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HomeProductsIntegrated Circuits (ICs)Embedded - MicroprocessorsOMAPL138EZWT3
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OMAPL138EZWT3 - Texas Instruments

Manufacturer Part Number
OMAPL138EZWT3
Manufacturer
Texas Instruments
Allelco Part Number
32D-OMAPL138EZWT3
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
2,190 pcs available, New & Original
Parts Description
IC MPU OMAP-L1X 375MHZ 361NFBGA
Package
361-NFBGA (16x16)
Data sheet
OMAPL138EZWT3.pdf

HTML Datasheet

OMAP-L138 Datasheet.pdf

PCN Assembly/Origin

2.73KHz.pdf

PCN Design/Specification

Cylindrical Battery Holders.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 2190
  • Unit Price: $22.62
  • Subtotal: $0.00

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1+ $22.62 $22.62
30+ $21.61 $648.30
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

OMAPL138EZWT3 Tech Specifications
Texas Instruments - OMAPL138EZWT3 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL138EZWT3

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - I/O 1.8V, 3.3V
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Supplier Device Package 361-NFBGA (16x16)
Speed 375MHz
Series OMAP-L1x
Security Features Boot Security, Cryptography
SATA SATA 3Gbps (1)
RAM Controllers SDRAM
Package / Case 361-LFBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 90°C (TJ)
Number of Cores/Bus Width 1 Core, 32-Bit
Mounting Type Surface Mount
Graphics Acceleration No
Ethernet 10/100Mbps (1)
Display & Interface Controllers LCD
Core Processor ARM926EJ-S
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
Base Product Number OMAPL138
Additional Interfaces HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

OMAPL138EZWT3 Image
OMAPL138EZWT3 (1)

Manufacturer Part Number

OMAPL138EZWT3

Manufacturer

Texas Instruments

Introduction

The OMAPL138EZWT3 is an embedded microprocessor within Texas Instruments' OMAP-L1x series, designed for signal processing and system control applications.

Product Features and Performance

Core Processor: ARM926EJ-S operates at 375MHz

Integrates C674x DSP for advanced signal processing

Embedded CP15 system control co-processor

Single-core, 32-bit architecture for efficient processing

Supports SDRAM memory interfaces

Provides an LCD display controller

Equipped with 10/100Mbps Ethernet connectivity

Includes SATA 3Gbps interface for storage solutions

USB support: USB 1.1 with PHY and USB 2.0 with PHY

Operates on dual I/O voltage levels of 1.8V and 3.3V

Boot security and cryptography for enhanced security measures

Product Advantages

Combination of ARM and DSP cores offers versatile signal processing capabilities.

Broad range of interfaces such as HPI, I2C, McASP, and more for diverse connectivity.

Enhanced security features ensure data integrity and secure operations.

Designed for high performance with low power consumption.

OMAPL138EZWT3 Image
OMAPL138EZWT3 (2)

Key Technical Parameters

Speed: 375MHz

Number of Cores/Bus Width: 1 Core, 32-Bit

RAM Controllers: SDRAM

Ethernet: 10/100Mbps

SATA: 3Gbps

USB Capabilities: USB 1.1 and USB 2.0

Voltage I/O: 1.8V, 3.3V

Operating Temperature Range: 0°C ~ 90°C (TJ)

Quality and Safety Features

Robust security features including boot security and cryptography.

Designed for reliability across varying operating temperatures.

Compatibility

Supports a wide array of interfaces for comprehensive compatibility with existing systems and peripheral devices.

Application Areas

Industrial control

Medical imaging

Networking

Voice and data communication systems

Product Lifecycle

Current Status: Active

Not nearing discontinuation, ensuring long-term availability for projects.

Support for upgrades and replacements is available.

Several Key Reasons to Choose This Product

High-speed signal processing capabilities suited for demanding applications.

Dual processor architecture (ARM and DSP) enhances performance and efficiency.

Comprehensive connectivity and interface support address various application needs.

Strong security features ensure the safety of sensitive data.

Active product status with Texas Instruments guarantees long-term support and supply continuity.

Frequently Asked Questions(FAQ)

How does the OMAPL138EZWT3 compare to other processors in terms of real-time signal processing performance when handling multi-channel audio and control loops?
The OMAPL138EZWT3 integrates a C674x floating-point DSP alongside its ARM926EJ-S core, delivering approximately 300 MFLOPS of single-precision floating-point throughput at 375 MHz. This enables efficient execution of complex algorithms such as FFTs or FIR filters in real time, making it suitable for industrial audio processing and motor control applications. In contrast, a pure ARM9 implementation without dedicated DSP acceleration may require significant software optimization or reduced sample rates to achieve comparable performance, introducing latency or computational bottlenecks.
What are the key trade-offs between using the OMAPL138EZWT3 with external DDR2 memory versus relying on internal SRAM for time-critical applications?
While the OMAPL138EZWT3 lacks integrated SRAM, it supports up to 128 MB of external DDR2 SDRAM via its memory controller, offering higher density and lower cost per bit compared to embedded alternatives. However, external access introduces latency—typically 10–15 cycles for burst reads—which can impact deterministic response in hard real-time tasks. Designers must weigh this against power consumption, where external DRAM requires refresh cycles and consumes more static power than embedded options, potentially affecting battery life in portable systems.
Can the OMAPL138EZWT3 simultaneously operate both USB 2.0 host and device modes while maintaining full-speed (480 Mbps) data transfer, and what system-level considerations apply?
Yes, the OMAPL138EZWT3 features dual USB ports—one supporting USB 2.0 (480 Mbps) and another USB 1.1 (12 Mbps)—with dedicated PHYs, enabling concurrent host and peripheral operation. However, achieving sustained USB 2.0 throughput requires careful PCB layout, impedance-controlled differential pairs, and sufficient CPU bandwidth to manage isochronous transfers. The shared AXI interconnect between the ARM and DSP subsystems may become a bottleneck under high combined load unless DMA is properly configured.
How does the boot security feature in the OMAPL138EZWT3 protect firmware integrity during system initialization?
The OMAPL138EZWT3 includes cryptographic hardware acceleration supporting AES-128 and RSA-2048 operations, which are used during the secure boot process to validate digital signatures of the first-stage bootloader stored in ROM or external flash. Only code signed with an approved private key will execute, preventing unauthorized firmware injection. This protects against tampering but requires careful management of root keys and secure key storage to avoid lock-in risks.
What thermal design constraints should be considered when deploying the OMAPL138EZWT3 in compact industrial enclosures without active cooling?
Operating the OMAPL138EZWT3 within its specified junction temperature range of 0°C to 90°C demands attention to power dissipation and airflow. At 375 MHz with typical I/O activity, the device may dissipate 1.2–1.8 W under full computational load. Given the 361-pin NFBGA package’s limited exposed pad area, thermal vias under the package and a solid ground plane are essential. Without forced convection, ambient temperatures above 50°C can push the junction near its limit, necessitating derating or workload throttling.
Is it feasible to drive a standard LVDS LCD panel directly from the OMAPL138EZWT3, and what interface limitations exist?
No, the OMAPL138EZWT3 includes an LCD controller but outputs only 8/16-bit parallel RGB signals, not native LVDS. To interface with most modern LVDS displays, an external serializer (e.g., DS90CR287) would be required, adding BOM cost and board complexity. Alternatively, one could use the parallel interface with a TFT controller chip capable of accepting RGB input, though this increases pin count usage and reduces available GPIOs.
How does the presence of both McBSP and McASP interfaces influence audio subsystem architecture in embedded designs using the OMAPL138EZWT3?
The McBSP (Multichannel Buffered Serial Port) supports basic TDM or I2S modes with up to two channels, suitable for simple codec connections. In contrast, McASP offers advanced multichannel support, configurable frame syncs, and higher channel counts—ideal for professional audio or multiple microphone arrays. Selecting between them depends on system requirements: McBSP suffices for stereo voice codecs, while McASP enables scalable, synchronized audio pipelines across sensor nodes.
What impact does the Moisture Sensitivity Level 3 classification have on storage and handling procedures for OMAPL138EZWT3 components prior to assembly?
As an MSL 3 component, the OMAPL138EZWT3 must be stored in moisture barrier bags with desiccant and humidity indicator cards, maintaining RH below 60% until reflow. Once opened, it remains usable for 168 hours (seven days) under ambient conditions before requiring baking to prevent popcorning during soldering. Manufacturers must track bake cycles and reseal promptly post-assembly to comply with JEDEC standards and ensure reliability.
When comparing the OMAPL138EZWT3 to newer Cortex-A series SoCs, what fundamental architectural differences affect real-time determinism and interrupt latency?
Unlike Cortex-A cores with out-of-order execution and deep pipelines, the ARM926EJ-S in the OMAPL138EZWT3 uses in-order architecture with shorter pipeline stages, yielding predictable interrupt latencies typically under 200 ns. This makes it preferable for hard real-time control loops where timing jitter must be minimized. However, this comes at the cost of peak integer performance, which newer architectures surpass significantly.
How should developers manage shared resource contention between the ARM926EJ-S and C674x DSP subsystems in a multicore-like environment using the OMAPL138EZWT3?
Although not a true multiprocessor, the OMAPL138EZWT3 allows cooperative task partitioning between the ARM and DSP. Shared peripherals like McBSP or memory require explicit synchronization via semaphores or hardware mailboxes. Mismanagement can lead to race conditions or priority inversion. TI provides DSP/BIOS Link middleware to abstract communication overhead, but custom implementations demand careful consideration of worst-case access times and buffer sizing to maintain system stability.
What role does CP15 play in the OMAPL138EZWT3, and how can its configuration affect system security or performance?
CP15 is the coprocessor controlling cache, MMU, and system control functions in the ARM926EJ-S. Proper configuration enables memory protection domains, cache locking for time-critical routines, and instruction/data cache enablement. For example, disabling data caching improves determinism at the expense of performance; conversely, aggressive caching speeds up repetitive computations but risks timing variability. Incorrect MMU setups can also expose sensitive data if not properly isolated.
Are there known limitations when using SATA II (3 Gbps) drives with the OMAPL138EZWT3 in consumer-grade industrial applications?
The OMAPL138EZWT3’s SATA controller adheres to SATA II specifications and can interface with standard 3 Gbps drives, but throughput may be limited by the ARM926EJ-S’s memory bandwidth (~800 MB/s theoretical) and lack of DMA coherency with the external memory. Sustained streaming transfers exceeding 200 MB/s may saturate the AXI bus, causing dropped packets or buffer underruns unless the driver employs scatter-gather DMA efficiently.
How does the absence of GPU acceleration in the OMAPL138EZWT3 influence GUI development compared to more recent multimedia SoCs?
Without integrated graphics, the OMAPL138EZWT3 relies entirely on software rendering for UI elements, limiting framerates to 15–30 FPS for complex widgets. This restricts suitability to basic menu systems or static displays rather than rich animations. Developers must offload rendering to the DSP or optimize drawing routines in assembly, increasing development effort and reducing responsiveness compared to GPU-accelerated platforms.
What precautions should be taken when connecting Ethernet peripherals to the OMAPL138EZWT3’s 10/100 PHY to ensure compliance with IEEE 802.3 standards?
The integrated MAC supports auto-negotiation and Manchester encoding, but proper magnetics placement, termination resistors, and trace length matching (<15 cm differential pair skew) are critical to meet EMI and signal integrity requirements. Additionally, TCP/IP stack optimization is necessary due to the ARM9’s limited RAM; using lightweight stacks like uIP or lwIP helps maintain packet handling efficiency without overwhelming the processor.
Can the OMAPL138EZWT3 support simultaneous operation of all serial interfaces (HPI, I2C, SPI, UART, etc.) at maximum baud rates without performance degradation?
Technically yes, as each interface operates independently via dedicated hardware modules. However, polling-intensive configurations or inefficient ISRs could monopolize CPU cycles, starving background tasks. Using DMA-assisted transfers for bulk data (e.g., SPI sensors) minimizes CPU involvement. Still, designers should profile total bus utilization—especially on the shared APB bus—to avoid saturation during peak loads.
How does the operating temperature range of 0°C to 90°C affect long-term reliability in outdoor or automotive edge deployments?
While industrial-grade, the 0°C to 90°C range excludes extended automotive (-40°C to +125°C) environments, limiting use to controlled installations. Thermal cycling near the upper bound accelerates solder joint fatigue and dielectric aging in nearby passives. For harsh environments, external thermal buffering or conformal coating may be needed, but derating clock frequency or disabling non-essential peripherals becomes advisable to maintain MTBF above 50,000 hours.
What advantages does the 361-NFBGA package offer over larger QFP alternatives for space-constrained embedded designs using the OMAPL138EZWT3?
The 361-pin NFBGA (16×16 mm) provides high pin density with fine 0.8 mm pitch, minimizing board area versus quad-flat packages. Its low profile (<1.2 mm) suits slim form factors, and the exposed die attach pad enhances thermal conductivity for heat dissipation. However, it demands precise PCB fabrication tolerances and stencil printing accuracy, increasing manufacturing yield risk if process controls are suboptimal.
Why might a designer choose the OMAPL138EZWT3 over a discrete MCU+DSP solution despite higher integration?
The OMAPL138EZWT3 consolidates ARM9 control logic, C674x DSP, and rich peripherals into a single chip, reducing board footprint, power consumption (by ~30%), and inter-chip communication latency. Integrated boot ROM, cryptographic engines, and unified memory map simplify debugging and certification. For moderate-complexity signal processing with deterministic timing needs, this integration lowers total system cost and accelerates time-to-market versus cascaded discrete parts.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments OMAPL138EZWT3

Product Attribute OMAPL138EZWTA3R OMAPL138EZWTQ3 OMAPL138EZWTA3 OMAPL138EZWTD4
Part Number OMAPL138EZWTA3R OMAPL138EZWTQ3 OMAPL138EZWTA3 OMAPL138EZWTD4
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Core Processor - - - -
Voltage - I/O - - - -
Security Features - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Mounting Type - Surface Mount Through Hole Surface Mount
Display & Interface Controllers - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Ethernet - - - -
Series - - - -
Co-Processors/DSP - - - -
USB - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
RAM Controllers - - - -
Number of Cores/Bus Width - - - -
Additional Interfaces - - - -
Speed - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Graphics Acceleration - - - -
SATA - - - -

OMAPL138EZWT3 Datasheet PDF

Download OMAPL138EZWT3 pdf datasheets and Texas Instruments documentation for OMAPL138EZWT3 - Texas Instruments.

HTML Datasheet
OMAP-L138 Datasheet.pdf
PCN Assembly/Origin
2.73KHz.pdf
PCN Design/Specification
Cylindrical Battery Holders.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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New Zealand 5
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DHL & FedEx Shipment Charges Reference
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0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
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OMAPL138EZWT3 Image

OMAPL138EZWT3

Texas Instruments
32D-OMAPL138EZWT3

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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