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Home Products Integrated Circuits (ICs)Embedded - DSP (Digital Signal Processors)~~TMS320C6727BGDH350~~

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TMS320C6727BGDH350 - Texas Instruments

Name: Texas Instruments TMS320C6727BGDH350
Brand: Texas Instruments
SKU: TMS320C6727BGDH350
Price: 9.14 USD
Availability: InStock
Rating: 5 (6 reviews)

Manufacturer Part Number: TMS320C6727BGDH350

Manufacturer: Texas Instruments

Allelco Part Number: 32D-TMS320C6727BGDH350

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 7,170 pcs available, New & Original

Parts Description: IC FLOATING POINT DSP 256-BGA

Package: 256-BGA (17x17)

Data sheet: TMS320C6727BGDH.pdf

PCN Packaging
New Tray 14/Sep/2020.pdf

HTML Datasheet
TMS320C672x(B).pdf

RoHs Status

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In stock: 7170

Unit Price: $11.10
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Quantity	Unit Price	Ext. Price
1+	$11.10	$11.10
10+	$10.64	$106.40
30+	$9.84	$295.20
100+	$9.14	$914.00

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TMS320C6727BGDH350 Tech Specifications
Texas Instruments - TMS320C6727BGDH350 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TMS320C6727BGDH350

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - I/O	3.30V
Voltage - Core	1.40V
Type	Floating Point
Supplier Device Package	256-BGA (17x17)
Series	TMS320C672x
Package / Case	256-BGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 90°C (TC)
On-Chip RAM	288kB
Non-Volatile Memory	ROM (384kB)
Mounting Type	Surface Mount
Interface	EBI/EMI, HPI, I²C, McASP, SPI
Clock Rate	350MHz
Base Product Number	TMS320

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS non-compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Affected
ECCN	3A991A2
HTSUS	8542.31.0001

Parts Introduction

TMS320C6727BGDH350 (1)

Manufacturer Part Number

TMS320C6727BGDH350

Manufacturer

Texas Instruments

Introduction

The TMS320C6727BGDH350 is a high-performance floating-point digital signal processor (DSP) from Texas Instruments' TMS320C672x series, designed for demanding processing applications.

Product Features and Performance

High clock rate of 350MHz for efficient signal processing

Floating Point architecture for precise computations

Embedded ROM of 384kB

Integrated On-Chip RAM of 288kB for quick data access

Rich interface options including EBI/EMI, HPI, I2C, McASP, SPI

Advanced BGA packaging for reliable surface mount assembly

Product Advantages

Exceptional processing power ideal for real-time applications

Flexible interfacing capabilities facilitating easier integration

On-chip memory reduces external component count

Optimized for low power consumption resulting in energy efficiency

Key Technical Parameters

Clock Rate: 350MHz

Non-Volatile Memory: ROM (384kB)

On-Chip RAM: 288kB

Voltage I/O: 3.30V

Voltage Core: 1.40V

Operating Temperature Range: 0°C to 90°C

Quality and Safety Features

Rigorous quality assurance testing

Designed for optimal thermal performance under recommended operating temperature limits

Compatibility

Supports a variety of serial and parallel interfaces for broad device compatibility

Suitable for use with Texas Instruments development tools

Application Areas

High-speed data acquisition systems

Imaging and multimedia processing

Medical instrumentation

Industrial control and automation

Product Lifecycle

Product status is currently active

Not indicated as nearing discontinuation

Availability of replacements or upgrades is typically assured by manufacturer

Several Key Reasons to Choose This Product

Renowned Texas Instruments reliability and support

High degree of precision with floating-point capabilities

Capable of handling complex algorithms and computations quickly

Extended operating temperature range for versatility in various environments

Comprehensive interfacing options driving ease of system integration

Frequently Asked Questions(FAQ)

What are the key performance trade-offs when selecting the TMS320C6727BGDH350 for real-time signal processing applications compared to fixed-point DSPs?: The TMS320C6727BGDH350 offers floating-point arithmetic at 350MHz, which provides superior dynamic range and reduced software complexity for algorithms like FFT or filter banks compared to fixed-point alternatives. However, this comes with higher power consumption due to its dual voltage architecture—1.40V core and 3.30V I/O—and a more complex memory subsystem requiring 288kB on-chip RAM plus 384kB ROM. Designers must balance computational throughput against thermal and power constraints in embedded systems where sustained floating-point operations may lead to elevated junction temperatures near the 90°C maximum rating.

How does the memory configuration of the TMS320C6727BGDH350 impact system-level design decisions in industrial control applications?: With 288kB of on-chip RAM and 384kB of integrated ROM, the TMS320C6727BGDH350 supports self-contained execution without external program storage, simplifying PCB layout and reducing component count. In motor control or sensor fusion tasks, this enables fast data buffering and interrupt-driven processing. However, large datasets such as multi-channel ADC streams may exceed available internal resources, necessitating careful partitioning between code, variables, and DMA-managed buffers to avoid bottlenecks during high-throughput operations.

Can the TMS320C6727BGDH350 be used effectively in battery-powered portable devices given its power characteristics?: While the TMS320C6727BGDH350 delivers strong computational density for its class, its dual-voltage design and 350MHz operating frequency result in relatively high active power draw, making it less ideal for ultra-low-power portable applications. Systems requiring long battery life would benefit from lower-clock alternatives in the same family or dedicated ultra-low-power MCUs. That said, in scenarios where performance outweighs efficiency—such as medical imaging peripherals or handheld test equipment—the floating-point capability justifies the energy cost through faster algorithm convergence and reduced processing time.

What interface options are available on the TMS320C6727BGDH350, and how do they influence peripheral integration strategies?: The TMS320C6727BGDH350 integrates multiple industry-standard interfaces including EBI/EMI, HPI, I2C, McASP, and SPI, enabling direct connectivity to sensors, memory modules, audio CODECs, and communication buses. This reduces reliance on additional bridge controllers and supports synchronized data acquisition across domains. For example, McASP can stream PCM audio while SPI handles sensor telemetry simultaneously. Careful arbitration is required if shared bandwidth exceeds bus capacity, particularly when using parallel access modes over the 17x17 BGA package’s limited pin availability.

How should thermal management be approached when deploying the TMS320C6727BGDH350 in compact enclosures?: Operating temperature ranges from 0°C to 90°C (TC), but sustained operation near 85°C–90°C under full load may require heatsinking or airflow due to power dissipation exceeding 2W in typical floating-point workloads. Given the small 256-BGA footprint (17x17), traditional thermal vias and copper pours on the bottom layer are essential. Thermal simulation should account for both conduction through the substrate and convection at the board edge, especially if populated densely around the device.

What are the implications of RoHS non-compliance for the TMS320C6727BGDH350 in commercial product development?: The TMS320C6727BGDH350 is marked as RoHS non-compliant, meaning it contains restricted substances above regulatory thresholds, primarily due to lead-based solder in the BGA package or certain alloy components. This limits its use in regions enforcing strict environmental directives unless exemptions apply. Engineers must verify end-product certification requirements early; failure to address this can lead to supply chain disruption or re-certification costs during manufacturing ramp-up.

How does the TMS320C6727BGDH350 compare to other members of the TMS320C672x series in terms of clock speed and memory allocation?: Within the TMS320C672x family, the TMS320C6727BGDH350 operates at 350MHz, which is among the higher frequencies offered by TI for this generation. Other variants may offer lower clock speeds but sometimes include larger caches or enhanced peripherals at the expense of peak throughput. Memory-wise, all C672x parts share similar architectures—typically 256–384kB ROM and 256–288kB RAM—but specific models vary in external memory support or instruction set extensions, requiring cross-referencing based on application latency and code size requirements.

Is the TMS320C6727BGDH350 suitable for safety-critical automotive applications?: Although the TMS320C6727BGDH350 delivers robust performance, it lacks formal automotive qualification (e.g., AEC-Q100) and carries a REACH Affected status, which complicates deployment in regulated environments like ADAS or infotainment systems. Additionally, the absence of lockstep CPU cores or ECC-protected memory increases risk in fault-tolerant designs. For non-safety-critical functions within automotive platforms, it may still be viable, but alternative TI DSPs explicitly certified for automotive use are recommended for compliance and reliability assurance.

What considerations arise when designing firmware for the TMS320C6727BGDH350’s floating-point unit?: The floating-point capabilities of the TMS320C6727BGDH350 simplify implementation of mathematical algorithms but demand attention to alignment with IEEE 754 standards and proper handling of NaN, infinity, and denormal numbers. Compiler optimizations must be tuned to leverage the VLIW architecture efficiently, avoiding pipeline stalls caused by misaligned memory accesses or excessive branching. Developers should profile critical loops to ensure consistent execution times, particularly if real-time deadlines depend on predictable cycle counts across varying input conditions.

How does the package type of the TMS320C6727BGDH350 affect PCB assembly and yield in mass production?: The 256-ball BGA package (17x17) presents challenges in reflow soldering due to tight pitch and potential tombstoning or bridging risks. Yield optimization requires precise stencil printing, controlled solder paste deposition, and accurate alignment during pick-and-place. Automated optical inspection (AOI) is almost mandatory to detect voids or insufficient wetting, especially given the Moisture Sensitivity Level 3 classification, which mandates dry packaging and humidity-controlled storage up to 168 hours before assembly.

What debugging and development tools are compatible with the TMS320C6727BGDH350?: Texas Instruments provides Code Composer Studio (CCS) as the primary IDE for developing and debugging firmware on the TMS320C6727BGDH350. Hardware probes such as XDS100v2 or XDS200 series JTAG emulators interface via the 256-BGA pins and support real-time tracing, breakpoints, and memory monitoring. Due to the dense pinout, probe placement often requires a debug header or breakout board to ensure reliable signal integrity during in-circuit validation.

What are the typical use cases where the TMS320C6727BGDH350 outperforms general-purpose microcontrollers?: The TMS320C6727BGDH350 excels in applications demanding high-speed floating-point computation, such as radar signal processing, software-defined radio (SDR), digital audio effects, and real-time spectral analysis. Its VLIW architecture allows multiple instructions per cycle, making it far more efficient than MCUs lacking FPU support when executing matrix operations or complex transforms. In contrast, microcontrollers are preferable for control logic, low-latency I/O handling, or simple state machines.

How does the voltage separation between core and I/O affect power delivery design for the TMS320C6727BGDH350?: The dual-supply requirement—1.40V for core logic and 3.30V for I/O—necessitates separate LDOs or PMIC rails to prevent noise coupling and ensure stable operation. Switching regulators are generally avoided for the core rail due to susceptibility to transient glitches, while the I/O rail can tolerate moderate ripple. Power sequencing must follow manufacturer guidelines to avoid latch-up or reset anomalies during startup or brownout events.

What precautions should be taken regarding ESD protection when handling the TMS320C6727BGDH350 in prototype builds?: As with all BGA-packaged ICs, the TMS320C6727BGDH350 is vulnerable to electrostatic discharge through exposed pads or unconnected inputs. Handling procedures should include grounded wrist straps, anti-static mats, and conductive packaging. During probing or socketing, temporary ESD clamps or ferrite beads may be needed to shunt transient energy away from sensitive nodes, especially since internal ESD diodes have limited current-handling capability compared to discrete protection devices.

Does the TMS320C6727BGDH350 support external memory expansion, and what are the limitations?: Yes, the TMS320C6727BGDH350 includes an External Bus Interface (EBI/EMI) that allows connection to SDRAM, NOR Flash, or SRAM. However, the total addressable space is constrained by the 32-bit address bus and available pin assignments, typically limiting expansion to several megabytes. Bandwidth becomes a bottleneck if external memory access competes with on-chip cache or DMA transfers, so careful scheduling or use of burst mode is advised for sustained throughput.

Why might someone choose the TMS320C6727BGDH350 over FPGA-based solutions despite higher cost and power consumption?: The TMS320C6727BGDH350 offers deterministic execution, mature toolchains, and lower development overhead for algorithmic workloads involving floating-point math or control loops. Unlike FPGAs, it abstracts hardware design complexities and supports rapid prototyping with C/C++. For applications where software portability, maintainability, and time-to-market outweigh the need for custom logic synthesis or parallel data paths, the DSP provides a pragmatic middle ground between MCU and FPGA extremes.

What impact does the 90°C maximum junction temperature have on long-term reliability assessments?: Operating consistently near the 90°C limit accelerates electromigration and reduces mean time between failures (MTBF), especially under continuous high-load conditions. Derating by 10–15°C improves longevity and ensures margin for ambient temperature variations. Thermal cycling also stresses solder joints in the BGA package, so designs should minimize repeated hot/cold transitions and consider conformal coating if environmental exposure is expected.

How does the ECCN classification (3A991A2) influence international export controls for products incorporating the TMS320C6727BGDH350?: ECCN 3A991A2 indicates the TMS320C6727BGDH350 falls under “specially designed semiconductors” not meeting the criteria for 3A001, yet still subject to export restrictions. This affects shipments to certain countries and may require licensing under U.S. regulations. End-users in defense, aerospace, or telecommunications sectors must confirm compliance documentation aligns with final destination requirements to avoid customs delays or legal penalties.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TMS320C6727BGDH350

Product Attribute
Part Number	TMS320C6727GDH300	TMS320C6727BZDH300	TMS320C6727BZDH250	TMS320C6727GDH250
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
On-Chip RAM	-	-	-	-
Interface	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Clock Rate	-	-	-	-
Non-Volatile Memory	-	-	-	-
Series	-	-	-	-
Type	-	-	-	-
Voltage - I/O	-	-	-	-
Voltage - Core	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C

TMS320C6727BGDH350 Datasheet PDF

Download TMS320C6727BGDH350 pdf datasheets and Texas Instruments documentation for TMS320C6727BGDH350 - Texas Instruments.

PCN Packaging: New Tray 14/Sep/2020.pdf
HTML Datasheet: TMS320C672x(B).pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
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