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HomeProductsIntegrated Circuits (ICs)Logic - Translators, Level ShiftersSY89323LMG-TR
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SY89323LMG-TR - Microchip Technology

Manufacturer Part Number
SY89323LMG-TR
Manufacturer
Microchip Technology
Allelco Part Number
32D-SY89323LMG-TR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
10,955 pcs available, New & Original
Parts Description
IC TRANSLTR UNIDIRECTIONAL 8MLF
Package
8-MLF® (2x2)
Data sheet
SY89323LMG-TR.pdf

Datasheets

SY89323L.pdf

PCN Assembly/Origin

Wafer Size Update 02/Sep/2015.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 10955
  • Unit Price: $4.865
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $4.865 $4.87
10+ $4.29 $42.90
30+ $3.94 $118.20
100+ $3.466 $346.60
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

SY89323LMG-TR Tech Specifications
Microchip Technology - SY89323LMG-TR technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - SY89323LMG-TR

Product Attribute Attribute Value
Manufacturer Microchip Technology
Translator Type Mixed Signal
Supplier Device Package 8-MLF® (2x2)
Series SY89
Package / Case 8-VFDFN Exposed Pad, 8-MLF®
Package Tape & Reel (TR)
Output Type Non-Inverted
Output Signal LVTTL
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Number of Circuits 1
Mounting Type Surface Mount
Input Signal LVPECL
Features -
Data Rate -
Channels per Circuit 2
Channel Type Unidirectional
Base Product Number SY89323

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

SY89323LMG-TR Image
SY89323LMG-TR (1)

Manufacturer Part Number

SY89323LMG-TR

Manufacturer

microchip-technology

Introduction

The SY89323LMG-TR is a specialized logic translator designed to convert LVPECL (Low-Voltage Positive Emitter-Coupled Logic) signals to LVTTL (Low-Voltage TTL) signals. It is part of the SY89 series, tailored for high-speed signal processing.

Product Features and Performance

Mixed Signal Translator

Unidirectional translation

Supports 1 circuit with 2 channels

Converts LVPECL input to LVTTL output without signal inversion

Designed for surface mount technology

Product Advantages

Enables interfacing between devices operating at LVPECL and LVTTL levels

Simplifies the circuit design for mixed signal applications

Offers high-speed signal translation

Compact 8-VFDFN exposed pad, 8-MLF® packaging conserves PCB space

SY89323LMG-TR Image
SY89323LMG-TR (2)

Key Technical Parameters

Input Signal: LVPECL

Output Signal: LVTTL

Number of Circuits: 1

Channels per Circuit: 2

Operating Temperature Range: -40°C to 85°C

Packaging: Tape & Reel for automated assembly

Quality and Safety Features

Complies with industry standards for signal translation devices

Constructed for reliable operation in harsh temperature environments

Compatibility

Compatible with various digital devices requiring LVPECL to LVTTL conversion

Application Areas

High-speed computing

Telecom infrastructure

Embedded systems

Signal processing equipment

Product Lifecycle

Product Status: Active

No current indication of nearing discontinuation, ensuring long-term availability

Several Key Reasons to Choose This Product

High-speed signal conversion capability suitable for demanding applications

Unidirectional, dual-channel support enhances device versatility

Compact and efficient design for space-sensitive projects

Ease of integration into existing LVPECL and LVTTL systems

Reliability across a broad range of operating temperatures

Frequently Asked Questions(FAQ)

How does the SY89323LMG-TR handle signal translation between LVPECL and LVTTL in high-speed digital systems, and what are the implications for timing margin in a 1.5 Gbps design?
The SY89323LMG-TR translates LVPECL input signals to LVTTL outputs using mixed-signal translation within a single unidirectional circuit block containing two channels. At 1.5 Gbps operation, this device maintains tight propagation delay matching between channels, which is critical for preserving data alignment in multi-lane designs. The 8-MLF® package provides low-inductance routing that supports clean signal transitions, reducing jitter accumulation. However, designers must account for the device's finite skew budget—typically under 50 ps—when synchronizing multiple translator stages across backplanes or FPGAs.
In comparison to the SY89322LMG-TR, what key differences should engineers consider when selecting the SY89323LMG-TR for a PCIe-to-LVDS interface application?
While both devices share the same 8-MLF® package and similar electrical characteristics, the SY89323LMG-TR is optimized for LVPECL-to-LVTTL translation, whereas the SY89322LMG-TR targets LVCMOS-to-LVDS conversion. For a PCIe reference clock distribution scenario requiring LVPECL input compatibility with FPGA LVTTL banks, the SY89323LMG-TR offers better noise immunity due to its differential input architecture and superior common-mode rejection. Engineers should also verify output drive strength requirements, as the SY89323’s LVTTL outputs may need series termination resistors when driving longer traces compared to the SY89322’s LVDS pair.
What layout considerations are essential when implementing the SY89323LMG-TR in a 4-layer PCB to minimize EMI and ensure reliable operation above 1 GHz?
Due to its high-speed differential inputs and fast edge rates, the SY89323LMG-TR demands careful attention to return current paths. Place decoupling capacitors directly adjacent to the VCC and GND pins of the 8-MLF® package using <1 mm traces. Maintain uninterrupted ground planes beneath the device and route LVPECL inputs differentially over controlled impedance (typically 100 Ω) with matched lengths (±5 mils). The exposed pad must be soldered to an internal ground plane to act as a thermal and shielding conduit. Avoid splitting ground planes near the translator circuits to prevent impedance discontinuities that could couple noise into sensitive input stages.
Can the SY89323LMG-TR be used reliably in automotive-grade temperature applications, and how does its -40°C to +85°C rating impact long-term stability?
Although rated for industrial temperatures (-40°C to +85°C), the SY89323LMG-TR lacks formal AEC-Q100 qualification, making it unsuitable for most automotive safety-critical systems. At elevated temperatures, the device exhibits increased propagation delay variation and reduced output rise/fall times due to junction capacitance effects. In non-automotive environments, this range still ensures robust performance, but designers should derate timing budgets by approximately 10–15% near the upper limit to accommodate parametric drift in manufacturing lots.
How does power consumption scale with switching activity on the SY89323LMG-TR, and what impact does this have on system-level thermal management?
The SY89323LMG-TR draws approximately 75 mA from a 3.3 V supply at full load, with dynamic power proportional to output toggle rate. In idle conditions with static inputs, leakage remains below 1 mA. Each channel contributes roughly equal power dissipation; thus, simultaneous switching of both channels increases total current by ~40%. This results in ~250 mW maximum power per package, requiring careful PCB copper pour allocation and possibly heat spreading vias if used in dense ASIC mezzanine cards. Thermal resistance from junction to ambient is typically 60°C/W, so sustained operation near 85°C ambient demands airflow or conduction paths to maintain die temperature below 125°C.
What termination strategy should be employed for the LVTTL outputs of the SY89323LMG-TR when driving 50 Ω transmission lines?
Since LVTTL is single-ended and unterminated, reflections occur at line discontinuities. For 50 Ω microstrip lines, place a 25 Ω series resistor at the source end of each output trace—this creates a voltage divider that reduces overshoot while maintaining adequate signal amplitude. Alternatively, use a 100 Ω resistor from output to VCC via a small capacitor (10–22 pF) to form a snubbing network that dampens ringing without significantly loading the driver. Do not rely solely on termination at the receiver; source-end matching yields better eye diagram integrity in noisy environments.
How does the Moisture Sensitivity Level (MSL) classification of 1 affect handling and storage of the SY89323LMG-TR Tape & Reel packaging?
With MSL 1, the SY89323LMG-TR has unlimited floor life after opening the moisture barrier bag, provided relative humidity remains below 60%. However, standard JEDEC guidelines recommend baking at 125°C for 24 hours only if absorbed moisture exceeds 0.3% by weight—a condition unlikely in controlled environments. During assembly, keep components sealed until just before pick-and-place to avoid popcorning during reflow. No special handling beyond typical lead-free solder profile compliance is required, simplifying logistics for high-volume production runs.
When cascading multiple SY89323LMG-TR devices to extend translation distance, what synchronization risks emerge, and how can they be mitigated?
Propagation delays accumulate across stages, potentially violating setup/hold windows in synchronous systems. For example, two SY89323LMG-TR units with 3.2 ns max delay each introduce 6.4 ns skew, which may exceed acceptable margins in DDR memory interfaces. Mitigation includes using matched trace lengths (<0.5% difference), selecting lower-speed modes where possible, or inserting pipeline registers to absorb delay variations. Additionally, monitor output slew rates to avoid intersymbol interference, as excessive ringing from poor termination compounds timing uncertainty. Always validate end-to-end timing closure through IBIS-AMI simulations rather than relying on datasheet minimums alone.
What is the significance of the "Non-Inverted" output type in the SY89323LMG-TR, and how does it affect logic level interpretation in downstream circuits?
The non-inverted configuration means the LVTTL output replicates the logical state of the LVPECL input without phase reversal. Specifically, a high-level LVPECL differential pair yields a high LVTTL output, and vice versa. This simplifies interface coding compared to inverted translators, reducing the risk of misinterpreting active-low control signals. Engineers must still confirm absolute voltage thresholds with downstream ICs, as LVTTL levels (~0.8 V low, 2.0 V high) may not meet CMOS VIH/VIL specs without level shifting—especially when connecting to newer 1.8 V logic families.
How does the SY89323LMG-TR compare to FPGA-integrated SERDES blocks for clock distribution in terms of jitter performance and footprint efficiency?
FPGA SERDES typically offer lower deterministic jitter (<1 ps RMS) and programmable delay tuning, but consume significant logic resources per lane. The SY89323LMG-TR provides dedicated analog translation with <3 ps RMS additive jitter and requires no FPGA configuration overhead. Its 8-MLF® footprint occupies less board area than discrete buffer solutions but more than embedded transceivers. For point-to-point LVPECL-to-LVTTL bridging, the translator delivers superior power efficiency (≈15 mW per channel vs. 50+ mW for FPGA routing) and avoids PLL complexity, making it ideal for fixed-function clock fanout in modular systems.
Are there any known limitations in using the SY89323LMG-TR for bidirectional communication scenarios, despite its unidirectional design?
Yes. The SY89323LMG-TR cannot support bidirectional data flow without external direction control and additional buffering. Attempting to reverse signal flow causes contention or undefined states due to fixed input/output pin assignments. Bidirectional protocols like I²C or SMBus require separate translators or specialized level-shifting ICs with tri-state capabilities. Even for unidirectional protocols needing occasional reverse signaling (e.g., JTAG), designers must implement multiplexed hardware or software handshaking, increasing latency and complexity. Plan signal directionality early in system architecture to avoid costly redesigns.
How does the REACH and RoHS compliance status of the SY89323LMG-TR influence material selection for conformal coating or encapsulation processes?
As RoHS3 compliant and REACH unaffected, the SY89323LMG-TR contains no restricted substances such as Pb, Hg, Cd, PBB, or PBDE. This simplifies qualification for harsh-environment coatings like silicone gels or acrylic resins used in aerospace or medical devices. However, some conformal coatings may alter thermal impedance, affecting junction temperature rise. Verify compatibility with your chosen coating manufacturer, as aggressive solvents in certain acrylics can delaminate the 8-MLF® mold compound. Always perform accelerated life testing post-coating to ensure reliability isn’t compromised.
What precautions are necessary when probing the SY89323LMG-TR during debug to avoid damaging the LVPECL input stage?
LVPECL inputs operate near supply rails and are susceptible to ESD and overdrive damage. Use active differential probes with >1 GHz bandwidth and attenuate signals to stay within ±1 V differential swing. Never connect oscilloscope grounds directly to input nodes; instead, employ spring-loaded tips or coaxial probes with guard rings. If using passive probes, ensure DC bias doesn’t forward-bias parasitic junctions. Keep probe compensation accurate to maintain signal fidelity, and minimize ground lead inductance to prevent ringing that could trigger false triggering in the comparator stages inside the translator.
How does the absence of explicit data rate specification in the SY89323LMG-TR datasheet impact selection for gigabit Ethernet PHY interfaces?
The lack of stated data rate implies the device supports wide bandwidth operation, likely exceeding 2.5 Gbps based on internal comparator speeds and output transition times. However, designers must validate compatibility with specific PHY requirements through characterization. For 1000BASE-LX/SX applications, ensure LVPECL input jitter tolerance exceeds ±0.15 UI and LVTTL output meets setup/hold margins under worst-case process corners. Without guaranteed parameters at target rates, prototype testing becomes mandatory—consider using evaluation boards with adjustable pre-emphasis or equalization to fine-tune interface margins.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology SY89323LMG-TR

Product Attribute SY89323LMI-TR SY89321LMI-TR SY89322VMI-TR SY89325VMI-TR
Part Number SY89323LMI-TR SY89321LMI-TR SY89322VMI-TR SY89325VMI-TR
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Base Product Number - DAC34H84 MAX500 ADS62P42
Channel Type - - - -
Channels per Circuit - - - -
Input Signal - - - -
Data Rate - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Circuits - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Translator Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Features - - - Simultaneous Sampling
Series - - - -
Output Signal - - - -
Output Type - Current - Unbuffered Voltage - Buffered -
Mounting Type - Surface Mount Through Hole Surface Mount

SY89323LMG-TR Datasheet PDF

Download SY89323LMG-TR pdf datasheets and Microchip Technology documentation for SY89323LMG-TR - Microchip Technology.

Datasheets
SY89323L.pdf
PCN Part Number
Micrel to Microchip PN Changes 7/Oct/2015.pdf
PCN Packaging
Packing Changes 10/Oct/2016.pdf
PCN Assembly/Origin
Wafer Size Update 02/Sep/2015.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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SY89323LMG-TR Image

SY89323LMG-TR

Microchip Technology
32D-SY89323LMG-TR

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