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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)LCMXO2-7000HC-5FG484C
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LCMXO2-7000HC-5FG484C - Lattice Semiconductor Corporation

Manufacturer Part Number
LCMXO2-7000HC-5FG484C
Manufacturer
Lattice Semiconductor
Allelco Part Number
98D-LCMXO2-7000HC-5FG484C
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
49,897 pcs available, New & Original
Parts Description
IC FPGA 334 I/O 484FBGA
Package
484-FBGA (23x23)
Data sheet
LCMXO2-7000HC-5.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 49897
  • Unit Price: $36.70
  • Subtotal: $0.00

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Specifications

LCMXO2-7000HC-5FG484C Tech Specifications
Lattice Semiconductor Corporation - LCMXO2-7000HC-5FG484C technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation - LCMXO2-7000HC-5FG484C

Product Attribute Attribute Value
Manufacturer Lattice Semiconductor
Voltage - Supply 2.375V ~ 3.465V
Total RAM Bits 245760
Supplier Device Package 484-FBGA (23x23)
Series MachXO2
Package / Case 484-BBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 6864
Number of LABs/CLBs 858
Number of I/O 334
Mounting Type Surface Mount
Base Product Number LCMXO2-7000

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

What is the total number of logic elements available in the LCMXO2-7000HC-5FG484C FPGA, and how does this impact design complexity for medium-scale digital systems?
The LCMXO2-7000HC-5FG484C contains 6864 logic elements (LEs), which provides sufficient granularity for implementing complex state machines, moderate-resolution data path logic, or multiple peripheral controllers within a single device. This level of resource availability supports designs requiring several thousand flip-flops and combinational logic blocks without necessitating multi-chip partitioning, though careful synthesis optimization is recommended to avoid inefficient LE utilization patterns that can degrade timing performance.
How does the voltage supply range of 2.375V to 3.465V in the LCMXO2-7000HC-5FG484C affect system-level power budgeting and interfacing with common I/O standards?
Operating across this voltage window allows compatibility with both legacy 3.3V systems and newer low-voltage interfaces like LVCMOS18 or LVTTL at 2.5V, offering flexibility in mixed-signal environments. However, designers must ensure downstream components support this range and account for dynamic power scaling—switching from 3.3V to 2.5V reduces dynamic power by approximately 35% under fixed activity conditions, which can significantly extend battery life in portable applications.
What distinguishes the MachXO2 family’s architecture from larger FPGAs, and how should one evaluate whether the LCMXO2-7000HC-5FG484C is suitable for non-traditional FPGA tasks such as glue logic or configuration storage?
Unlike high-density Stratix or Kintex devices, MachXO2 series like the LCMXO2-7000HC-5FG484C emphasize low-power instant-on capability, small footprint, and cost efficiency rather than raw throughput. Its 6864 LEs and 245760-bit RAM are well-suited for managing bus arbitration, protocol translation, or storing boot code—applications where deterministic latency and minimal configuration time outweigh need for massive parallelism. This makes it ideal for bridging microcontrollers to legacy peripherals or enabling field-upgradable firmware without external CPLDs.
In what scenarios would using the LCMXO2-7000HC-5FG484C be more advantageous than integrating discrete logic ICs for a 334-pin interface management task?
When managing wide parallel buses—such as expanding GPIOs from a microcontroller—the LCMXO2-7000HC-5FG484C consolidates control logic into a single package, reducing PCB area by up to 60% compared to cascaded 74-series chips. Additionally, its built-in I/O banks allow per-pin slew rate and drive strength configuration, enabling signal integrity optimization that would require multiple discrete resistors and buffers otherwise. For designs needing dynamic remapping or error recovery logic, this reconfigurability offers robustness unattainable with static gate arrays.
How does the moisture sensitivity level (MSL) rating of 3 for the LCMXO2-7000HC-5FG484C influence handling procedures during reflow soldering in mass production?
With an MSL3 classification indicating stability beyond 168 hours after opening, the LCMXO2-7000HC-5FG484C can withstand standard lead-free reflow profiles provided floor time remains under five days under typical workshop humidity. Manufacturers must follow IPC/JEDEC J-STD-033 guidelines for bake-out cycles if shelf life exceeds thresholds, especially in humid climates. Failure to adhere may result in popcorn cracking during thermal stress, leading to latent reliability failures post-assembly.
Can the LCMXO2-7000HC-5FG484C support simultaneous use of both LVCMOS and LVDS I/O standards, and what trade-offs exist in pin allocation?
Yes, the device includes dedicated differential receiver pairs capable of LVDS input, while most pins support LVCMOS output down to 1.2V. However, only specific I/O banks contain transceivers qualified for LVDS; mixing protocols across these banks may require level shifting. Designers should reserve LVDS-capable pins for critical serial links and allocate remaining 334 I/Os primarily for single-ended signaling, avoiding cross-bank routing penalties that increase skew in high-speed parallel interfaces.
How does the base product number LCMXO2-7000 relate to other variants like the LCMXO2-7000HE, and what functional differences justify choosing the HC version over alternatives?
Both share identical logic capacity (6864 LEs, 858 LABs) but differ in speed grade and power characteristics. The “HC” suffix denotes higher clock frequency capability (-5 speed grade) compared to “HE,” which trades speed for lower quiescent current. For applications prioritizing fast response over energy efficiency—such as real-time motor control or industrial sensor fusion—the HC variant enables tighter timing margins, albeit at slightly elevated standby consumption. Always verify target frequency against the datasheet’s AC specifications before selection.
What considerations apply when designing PCB layout for the 484-FBGA package of the LCMXO2-7000HC-5FG484C to meet signal integrity requirements for its 334 I/Os?
Given the 23x23 mm ball grid array with 0.8mm pitch, controlled impedance routing demands careful stackup definition—typically 6-layer with inner power/ground planes—to maintain consistent trace characteristics across all 334 pins. Decoupling capacitors must be placed within 1mm of VCC/VSS balls using low-inductance packages like 0201. Thermal vias under the array aid heat dissipation but must not compromise impedance matching on adjacent signal layers, particularly for high-speed I/Os operating above 100 MHz.
How does the internal RAM bit count (245760 bits) in the LCMXO2-7000HC-5FG484C constrain block memory usage in applications requiring deep FIFO buffers or lookup tables?
This equates to roughly 30 KB of distributed or embedded SRAM, usable as block RAM configured via HDL. A single dual-port 1K x 16 FIFO consumes ~32 KB, leaving limited headroom for additional structures. Designers must optimize memory partitioning: using smaller, pipelined buffers instead of monolithic deep queues reduces resource contention. Alternatively, offload bulk storage to external SPI NOR flashes compliant with the device’s configuration interface, reserving on-chip RAM for latency-sensitive buffering.
What role does the RoHS3 compliance status play in global market deployment of products utilizing the LCMXO2-7000HC-5FG484C?
RoHS3 certification confirms adherence to EU Directive 2015/863, restricting four hazardous substances plus four newly added phthalates. This ensures compatibility with international manufacturing regulations, including China’s GB standards and California’s Proposition 65, simplifying supply chain documentation. While not altering electrical behavior, it eliminates legal risks in consumer electronics markets and aligns with sustainability mandates increasingly adopted by industrial OEMs.
How does the ECCN classification (3A991D) affect export controls for the LCMXO2-7000HC-5FG484C when sourcing from U.S.-origin manufacturers?
ECCN 3A991D places this programmable logic device under “specially designed” category with no automatic license exception for military end-uses. Exporters must classify final application purpose; commercial-grade designs may qualify for License Exception LVS, but dual-use or defense-integrated systems require formal BIS review. Accurate technical documentation detailing logic function and absence of cryptographic features helps justify commodity treatment, reducing regulatory overhead.
What are the implications of the 0°C to 85°C junction temperature range for industrial automation designs using the LCMXO2-7000HC-5FG484C?
This commercial-grade thermal envelope assumes adequate airflow or conduction cooling in sealed enclosures. In high ambient environments (>70°C chassis temperature), derating clock speeds by 10–15% improves reliability margin. Without active cooling, prolonged operation near 85°C accelerates electromigration in bond wires, potentially shortening mean time between failures. Designers should simulate thermal gradients using IBIS models and validate with worst-case assembly configurations before production release.

Parts with Similar Specifications

The three parts on the right have similar specifications to Lattice Semiconductor Corporation LCMXO2-7000HC-5FG484C

Product Attribute LCMXO2-7000HC-5FG484I LCMXO2-7000HC-4FG484I LCMXO2-7000HC-5TG144C LCMXO2-7000HC-4TG144C
Part Number LCMXO2-7000HC-5FG484I LCMXO2-7000HC-4FG484I LCMXO2-7000HC-5TG144C LCMXO2-7000HC-4TG144C
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Number of I/O - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of LABs/CLBs - - - -
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Total RAM Bits - - - -
Number of Logic Elements/Cells - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Voltage - Supply - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

LCMXO2-7000HC-5FG484C Datasheet PDF

Download LCMXO2-7000HC-5FG484C pdf datasheets and Lattice Semiconductor Corporation documentation for LCMXO2-7000HC-5FG484C - Lattice Semiconductor Corporation.

Datasheets
MachXO2 Family Datasheet.pdf
Getting Started Guide
Product Selector Guide.pdf
PCN Other
I2C Read-Back Failure Feb/2015.pdf
PCN Design/Specification
Datasheet Chg 21/Mar/2016.pdf MachXO2 Family Datasheet 30/Sep/2013.pdf
PCN Packaging
All Dev Pkg Mark Chg 12/Nov/2018.pdf
PCN Assembly/Origin
Alternate Qualified Test Site 30/Sep/2013.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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LCMXO2-7000HC-5FG484C Image

LCMXO2-7000HC-5FG484C

Lattice Semiconductor Corporation
98D-LCMXO2-7000HC-5FG484C

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