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Home Products Integrated Circuits (ICs)Embedded - DSP (Digital Signal Processors)~~TMS320C6726RFP250~~

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TMS320C6726RFP250 - Texas Instruments

Name: Texas Instruments TMS320C6726RFP250
Brand: Texas Instruments
SKU: TMS320C6726RFP250
Availability: InStock
Rating: 5 (1 reviews)

Manufacturer Part Number: TMS320C6726RFP250

Manufacturer: Texas Instruments

Allelco Part Number: 98D-TMS320C6726RFP250

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 15,578 pcs available, New & Original

Parts Description: IC FLOATING-POINT DSP 144-HTQFP

Package: 144-HTQFP (20x20)

Data sheet: -

RoHs Status: ROHS3 Compliant

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In stock: 15578

Specifications

TMS320C6726RFP250 Tech Specifications
Texas Instruments - TMS320C6726RFP250 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TMS320C6726RFP250

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - I/O	3.30V
Voltage - Core	1.20V
Type	Floating Point
Supplier Device Package	144-HTQFP (20x20)
Series	TMS320C672x
Package / Case	144-TQFP Exposed Pad
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 90°C (TC)
On-Chip RAM	288kB
Non-Volatile Memory	ROM (384kB)
Mounting Type	Surface Mount
Interface	EBI/EMI, I²C, McASP, SPI
Clock Rate	250MHz
Base Product Number	TMS320

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	4 (72 Hours)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Frequently Asked Questions(FAQ)

How does the TMS320C6726RFP250's 288kB on-chip RAM compare to other DSPs in the same performance tier, and what implications does this have for real-time signal processing applications?: The TMS320C6726RFP250 offers 288kB of on-chip RAM, which is relatively modest compared to high-end floating-point DSPs like the C6748 (which can exceed 1MB), but remains sufficient for many intermediate-complexity applications such as motor control or audio filtering. This amount of memory allows execution of moderately complex algorithms without external memory access penalties, reducing latency and improving deterministic behavior—critical for real-time systems. However, designs requiring larger data buffers or multiple concurrent processes may still need external SDRAM or SRAM, increasing system cost and board space.

What are the thermal and power considerations when operating the TMS320C6726RFP250 at its maximum clock rate of 250MHz, and how do these impact PCB layout and cooling strategy?: At 250MHz, the TMS320C6726RFP250 draws significant dynamic power due to its high-speed floating-point unit and multiple internal buses. With a core voltage of 1.2V, typical active-mode current can reach several hundred milliamps, leading to heat generation that necessitates careful thermal management. Combined with a 0°C to 90°C operating range, designers must ensure adequate airflow or conduction paths, especially in sealed enclosures. The exposed pad package (HTQFP) aids heat dissipation but requires proper soldering and grounding to maintain junction temperature within safe limits during sustained operation.

Can the TMS320C6726RFP250 interface directly with industrial-grade peripherals using EBI/EMI, McASP, and SPI interfaces, and what level of signal conditioning might be needed?: Yes, the TMS320C6726RFP250 features robust peripheral interfaces including EBI/EMI for external memory expansion, McASP for audio and serial communication, and SPI for sensor connectivity. These operate at 3.3V I/O levels, which is compatible with most modern digital sensors and industrial logic families. However, interfacing with legacy 5V TTL devices may require level shifters, while analog front-ends (e.g., ADCs/DACs) often demand additional anti-aliasing filters or sample-and-hold circuits to match the DSP’s input bandwidth and timing requirements.

How does the 384kB ROM in the TMS320C6726RFP250 influence boot modes and application firmware deployment in embedded systems?: The integrated 384kB ROM contains TI’s bootloader and essential system initialization code, enabling flexible boot options such as loading firmware from SPI flash, I2C EEPROM, or over Ethernet via MDIO. This reduces reliance on external boot components and simplifies system bring-up. However, it also means that custom boot sequences or proprietary initialization logic must fit within this constraint unless supplemented with external non-volatile memory. Applications requiring extensive boot-time configuration may exceed this limit, necessitating external storage.

In what scenarios would one choose the TMS320C6726RFP250 over a general-purpose microcontroller, despite its higher cost and power consumption?: The TMS320C6726RFP250 is preferable when floating-point arithmetic performance is critical—such as in radar processing, medical imaging, or advanced audio effects—where a microcontroller would require software emulation of floating-point operations, drastically reducing throughput. Its single-cycle MAC units and VLIW architecture deliver up to hundreds of MFLOPS, making it ideal for mathematical-intensive tasks that cannot tolerate fixed-point approximations or iterative convergence. For control loops with low computational demands, however, a lower-cost MCU may offer better energy efficiency and integration.

What are the key differences between the TMS320C6726RFP250 and the TMS320C6713BTSHAR in terms of memory architecture and peripheral support?: While both belong to Texas Instruments’ C6000 family, the TMS320C6726RFP250 offers significantly more on-chip memory (288kB vs. typically 128–256kB on older models) and runs at a higher clock speed (250MHz vs. ~300MHz peak on C6713 but with different pipeline characteristics). Additionally, the C6726 includes enhanced peripheral sets like improved McASP and I2C modules, and supports newer packaging options with better thermal performance. The C6713 lacks some of the C672x series’ power management features and has less integrated RAM, impacting scalability in memory-bound applications.

How should the moisture sensitivity level (MSL 4) of the TMS320C6726RFP250 affect handling procedures during PCB assembly?: MSL 4 classification indicates that the TMS320C6726RFP250 must be stored in dry conditions and processed within 72 hours after removal from an approved moisture barrier bag. If exposed to ambient humidity beyond this window, the device must undergo reflow oven baking before soldering to prevent popcorning—a failure mode caused by moisture vaporization under thermal stress. Compliance with JEDEC J-STD-033 guidelines is essential during manufacturing to avoid reliability issues in field deployments.

Can the TMS320C6726RFP250 support multi-core configurations or inter-processor communication in embedded systems requiring distributed computation?: No, the TMS320C6726RFP250 is a single-core processor and does not natively support multi-core operation or hardware-assisted inter-processor messaging. For systems requiring parallel processing, designers must implement task partitioning across multiple instances on separate boards or use companion processors (e.g., microcontrollers or FPGAs) to offload coordination. Alternatively, future-proofing may involve selecting a multicore DSP from the C66x or Jacinto series if scalability is anticipated.

What impact does the 1.20V core voltage have on noise immunity and switching performance of the TMS320C6726RFP250 in noisy industrial environments?: Operating at 1.20V reduces dynamic power and electromagnetic emissions, which improves noise margin slightly, but also lowers drive strength, potentially increasing susceptibility to voltage droop under transient loads. In industrial settings with switching power supplies or motor drives, decoupling capacitors near the core pins and a clean local power rail are critical. The reduced swing also means faster edges are harder to maintain at full clock rates, possibly affecting timing margins in long bus traces or high-capacitance loads.

Is it feasible to upgrade legacy systems based on the TMS320C6713 to the TMS320C6726RFP250 while maintaining compatibility with existing software and hardware platforms?: Software compatibility is generally preserved due to architectural similarity within the C67xx lineage, allowing recompilation with minimal changes. However, differences in memory map, clock domains, and peripheral register layouts may require adjustments in linker scripts and initialization code. Hardware-wise, the HTQFP package has the same pinout as earlier TQFP variants, so mechanical compatibility is maintained, though thermal design must account for increased power density. Thorough regression testing is recommended before migration.

How does the absence of external memory interface voltage flexibility in the TMS320C6726RFP250 affect mixed-voltage system design?: The TMS320C6726RFP250 uses fixed 3.3V I/O levels, which limits direct connection to 1.8V or 1.2V memory devices without level shifting. This complicates integration with low-voltage DRAMs or flash chips commonly used in power-sensitive applications. Designers must either select 3.3V-compatible memories or insert translation circuitry, adding BOM cost and trace complexity. This constraint favors systems where all external components operate at 3.3V to maintain simplicity and reduce component count.

What role does the EBI/EMI interface play in expanding the effective addressable memory space of the TMS320C6726RFP250, and what limitations exist due to internal RAM size?: The EBI/EMI enables the TMS320C6726RFP250 to access large external memories such as SDRAM or NOR flash, extending program and data storage far beyond its 288kB internal RAM. This allows execution of large applications or data sets that wouldn’t fit internally. However, frequent accesses to external memory introduce latency and bandwidth constraints, especially at 250MHz, where internal L1/L2 caches mitigate but don’t eliminate performance penalties. Optimal usage involves keeping hot code/data in on-chip memory and streaming cold data externally.

How reliable is the TMS320C6726RFP250 in harsh environments given its commercial-grade temperature rating of 0°C to 90°C?: The TMS320C6726RFP250’s 0°C to 90°C range covers standard industrial temperatures but excludes extended automotive or aerospace grades. In applications involving thermal cycling, vibration, or dust exposure, additional environmental hardening—such as conformal coating, sealed enclosures, or derating—is advisable. While the silicon itself is robust, solder joints and nearby passives may degrade over time under stress. For mission-critical systems, qualification to MIL-STD or AEC-Q100 standards may be warranted despite the lack of explicit certification.

What development tools and compiler optimizations are available for efficiently utilizing the TMS320C6726RFP250’s VLIW architecture?: Texas Instruments provides Code Composer Studio (CCS) with built-in support for the C6726, including cycle-accurate simulators, profilers, and optimized math libraries (CBLAS, FFTW-like functions). Compilers automatically schedule instructions across functional units but benefit greatly from hand-tuned assembly or intrinsics for latency-critical kernels. Profiling reveals bottlenecks in data movement or branch mispredictions, guiding loop unrolling, cache blocking, or register allocation strategies. Effective use of DMA channels further reduces CPU overhead in data transfers.

Can the TMS320C6726RFP250 support real-time operating systems (RTOS) with strict timing guarantees, and which ones are commonly deployed?: Yes, the TMS320C6726RFP250 is well-suited for RTOS-based designs due to its deterministic interrupt response and high interrupt priority levels. Commonly used RTOSes include TI-RTOS, FreeRTOS (with port available), and QNX Neutrino. The presence of multiple interrupt sources and fast context switching enables multitasking with microsecond-level scheduling jitter. Memory protection units (if implemented in system-on-chip extensions) further enhance safety in fault-tolerant applications.

What are the implications of the TMS320C6726RFP250’s RoHS3 compliance for international regulatory adherence and supply chain continuity?: RoHS3 compliance ensures the absence of restricted substances like lead, mercury, and cadmium, meeting EU directives and simplifying global market entry. It also aligns with green procurement policies common in defense, medical, and consumer electronics sectors. Since the device is REACH unaffected and ECCN-controlled for export purposes, sourcing risks are minimized across most regions. Distributors typically maintain stable stock levels due to broad industry adoption, reducing obsolescence concerns for mid-life product cycles.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TMS320C6726RFP250

Product Attribute
Part Number	TMS320C6722RFP250	TMS320C6726RFPA225	TMS320C6722RFPA225	TMS320C6726BRFP266
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Clock Rate	-	-	-	-
Non-Volatile Memory	-	-	-	-
Type	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Interface	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Voltage - I/O	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Voltage - Core	-	-	-	-
Series	-	-	-	-
On-Chip RAM	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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America	United States	5
America	Brazil	7
Europe	Germany	5
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	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
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Middle East	Israel	6

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Shipment charges(KG)	Reference DHL(USD$)
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1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

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