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Home Products Integrated Circuits (ICs)Embedded - DSP (Digital Signal Processors)~~TMS320C6726RFPA225~~

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TMS320C6726RFPA225 - Texas Instruments

Name: Texas Instruments TMS320C6726RFPA225
Brand: Texas Instruments
SKU: TMS320C6726RFPA225
Availability: InStock
Rating: 5 (10 reviews)

Manufacturer Part Number: TMS320C6726RFPA225

Manufacturer: Texas Instruments

Allelco Part Number: 98D-TMS320C6726RFPA225

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 12,317 pcs available, New & Original

Parts Description: IC FLOATING POINT DSP 144-HTQFP

Package: 144-HTQFP (20x20)

Data sheet: -

RoHs Status: ROHS3 Compliant

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In stock: 12317

Specifications

TMS320C6726RFPA225 Tech Specifications
Texas Instruments - TMS320C6726RFPA225 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TMS320C6726RFPA225

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - I/O	3.30V
Voltage - Core	1.20V
Type	Floating Point
Supplier Device Package	144-HTQFP (20x20)
Series	TMS320C672x
Package / Case	144-TQFP Exposed Pad
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	-40°C ~ 105°C (TC)
On-Chip RAM	288kB
Non-Volatile Memory	ROM (384kB)
Mounting Type	Surface Mount
Interface	EBI/EMI, I²C, McASP, SPI
Clock Rate	225MHz
Base Product Number	TMS320

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	4 (72 Hours)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Frequently Asked Questions(FAQ)

How does the TMS320C6726RFPA225 handle real-time signal processing in high-temperature industrial environments, and what thermal considerations should be factored into a system design using this DSP?: The TMS320C6726RFPA225 operates reliably across a commercial temperature range of -40°C to 105°C, making it suitable for demanding embedded applications such as motor control or power conversion systems exposed to elevated ambient conditions. At full load, the core consumes approximately 1.2W under typical supply conditions (1.2V core voltage), which generates heat that must be managed through proper PCB layout and thermal vias in the 144-HTQFP package. Designers should ensure adequate airflow or implement thermal management strategies when operating near the upper limit of 105°C, especially in compact form factors where convective cooling is limited.

What are the key differences between the TMS320C6726RFPA225 and other members of the TMS320C672x series in terms of memory architecture and peripheral integration for audio and communication applications?: Compared to similar devices like the TMS320C6713B, the TMS320C6726RFPA225 features a unified memory space with 288kB of on-chip RAM and includes enhanced McASP interfaces optimized for high-speed audio and serial data streaming. Unlike the C6713B, which lacks integrated EBI/EMI support, the C6726RFPA225 provides direct external memory interface capabilities, enabling more flexible system expansion. Additionally, its 384kB ROM supports booting from various sources, including parallel interfaces, which reduces dependency on external flash in certain designs—particularly beneficial in space-constrained or cost-sensitive embedded systems.

Can the TMS320C6726RFPA225 be used in low-power battery-operated embedded systems, and how do voltage scaling or clock gating strategies impact its performance versus power consumption trade-off?: While the TMS320C6726RFPA225 is not designed for ultra-low-power operation, its 1.2V core voltage allows for reasonable power efficiency relative to high-performance floating-point throughput. Dynamic power consumption scales quadratically with core voltage, so reducing the 1.2V supply can significantly decrease energy usage at the expense of available computational headroom. However, aggressive voltage scaling below nominal levels may violate timing margins during peak processing loads. Clock gating via software control of internal modules can reduce dynamic power by up to 30–40% during idle periods, making it feasible for intermittent workloads common in sensor fusion or edge AI applications.

What external memory configurations are compatible with the TMS320C6726RFPA225, and how does the EBI/EMI interface affect system latency and memory bandwidth requirements in real-time applications?: The TMS320C6726RFPA225 supports asynchronous NOR flash, SRAM, and SDRAM via its 16-bit or 32-bit EBI/EMI interface. Typical configurations include 16MB of SDRAM running at 66MHz with CAS latency of 2 cycles, yielding sustained bandwidth around 132 MB/s. Access latency depends on wait-state insertion and bus arbitration logic; unoptimized accesses can introduce microsecond-level delays, potentially impacting real-time deadlines in control loops. Designers should align memory access patterns with cache-aware programming models and consider burst-mode transfers to maximize effective bandwidth while minimizing CPU stalls.

How does the presence of both I2C and SPI interfaces on the TMS320C6726RFPA225 influence peripheral selection in multi-device communication systems, and which protocol offers better performance for high-frequency sensor readout?: The dual-support for I2C and SPI allows flexible connectivity depending on device requirements. SPI generally provides higher data rates—up to several Mbps over short distances—due to full-duplex operation and dedicated chip select lines, making it preferable for high-speed ADCs or memory-mapped peripherals. In contrast, I2C simplifies wiring in multi-drop configurations but caps out at around 400 kbps (Fast Mode Plus). For the TMS320C6726RFPA225, using SPI with DMA-assisted transfers minimizes CPU overhead during bulk sensor data acquisition, preserving core cycles for algorithmic processing in vision or radar signal chains.

Is the TMS320C6726RFPA225 suitable for safety-critical applications requiring functional safety certification, and what architectural limitations might prevent compliance with standards like ISO 26262 or IEC 61508?: The TMS320C6726RFPA225 does not natively include hardware redundancy, error-correcting code (ECC) on RAM, or lockstep cores required for ASIL-B or SIL-2 level certifications. Although its deterministic execution pipeline and lack of caches simplify timing analysis, the absence of built-in fault detection mechanisms means additional software-based diagnostics and watchdog timers must be implemented externally. Therefore, while usable in non-certified safety-related systems, achieving formal safety compliance would require significant system-level augmentation beyond the chip’s native capabilities.

What role does the 384kB ROM play in bootloader flexibility for the TMS320C6726RFPA225, and how does it compare to alternative boot methods involving external serial EEPROMs or SD cards?: The internal ROM on the TMS320C6726RFPA225 contains a configurable bootloader supporting multiple sources including parallel NOR flash, SPI serial flash, and USB. This eliminates the need for external boot ROMs in many cases and accelerates time-to-market. Compared to booting from an SD card—which requires additional host controller drivers and FAT filesystem parsing—the internal ROM approach offers faster startup times (<100ms) and lower BOM cost. However, firmware updates remain constrained unless paired with a secondary storage medium accessible after initial boot, limiting field upgradeability without external components.

How does the Moisture Sensitivity Level (MSL) rating of 4 for the TMS320C6726RFPA225 affect manufacturing handling procedures, particularly in high-volume assembly environments?: With an MSL of 4 indicating sensitivity beyond 30°C/60% RH after 168 hours, the TMS320C6726RFPA225 mandates controlled humidity storage and baking prior to reflow if shelf life exceeds one year. In high-volume production, this necessitates dry packaging within moisture barrier bags with desiccant and humidity indicator cards. Failure to follow JEDEC J-STD-033 guidelines risks pop-corning during soldering, leading to package cracking and latent reliability failures. Most modern SMT lines automatically bake parts based on RFID tracking, but supply chain coordination remains essential to maintain integrity throughout assembly flow.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TMS320C6726RFPA225

Product Attribute
Part Number	TMS320C6722RFPA225	TMS320C6726RFP250	TMS320C6722RFP250	TMS320C6726BRFP266
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Non-Volatile Memory	-	-	-	-
Voltage - I/O	-	-	-	-
Type	-	-	-	-
Voltage - Core	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Interface	-	-	-	-
Clock Rate	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Base Product Number	-	DAC34H84	MAX500	ADS62P42
On-Chip RAM	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Series	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
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