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HomeProductsIntegrated Circuits (ICs)Embedded - MicroprocessorsOMAPL138EZCED4
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OMAPL138EZCED4 - Texas Instruments

Manufacturer Part Number
OMAPL138EZCED4
Manufacturer
Texas Instruments
Allelco Part Number
32D-OMAPL138EZCED4
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
16,713 pcs available, New & Original
Parts Description
IC MPU OMAP-L1X 456MHZ 361NFBGA
Package
361-NFBGA (13x13)
Data sheet
OMAPL138EZCED4.pdf

PCN Assembly/Origin

Multiple Parts 28/Jul/2022.pdf

PCN Design/Specification

nfBGA 01/Jul/2016.pdf

HTML Datasheet

OMAP-L138 Datasheet.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 16713
  • Unit Price: $21.79
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $21.79 $21.79
30+ $20.91 $627.30
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

OMAPL138EZCED4 Tech Specifications
Texas Instruments - OMAPL138EZCED4 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL138EZCED4

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - I/O 1.8V, 3.3V
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Supplier Device Package 361-NFBGA (13x13)
Speed 456MHz
Series OMAP-L1x
Security Features Boot Security, Cryptography
SATA SATA 3Gbps (1)
RAM Controllers SDRAM
Package / Case 361-LFBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature -40°C ~ 90°C (TJ)
Number of Cores/Bus Width 1 Core, 32-Bit
Mounting Type Surface Mount
Graphics Acceleration No
Ethernet 10/100Mbps (1)
Display & Interface Controllers LCD
Core Processor ARM926EJ-S
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
Base Product Number OMAPL138
Additional Interfaces HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

OMAPL138EZCED4 Image
OMAPL138EZCED4 (1)

Manufacturer Part Number

OMAPL138EZCED4

Manufacturer

Texas Instruments

Introduction

OMAPL138EZCED4 is an embedded microprocessor by Texas Instruments, designed for high-performance signal processing and general-purpose applications.

Product Features and Performance

ARM926EJ-S core processor with a speed of 456MHz

Integrated C674x DSP for advanced signal processing

CP15 system control co-processor

SDRAM memory controller for efficient data management

10/100 Mbps Ethernet for network connectivity

SATA 3Gbps interface for high-speed data transfer

USB 1.1 and USB 2.0 interfaces for peripheral connectivity

Operating temperature range of -40°C to 90°C

Product Advantages

High integration of DSP and ARM processors for diverse applications

Advanced security features including boot security and cryptography

Multiple interfaces including LCD, Ethernet, SATA, and USB for comprehensive connectivity

High-performance processing capability at 456MHz

OMAPL138EZCED4 Image
OMAPL138EZCED4 (2)

Key Technical Parameters

Core: ARM926EJ-S, 32-Bit

Speed: 456MHz

Co-Processors/DSP: C674x, CP15

RAM Controllers: SDRAM

Ethernet: 10/100Mbps

SATA: 3Gbps

USB: Version 1.1 and 2.0

Voltage I/O: 1.8V, 3.3V

Package: 361-LFBGA

Quality and Safety Features

Robust security features for safe operation

Designed to operate within a wide temperature range for reliability in various environments

Compatibility

Supports a variety of interfaces for flexible system design

Compatible with multiple memory types including SDRAM

Application Areas

Industrial control systems

Medical devices

Automotive infotainment

Networking equipment

Digital signal processing

Product Lifecycle

Status: Active

Regularly updated with support and documentation, no immediate discontinuation expected

Several Key Reasons to Choose This Product

High-speed operation with ARM and DSP cores for efficient processing

Flexible connectivity options including Ethernet, SATA, and USB

Advanced security features for secure applications

Wide operating temperature range for reliability in harsh environments

Texas Instruments' reputation for quality and support

Frequently Asked Questions(FAQ)

What are the key differences between the OMAPL138EZCED4 and other processors in the OMAP-L1x series, particularly in terms of core architecture and integrated peripherals?
The OMAPL138EZCED4 features an ARM926EJ-S core operating at 456MHz, which is consistent across the OMAP-L1x family but distinguishes it from higher-performance Cortex-A series devices. While maintaining a similar power profile and package form factor, this device integrates a C674x DSP for signal processing tasks, a feature shared with other L1x variants but absent in earlier ARM-only designs. Its peripheral set includes dual USB ports (1.1 and 2.0), one SATA 3Gbps interface, and a 10/100 Ethernet MAC—configurations that align with industrial control applications but differ from consumer-oriented models lacking SATA or advanced security modules.
How does the voltage domain configuration of the OMAPL138EZCED4 affect system-level power management in embedded designs?
The OMAPL138EZCED4 supports dual I/O voltage levels: 1.8V and 3.3V. This enables flexible interfacing with mixed-voltage legacy systems while reducing power consumption during active operation. In practical implementations, the 1.8V rail typically powers internal logic and high-speed interfaces like USB 2.0 and McASP, whereas 3.3V supports slower peripherals such as UART and I2C. Designers must ensure proper level shifting when connecting to external 5V-only components, increasing BOM cost and board complexity compared to single-voltage solutions.
Can the OMAPL138EZCED4 support real-time audio processing applications using its McBSP and McASP interfaces simultaneously?
Yes, the OMAPL138EZCED4 can concurrently utilize both McBSP and McASP interfaces for multichannel audio streams. The McBSP provides basic TDM support suitable for simple codecs or ADCs/DACs, while the enhanced McASP offers full-duplex, multichannel capabilities with configurable data widths up to 32 bits per channel. For example, in a voice recognition system sampling at 16kHz with eight channels, McASP would be preferred due to its DMA-driven throughput, whereas McBSP suffices for monaural telephony applications requiring lower bandwidth.
What thermal considerations should engineers evaluate when integrating the OMAPL138EZCED4 into compact industrial enclosures?
With a maximum junction temperature of 90°C and a typical power dissipation around 1.2W under full load, the OMAPL138EZCED4 requires careful thermal analysis. In natural convection environments, airflow exceeding 0.5 m/s significantly improves heat transfer. Mounting directly to a 2 oz copper plane with vias to inner layers reduces thermal resistance by approximately 40%. Without heatsinking, sustained operation near 70°C ambient may necessitate clock throttling or peripheral disablement to meet TJmax constraints.
How does the Boot Security and Cryptography feature in the OMAPL138EZCED4 impact firmware deployment in secure edge devices?
The OMAPL138EZCED4 implements secure boot via ROM-based RSA signature verification of initial firmware blocks, preventing unauthorized code execution. This adds ~20ms to boot time compared to unsecured devices and requires provisioning of a unique private key during manufacturing. Engineers must integrate a trusted root certificate into the ROM image and manage key rotation through a hardware security module if post-deployment updates are needed, increasing development overhead versus open-boot architectures.
In what scenarios would the absence of hardware graphics acceleration in the OMAPL138EZCED4 limit application performance despite its 456MHz CPU?
Without dedicated GPU cores, rendering complex UIs or video decoding in software places significant burden on the ARM926EJ-S core. For instance, displaying a 480x272 QVGA LCD at 30fps with alpha-blended widgets consumes over 60% of CPU utilization even on optimized code—making the OMAPL138EZCED4 unsuitable for rich graphical dashboards. Alternatives include offloading to external displays via SPI or using simpler bitmap-based UI frameworks, trading visual fidelity for responsiveness.
How does the Moisture Sensitivity Level (MSL) rating of 3 for the OMAPL138EZCED4 influence assembly process planning?
As an MSL-3 component requiring baking prior to reflow if stored beyond 168 hours above 30°C/60% RH, the OMAPL138EZCED4 mandates adherence to JEDEC J-STD-033 guidelines. Failure to bake increases popcorning risk during soldering, especially given its fine-pitch 361-ball BGA package. Production teams must track storage conditions and schedule rework accordingly, adding logistical steps not required for MSL-1 devices.
What trade-offs exist between using the HPI interface versus SPI for host communication with the OMAPL138EZCED4?
The HPI (Host Port Interface) offers parallel access to internal memory mapped registers at speeds up to 50MB/s, ideal for high-throughput host-DSP collaboration in the OMAPL138EZCED4. However, it consumes additional pins and requires precise timing alignment. In contrast, SPI provides serial connectivity at lower bandwidth (<10MB/s) but simplifies PCB routing and reduces pin count—optimal for low-frequency sensor polling where latency tolerance exceeds 100ms.
Does the presence of CP15 in the OMAPL138EZCED4 enable advanced memory protection features critical for multi-application environments?
Yes, the CP15 co-processor in the OMAPL138EZCED4 supports Memory Management Unit (MMU)-based virtualization, allowing isolation of user/kernel modes and privileged instruction enforcement. For example, in a medical monitoring device running patient data acquisition and display subsystems, MMU configuration can prevent accidental corruption of calibration parameters by misbehaving background tasks—enhancing reliability without requiring external security chips.
How does the SATA 3Gbps interface in the OMAPL138EZCED4 compare functionally to NVMe alternatives in embedded storage applications?
While SATA 3Gbps provides sufficient throughput (~300MB/s burst) for logging or firmware updates in most embedded systems using the OMAPL138EZCED4, it lacks the queue depth and protocol efficiency of NVMe. In continuous data recording scenarios exceeding 150MB/s sustained write rates, SATA becomes bottlenecked by command overhead, whereas NVMe’s PCIe-based architecture would reduce CPU utilization by 30–40%—though requiring a different SoC altogether.
What role does the SDRAM controller play in optimizing memory bandwidth for signal processing workloads on the OMAPL138EZCED4?
The integrated SDRAM controller in the OMAPL138EZCED4 supports burst transfers and page mode operation, enabling efficient streaming of large datasets to the C674x DSP. For instance, processing 1024-point FFTs with double-buffered DMA reduces ARM core intervention by 70%, freeing cycles for task scheduling. However, without ECC support, bit errors in volatile memory could corrupt results—necessitating periodic checksum validation in safety-critical domains.
Is the OMAPL138EZCED4 suitable for battery-powered portable instruments requiring sub-500mW average current?
Under typical loads, the OMAPL138EZCED4 draws ~300mA at 1.8V during active computation, yielding ~540mW—above the target threshold. Although sleep modes reduce consumption to <10mA, wake-up latency (~2ms) limits duty cycling effectiveness. Alternative ultra-low-power MCUs with smaller SRAM footprints might better serve such applications unless the required DSP acceleration justifies the power penalty.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments OMAPL138EZCED4

Product Attribute OMAPL138EZCED4E OMAPL138EZCE4 OMAPL138EZCE3 OMAPL138EZCEA3E
Part Number OMAPL138EZCED4E OMAPL138EZCE4 OMAPL138EZCE3 OMAPL138EZCEA3E
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Speed - - - -
SATA - - - -
Number of Cores/Bus Width - - - -
RAM Controllers - - - -
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Graphics Acceleration - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Additional Interfaces - - - -
USB - - - -
Voltage - I/O - - - -
Security Features - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Ethernet - - - -
Co-Processors/DSP - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Display & Interface Controllers - - - -
Core Processor - - - -

OMAPL138EZCED4 Datasheet PDF

Download OMAPL138EZCED4 pdf datasheets and Texas Instruments documentation for OMAPL138EZCED4 - Texas Instruments.

PCN Packaging
Mult Dev 13/Apr/2020.pdf Mult Dev Rev 27/Apr/2020.pdf
PCN Assembly/Origin
Multiple Parts 28/Jul/2022.pdf
PCN Design/Specification
nfBGA 01/Jul/2016.pdf
HTML Datasheet
OMAP-L138 Datasheet.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
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Electrostatic Discharge Protection and Handling

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OMAPL138EZCED4 Image

OMAPL138EZCED4

Texas Instruments
32D-OMAPL138EZCED4

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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