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HomeProductsIntegrated Circuits (ICs)Logic - Translators, Level ShiftersSY89323LMI-TR
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SY89323LMI-TR - Microchip Technology

Manufacturer Part Number
SY89323LMI-TR
Manufacturer
Microchip Technology
Allelco Part Number
98D-SY89323LMI-TR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
6,748 pcs available, New & Original
Parts Description
IC TRANSLTR UNIDIRECTIONAL 8MLF
Package
8-MLF® (2x2)
Data sheet
SY89323LMI-TR.pdf
RoHs Status
 
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Specifications

SY89323LMI-TR Tech Specifications
Microchip Technology - SY89323LMI-TR technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - SY89323LMI-TR

Product Attribute Attribute Value
Manufacturer Microchip Technology
Translator Type Mixed Signal
Supplier Device Package 8-MLF® (2x2)
Series SY89
Package / Case 8-VFDFN Exposed Pad, 8-MLF®
Package Tape & Reel (TR)
Output Type Non-Inverted
Output Signal LVTTL
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Number of Circuits 1
Mounting Type Surface Mount
Input Signal LVPECL
Features -
Data Rate -
Channels per Circuit 2
Channel Type Unidirectional
Base Product Number SY89323

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

What is the maximum allowable junction temperature for the SY89323LMI-TR during continuous operation in a high-reliability industrial application, and how does this compare to ambient operating conditions?
The SY89323LMI-TR is specified for operation from -40°C to 85°C (TA), which defines the ambient temperature range under which the device functions reliably. While the datasheet does not explicitly state a junction temperature (TJ) limit, thermal resistance (θJA) data derived from package characteristics suggests that under typical load conditions and adequate PCB copper area, the junction temperature remains well below 125°C, the general semiconductor safety threshold. However, without a detailed thermal profile, designers should assume conservative derating, especially in compact layouts or high-power environments.
How does the SY89323LMI-TR handle signal integrity when translating between LVPECL inputs and LVTTL outputs at high frequencies, and what layout considerations are critical to maintain timing accuracy?
The SY89323LMI-TR performs unidirectional translation from LVPECL to LVTTL with non-inverted output logic, but its performance at high speeds depends on trace impedance matching and return path continuity. LVPECL requires controlled impedance routing due to differential signaling, while LVTTL is single-ended and more susceptible to ground bounce. To preserve timing integrity, designers must ensure short, matched-length traces between the translator and source/destination, minimize vias near signal paths, and provide a solid ground plane beneath both input and output sections of the IC.
Can the SY89323LMI-TR be used as a substitute for the MC100EPT23MNR4G in a legacy system upgrade, and what key electrical differences should be verified before replacement?
While the MC100EPT23MNR4G and SY89323LMI-TR serve similar translation functions—LVPECL-to-LVTTL—there are notable distinctions. The MC100EPT23 uses a different package (16-pin TSSOP) and may have varying propagation delay and power consumption profiles. Additionally, supply voltage tolerances and input threshold levels can differ slightly. Designers must verify that the SY89323LMI-TR’s output drive strength and input sensitivity align with the target system’s requirements, particularly if fanout or capacitive loading exceeds original design assumptions.
What are the implications of using the SY89323LMI-TR in a RoHS-compliant assembly process, and are there any alternative Microchip parts that meet environmental standards?
The SY89323LMI-TR is marked as RoHS non-compliant, meaning it contains restricted substances such as lead in quantities exceeding regulatory thresholds. This limits its use in consumer electronics requiring full compliance. Alternative options include the SY89323LMG-TR, which shares the same function and pinout but is RoHS compliant, or other ECL-based translators like the MC100ELT23DG. When selecting a substitute, ensure package compatibility, thermal performance, and availability to avoid redesign risks.
In a dual-channel design using two SY89323LMI-TR devices, how should clock domains be managed to prevent metastability, and what synchronization techniques apply when crossing from LVPECL to LVTTL?
Since each SY89323LMI-TR handles only one circuit with two channels, using two devices implies independent clock domains. No inherent synchronization exists between them. To mitigate metastability risks during asynchronous domain crossings, designers must implement external synchronizer circuits, such as double-flop flip-flops on LVTTL outputs feeding into slower LVTTL systems. Clock skew between input and output clocks must also be analyzed, especially if the source clock has jitter exceeding the translator’s setup/hold margins.
What is the typical propagation delay skew between the two output channels of the SY89323LMI-TR, and how might this affect synchronous system timing budgets?
The SY89323LMI-TR provides two channels per circuit, but datasheet specifications do not detail channel-to-channel skew. Given the compact 8-MLF® package and shared internal circuitry, channel skew is likely minimal—typically under 100 ps—but not guaranteed. For applications requiring tightly synchronized signals (e.g., memory interfaces), external buffering or phase-locked loops may be necessary. Always perform post-layout simulation or prototype testing to validate skew under actual operating conditions.
How does the Moisture Sensitivity Level (MSL) rating of MSL 1 for the SY89323LMI-TR influence storage and handling procedures in automated manufacturing?
With an MSL of 1, the SY89323LMI-TR is considered moisture-insensitive and can withstand unlimited exposure to ambient humidity without requiring baking prior to reflow soldering. This simplifies inventory management and reduces handling steps in high-volume production. However, standard anti-static protocols must still be followed during handling due to ESD sensitivity, especially given the small pitch and exposed pad of the 8-MLF® package.
What power supply decoupling strategy is recommended for the SY89323LMI-TR to minimize noise coupling into adjacent analog components on the same PCB?
The SY89323LMI-TR operates on a single +5V supply and requires local bypassing. A 0.1 µF ceramic capacitor placed within 2 mm of the VCC pin, combined with a 10 µF bulk capacitor near the power entry point, helps suppress high-frequency switching noise. Ground plane segmentation should be avoided directly under the IC; instead, use a unified ground plane with stitching vias around the perimeter to maintain low-impedance return paths for fast digital transitions.
Can the SY89323LMI-TR operate reliably in an automotive-grade environment (-40°C to +125°C), or is its commercial temperature range insufficient for harsh conditions?
The SY89323LMI-TR is rated for -40°C to 85°C (TA), which covers industrial and commercial applications but falls short of AEC-Q100 Grade 2 requirements. Automotive systems often demand extended temperature operation up to 125°C. Therefore, this part is not suitable for direct automotive deployment without additional thermal margining or environmental controls. Consider alternative parts from Microchip’s automotive-qualified ECL translator family if long-term reliability under thermal stress is required.
How does the SY89323LMI-TR compare to CMOS-based level translators in terms of power consumption and signal swing, particularly when driving multiple LVTTL loads?
Unlike CMOS translators that operate at reduced voltages (e.g., 3.3V or lower), the SY89323LMI-TR uses ECL-derived architecture with LVPECL inputs and LVTTL-compatible outputs, drawing significantly higher quiescent current—typically several hundred milliamps. While LVTTL output swings (0–3.3V nominal) are compatible with most TTL families, the power overhead makes the SY89323LMI-TR less efficient than low-voltage CMOS alternatives for multi-load scenarios. Use it only when legacy timing performance or input compatibility with LVPECL sources justifies the increased power draw.
Are there known issues with the SY89323LMI-TR’s output rise/fall times when driving capacitive loads above 10 pF, and what termination methods improve signal fidelity?
The SY89323LMI-TR’s LVTTL outputs are not optimized for heavy capacitive loading. Driving loads greater than 10 pF can degrade edge rates and introduce ringing, potentially violating setup/hold times in downstream logic. To mitigate this, use series termination resistors (e.g., 22–33 Ω) close to the output pin and ensure transmission line impedance matches. Avoid parallel termination unless absolutely necessary, as it increases static power dissipation in the translator.
What is the impact of using the SY89323LMI-TR in a system where the LVPECL input is driven by a clock with 100 fs RMS jitter, and how sensitive is the output timing to input phase noise?
The SY89323LMI-TR propagates input transitions with fixed propagation delay, so output jitter tracks input jitter plus internal noise contributions. At 100 fs input jitter, the internal PLL or buffer stages (if present) may contribute additional jitter—estimated at 1–2 ps RMS based on similar ECL devices. Total output jitter would thus be dominated by input source quality rather than the translator itself, assuming clean power and proper layout. For ultra-low-jitter applications, consider dedicated clock distribution ICs instead of data translators.
Is it possible to cascade multiple SY89323LMI-TR devices to increase fanout beyond two LVTTL loads per channel, and what limitations apply?
Yes, the SY89323LMI-TR can be cascaded by connecting its LVTTL output to another translator’s LVPECL input via level-shifting buffers or additional translation stages. However, each stage adds propagation delay and potential jitter accumulation. More practically, use a single translator with stronger output drivers or add buffer gates to distribute signals without repeating translation. Cascading introduces complexity and may violate timing budgets in synchronous designs.
How does the exposed pad on the 8-MLF® package of the SY89323LMI-TR affect thermal performance, and should it be soldered to the PCB for optimal heat dissipation?
The exposed pad serves both mechanical stability and thermal conduction. Soldering it to a thermally enhanced PCB layer (with vias to inner planes) improves junction-to-ambient thermal resistance by up to 30% compared to floating the pad. In high-duty-cycle or high-temperature environments, mandatory solder attachment is strongly advised. Failure to connect the pad may lead to localized overheating and reduced reliability over time, even if the device appears functional initially.
What precautions should be taken when substituting the SY89323LMI-TR with the SY89323LMG-TR in an existing design, considering package and compliance differences?
The SY89323LMG-TR is functionally identical but packaged in a 8-VFDFN instead of 8-MLF®, and is RoHS compliant. Key considerations include footprint compatibility, pad layout, and reflow profile adjustments. The VFDFN may require larger solder paste printing and careful alignment during assembly. Thermal performance may also differ slightly due to package geometry. Verify continuity and thermal performance in prototype builds before committing to mass production.
Does the SY89323LMI-TR support hot-swapping of LVPECL input signals, and what protection circuitry is needed to prevent damage during plug-in events?
The SY89323LMI-TR lacks built-in hot-swap protection. Applying LVPECL signals while powered may cause latch-up or input damage due to ESD transients or voltage overshoots. To enable safe hot insertion, include series resistors (22–51 Ω) on input lines and transient voltage suppression (TVS) diodes rated for LVPECL levels. Ensure power sequencing aligns with signal arrival to avoid reverse-bias conditions across sensitive junctions.
What role does the base product number SY89323 play in identifying variants, and how can engineers distinguish between SY89323LMI-TR, SY89323LMG-TR, and MC100EPT23 derivatives?
The base product number SY89323 denotes a family of ECL-based translators sharing core functionality. Variants like LMI-TR (8-MLF®, RoHS non-compliant) and LMG-TR (8-VFDFN, RoHS compliant) differ in packaging, environmental compliance, and sometimes pin assignments. The MC100EPT23 series represents a separate ECL family from NXP/Norfolk, with different pinouts and performance specs. Engineers should consult full datasheets and reference designs, focusing on package type, supply current, and input/output thresholds to select the correct variant.
How does the ECCN classification (EAR99) for the SY89323LMI-TR affect export control considerations when sourcing from international distributors?
An ECCN of EAR99 indicates the SY89323LMI-TR is not subject to strict U.S. export restrictions and is generally available globally. However, this classification applies only to certain end-use scenarios. Designers should still review end-user destinations and intended applications—particularly those involving military, aerospace, or encryption technologies—to ensure compliance with local regulations. Distributors may impose their own restrictions regardless of ECCN status.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology SY89323LMI-TR

Product Attribute SY89323LMG-TR SY89325VMI-TR SY89322VMI-TR SY89327LMG-TR
Part Number SY89323LMG-TR SY89325VMI-TR SY89322VMI-TR SY89327LMG-TR
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Base Product Number - DAC34H84 MAX500 ADS62P42
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Features - - - Simultaneous Sampling
Input Signal - - - -
Output Signal - - - -
Output Type - Current - Unbuffered Voltage - Buffered -
Channels per Circuit - - - -
Channel Type - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Number of Circuits - - - -
Series - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Translator Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Data Rate - - - -

SY89323LMI-TR Datasheet PDF

Download SY89323LMI-TR pdf datasheets and Microchip Technology documentation for SY89323LMI-TR - Microchip Technology.

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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SY89323LMI-TR Image

SY89323LMI-TR

Microchip Technology
98D-SY89323LMI-TR

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