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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~STM32F733ZEI6~~

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STM32F733ZEI6 - STMicroelectronics

Manufacturer Part Number: STM32F733ZEI6

Manufacturer: STMicroelectronics

Allelco Part Number: 98D-STM32F733ZEI6

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 47,357 pcs available, New & Original

Parts Description: IC MCU 32BIT 512KB FLSH 144UFBGA

Package: 144-UFBGA (7x7)

Data sheet: STM32F733ZEI6.pdf

PCN Packaging
2.73KHz.pdf

PCN Assembly/Origin
2.73KHz.pdf

HTML Datasheet
STM32F7 Series Brochure.pdf

RoHs Status: ROHS3 Compliant

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In stock: 47357

Unit Price: $11.049
Subtotal: $0.00

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Quantity	Unit Price	Ext. Price
1+	$11.049	$11.05

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Specifications

STM32F733ZEI6 Tech Specifications
STMicroelectronics - STM32F733ZEI6 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - STM32F733ZEI6

Product Attribute	Attribute Value
Manufacturer	STMicroelectronics
Voltage - Supply (Vcc/Vdd)	1.7V ~ 3.6V
Supplier Device Package	144-UFBGA (7x7)
Speed	216MHz
Series	STM32F7
RAM Size	256K x 8
Program Memory Type	FLASH
Program Memory Size	512KB (512K x 8)
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Package / Case	144-UFBGA
Package	Tray

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Number of I/O	112
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	A/D 16x12b; D/A 2x12b
Core Size	32-Bit Single-Core
Core Processor	ARM® Cortex®-M7
Connectivity	CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, UART/USART, USB
Base Product Number	STM32F733

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	5A992C
HTSUS	8542.31.0001

Frequently Asked Questions(FAQ)

How does the STM32F733ZEI6 compare to other STM32F7 series microcontrollers in terms of clock speed and memory capacity, and what design implications does this have for real-time processing applications?: The STM32F733ZEI6 operates at a maximum frequency of 216MHz with 512KB of embedded Flash memory and 256KB of RAM. This places it above mid-range variants like the STM32F723RE, which typically offers up to 200MHz and 512KB Flash, but below high-performance models such as the STM32F746ZG that can reach 216MHz with up to 1MB Flash. For time-critical control loops or DSP-heavy tasks, the 216MHz core enables execution of complex algorithms within tight deadlines—critical for motor control or audio processing. However, designers must ensure sufficient RAM allocation when leveraging the Cortex-M7’s dual-issue pipeline, as memory bandwidth becomes a bottleneck if peripherals like QSPI or SAI access data faster than the CPU can process it.

What are the key trade-offs when selecting the STM32F733ZEI6 over an STM32H7 series part for a cost-sensitive industrial automation application requiring CANbus and USB connectivity?: While both families use ARM Cortex-M7 cores, the STM32F733ZEI6 lacks some advanced features found in the STM32H7, such as higher-speed SRAM (up to 1MB vs. 256KB), floating-point unit enhancements, and support for larger external memories. The H7 series also supports operation at higher frequencies (up to 480MHz) and includes additional power management modes tailored for ultra-low-power applications. Choosing the F733ZEI6 reduces bill-of-materials cost and simplifies PCB layout due to its smaller package and lower pin count, making it suitable for space-constrained systems where moderate performance suffices. However, if future scalability or higher data throughput is anticipated, migrating to the H7 may be justified despite increased complexity and power consumption.

Can the STM32F733ZEI6 reliably interface with SD cards using MMC/SD peripheral mode, and what configuration considerations are necessary to ensure stable data transfer rates?: Yes, the STM32F733ZEI6 supports MMC/SD communication via its dedicated MMC/SD interface, enabling full-speed SD card access up to 50MHz clock rates. To achieve stable transfers, designers should implement proper pull-up resistors on DAT0–DAT3 and CMD lines, adhere to timing constraints defined in the reference manual, and configure DMA to offload the CPU from handling block transactions. Using 3.3V signaling levels is essential, and firmware must handle initialization sequences compliant with SDHC/SDXC standards. Performance drops may occur if the system runs at reduced core speeds or insufficiently sized buffers are used, particularly during write operations under heavy peripheral load.

How does the internal oscillator accuracy of the STM32F733ZEI6 impact system timing in precision sensor fusion applications, and are external crystals required for reliable operation?: The STM32F733ZEI6 includes an internal 16MHz RC oscillator with typical accuracy of ±2% across temperature and voltage variations. For most general-purpose applications, this suffices, but in precision sensor fusion involving IMUs or time-stamped data acquisition, such drift can introduce timing errors exceeding acceptable thresholds. In these cases, an external 8–26MHz crystal with matched load capacitors provides better stability (<±10ppm), ensuring synchronized sampling across multiple sensors. Designers should also enable the RTC backup domain with LSE crystal for sub-ppm accuracy in timestamping events, even if the main system clock remains derived from the internal oscillator.

What are the thermal implications of running the STM32F733ZEI6 continuously at 216MHz in a sealed enclosure with limited convection cooling?: At full operational frequency with typical firmware loads, the STM32F733ZEI6 consumes approximately 50–70mA from a 3.3V supply, resulting in power dissipation around 0.2–0.3W. In a poorly ventilated environment, cumulative heat buildup can raise junction temperature beyond the specified maximum of 85°C. Although the device includes thermal shutdown protection, sustained overheating may degrade reliability or trigger unintended resets. Engineers should simulate worst-case current draw using actual code profiles and consider adding copper pour under the UFBGA package, though note that BGA rework without reflow equipment complicates thermal management during prototyping. Derating the clock frequency by 10–15% often provides sufficient margin without sacrificing performance.

How does the STM32F733ZEI6 support secure firmware updates over-the-air (OTA) in IoT edge devices, and what hardware-level protections are available to prevent unauthorized code injection?: The STM32F733ZEI6 incorporates built-in security features including read-out protection (RDP), write protection (WRP), and option bytes that define flash sectors as read-only after programming. It also supports cryptographic acceleration via the CRYP peripheral, allowing AES-256 encryption/decryption and hash generation (SHA-1/SHA-2) in hardware. For OTA updates, developers can partition flash into bootloader and application regions, validate incoming firmware signatures using public-key cryptography stored in protected sectors, and enforce rollback prevention through version counters. However, unlike some newer STM32MP1 devices, this MCU does not include tamper detection pins or one-time programmable keys, so physical access remains a risk vector requiring additional system-level mitigations.

When implementing USB OTG functionality with the STM32F733ZEI6, what PCB layout considerations are critical to meet USB 2.0 Full-Speed electrical specifications?: Achieving reliable USB communication demands careful impedance-controlled routing for D+ and D− differential pairs, maintained at 90Ω ±10% with length matching within ±5mm. Minimize stubs and avoid vias near connectors, and place series termination resistors (typically 27Ω) close to the MCU pins. Power integrity is equally vital: provide a solid ground plane, decouple VDD with 100nF ceramic capacitors near each power pin, and ensure VBUS has appropriate filtering. Shielded connectors reduce EMI susceptibility, especially in noisy industrial environments. Failure to comply with these guidelines may result in enumeration failures or intermittent disconnects, particularly when driving capacitive loads like host-mode peripherals or long cables.

How does the DMA controller in the STM32F733ZEI6 facilitate concurrent data movement between peripherals and memory, and what limitations exist when configuring multi-channel transfers?: The STM32F733ZEI6 integrates a 16-channel DMA controller capable of handling simultaneous transfers from SPI, I2C, UART, ADC, and DAC peripherals to/from SRAM or Flash. Each channel supports circular buffering and burst modes, significantly reducing CPU overhead during high-throughput tasks like audio streaming or sensor logging. However, only two DMA controllers (MDMA and TIMx) share access to memory, creating contention if both attempt large transfers simultaneously. Additionally, Flash write cycles are limited (~10k erase/write cycles per sector), so direct DMA writes to Flash require careful wear leveling or buffering in SRAM first. Proper channel prioritization and event synchronization via interrupts or semaphores are essential to avoid buffer overruns or data corruption.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics STM32F733ZEI6

Product Attribute
Part Number	STM32F733IET6	STM32F733VEY6TR	STM32F733VET6	STM32F732ZET6
Manufacturer	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Base Product Number	-	DAC34H84	MAX500	ADS62P42
RAM Size	-	-	-	-
Connectivity	-	-	-	-
Core Processor	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Series	-	-	-	-
Oscillator Type	-	-	-	-
Program Memory Type	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Peripherals	-	-	-	-
Speed	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Core Size	-	-	-	-
EEPROM Size	-	-	-	-
Program Memory Size	-	-	-	-
Number of I/O	-	-	-	-
Data Converters	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount

STM32F733ZEI6 Datasheet PDF

Download STM32F733ZEI6 pdf datasheets and STMicroelectronics documentation for STM32F733ZEI6 - STMicroelectronics.

PCN Packaging: 2.73KHz.pdf
PCN Assembly/Origin: 2.73KHz.pdf
HTML Datasheet: STM32F7 Series Brochure.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
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STM32F733ZEI6

STMicroelectronics
98D-STM32F733ZEI6

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