidate functions reduces total system power by eliminating interface ICs.

What are the thermal implications of operating the LCMXO2-7000HC-4TG144I at maximum junction temperature in a sealed industrial enclosure?: At TJ = 100°C and ambient temperatures approaching 85°C, the LCMXO2-7000HC-4TG144I’s power dissipation must be carefully managed to avoid thermal runaway. In a typical 3.3V application with 60% logic utilization and 20 active I/Os switching at 10 MHz, dynamic power can reach ~180 mW. Combined with ~50 mW static power, this yields a total of ~230 mW. Given the 144-TQFP package’s θJA of ~35°C/W (on a 4-layer PCB), the resulting temperature rise is approximately 8°C above ambient. However, in sealed enclosures with limited airflow, localized heating from adjacent components can elevate effective ambient temperature, necessitating thermal vias under the package and copper pour isolation to maintain TJ within limits.

Can the LCMXO2-7000HC-4TG144I support DDR3 memory interfacing through soft IP, and what are the limiting factors?: The LCMXO2-7000HC-4TG144I lacks hardened memory controllers and high-speed transceivers, making native DDR3 support impractical. However, a soft-core DDR3 controller can be implemented using the available 6,864 logic elements and block RAM, though with significant trade-offs. Maximum achievable data rates are limited to ~800 Mbps (DDR3-800) due to the FPGA’s 1.2V VCCIO limitations and lack of calibrated delay-locked loops (DLLs) for precise DQS alignment. Additionally, the 114 I/Os constrain address/command bus width—practical implementations typically cap at 16-bit data widths. For applications requiring higher bandwidth or reliability, an external memory controller or migration to a higher-performance FPGA family is recommended.

How does the LCMXO2-7000HC-4TG144I’s configuration memory architecture impact firmware update strategies in field-deployed systems?: The LCMXO2-7000HC-4TG144I uses non-volatile flash-based configuration memory, retaining programming without external boot devices. This enables single-chip solutions but introduces considerations for in-field updates. The internal flash supports over 10,000 program/erase cycles, sufficient for most industrial lifecycles, but frequent reprogramming (e.g., daily updates) may necessitate wear-leveling algorithms in the host MCU’s firmware. Dual-boot support is not native; instead, designers must implement a soft-core state machine to manage fallback images stored in external SPI flash. Configuration time is ~10 ms from power-on, so fail-safe mechanisms should account for brief unavailability during updates.

What signal integrity challenges arise when routing high-speed SPI or UART interfaces on the LCMXO2-7000HC-4TG144I’s 144-TQFP package?: The 144-TQFP’s 0.5 mm pitch and lead inductance (~2–3 nH per pin) impose constraints on signal integrity for interfaces operating above 20 MHz. For SPI clocks exceeding 25 MHz, transmission line effects become significant, requiring controlled impedance routing (typically 50 Ω single-ended) and length matching within ±50 ps for data lines. Ground return paths must be maintained beneath high-speed traces to minimize crosstalk, especially given the limited number of dedicated GND pins (12 in this package). Additionally, simultaneous switching output (SSO) noise can couple into adjacent analog or clock signals; isolating high-drive I/O banks and using slew rate control (available in the LCMXO2-7000HC-4TG144I’s programmable I/O buffers) mitigates this risk.

How does the LCMXO2-7000HC-4TG144I’s MachXO2 architecture compare to Xilinx CoolRunner-II CPLDs for glue logic applications in legacy system upgrades?: The LCMXO2-7000HC-4TG144I provides significantly greater flexibility than CoolRunner-II devices, offering 6,864 logic elements versus ~500–1,000 in comparable CPLDs, along with embedded block RAM and hardened SPI flash. This enables implementation of complex state machines, protocol converters, or soft processors that would require multiple CoolRunner-II chips. However, for simple glue logic (e.g., address decoding or signal multiplexing), the CoolRunner-II’s instant-on capability and lower static power (~10 µA vs. ~50 µA in standby) may be preferable. The LCMXO2-7000HC-4TG144I excels in applications requiring future scalability or firmware-based reconfiguration, while CoolRunner-II remains viable for deterministic, low-latency combinatorial logic.

What precautions are necessary when designing the PCB layout for the LCMXO2-7000HC-4TG144I to meet MSL 3 handling requirements?: As an MSL 3 device, the LCMXO2-7000HC-4TG144I can withstand ambient storage for 168 hours before requiring baking if exposed to >30°C/60% RH conditions. To prevent moisture-induced delamination during reflow, PCBs must be baked at 125°C for 24 hours if the floor life is exceeded. During layout, ensure even thermal distribution under the package by using a symmetrical ground plane and thermal vias (8–12 vias of 0.3 mm diameter recommended) to avoid warpage. Stencil aperture design should limit solder paste volume to prevent voiding, and no-clean flux is preferred to reduce ionic contamination risks that could affect long-term reliability in humid environments.

Can the LCMXO2-7000HC-4TG144I be used in safety-critical applications requiring IEC 61508 compliance, and what documentation support is available?: While the LCMXO2-7000HC-4TG144I is not certified to IEC 61508, its deterministic timing, non-volatile configuration, and absence of dynamic reconfiguration make it suitable for use in SIL 1 or SIL 2 systems with proper architectural mitigations. Lattice provides reliability reports including FIT rates (<10 FIT at 55°C) and failure mode distribution data, which can support FMEDA development. Designers must implement external watchdog timers and periodic self-test routines, as the device lacks built-in BIST or redundancy features. For higher integrity levels, consider pairing with a certified microcontroller for cross-monitoring, leveraging the FPGA’s role as a peripheral controller rather than primary safety logic.

Parts with Similar Specifications

The three parts on the right have similar specifications to Lattice Semiconductor Corporation LCMXO2-7000HC-4TG144I

Product Attribute
Part Number	LCMXO2-7000HC-4TG144C	LCMXO2-7000HC-4FG484I	LCMXO2-7000HC-4FTG256I	LCMXO2-7000HC-4FG484C
Manufacturer	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Number of LABs/CLBs	-	-	-	-
Total RAM Bits	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Voltage - Supply	-	-	-	-
Series	-	-	-	-
Number of I/O	-	-	-	-
Number of Logic Elements/Cells	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Base Product Number	-	DAC34H84	MAX500	ADS62P42

LCMXO2-7000HC-4TG144I Datasheet PDF

Download LCMXO2-7000HC-4TG144I pdf datasheets and Lattice Semiconductor Corporation documentation for LCMXO2-7000HC-4TG144I - Lattice Semiconductor Corporation.

Datasheets: MachXO2 Family Datasheet.pdf
PCN Packaging: All Dev Pkg Mark Chg 12/Nov/2018.pdf
PCN Assembly/Origin: Alternate Qualified Test Site 30/Sep/2013.pdf
Manuals: Leaded Pkg PCB Layout Guide.pdf
PCN Design/Specification: MachXO2 Family Datasheet 30/Sep/2013.pdf QFP Dev Marking Chgs 28/Sep/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Oceania	Australia	6
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Middle East	Israel	6

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