Please refer to the English Version as our Official Version.

Europe: France~~(Français)~~ Germany~~(Deutsch)~~ Italy~~(Italia)~~ Russian~~(русский)~~ Poland~~(polski)~~ Czech~~(Čeština)~~ Luxembourg~~(Lëtzebuergesch)~~ Netherlands~~(Nederland)~~ Iceland~~(íslenska)~~ Hungarian~~(Magyarország)~~ Spain~~(español)~~ Portugal~~(Português)~~ Turkey~~(Türk dili)~~ Bulgaria~~(Български език)~~ Ukraine~~(Україна)~~ Greece~~(Ελλάδα)~~ Israel~~(עִבְרִית)~~ Sweden~~(Svenska)~~ Finland~~(Svenska)~~ Finland~~(Suomi)~~ Romania~~(românesc)~~ Moldova~~(românesc)~~ Slovakia~~(Slovenská)~~ Denmark~~(Dansk)~~ Slovenia~~(Slovenija)~~ Slovenia~~(Hrvatska)~~ Croatia~~(Hrvatska)~~ Serbia~~(Hrvatska)~~ Montenegro~~(Hrvatska)~~ Bosnia and Herzegovina~~(Hrvatska)~~ Lithuania~~(lietuvių)~~ Spain~~(Português)~~ Switzerland~~(Deutsch)~~ United Kingdom~~(English)~~

Asia/Pacific: Japan~~(日本語)~~ Korea~~(한국의)~~ Thailand~~(ภาษาไทย)~~ Malaysia~~(Melayu)~~ Singapore~~(Melayu)~~ Vietnam~~(Tiếng Việt)~~ Philippines~~(Pilipino)~~

Africa, India and Middle East: United Arab Emirates~~(العربية)~~ Iran~~(فارسی)~~ Tajikistan~~(فارسی)~~ India~~(हिंदी)~~ Madagascar~~(malaɡasʲ)~~

South America / Oceania: New Zealand~~(Maori)~~ Brazil~~(Português)~~ Angola~~(Português)~~ Mozambique~~(Português)~~

North America: United States~~(English)~~ Canada~~(English)~~ Haiti~~(Ayiti)~~ Mexico~~(español)~~

Home Products Integrated Circuits (ICs)Embedded - DSP (Digital Signal Processors)~~TMS320C6727BZDH275~~

Image may be representation.
See specifications for product details.

~~Favorite~~

EXPRESS OPTION

Payment method

TMS320C6727BZDH275 - Texas Instruments

Name: Texas Instruments TMS320C6727BZDH275
Brand: Texas Instruments
SKU: TMS320C6727BZDH275
Price: 5.01 USD
Availability: InStock
Rating: 5 (10 reviews)

Manufacturer Part Number: TMS320C6727BZDH275

Manufacturer: Texas Instruments

Allelco Part Number: 32D-TMS320C6727BZDH275

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 6,797 pcs available, New & Original

Parts Description: IC FLOATING POINT DSP 256-BGA

Package: 256-BGA (17x17)

Data sheet: TMS320C6727BZDH.pdf

PCN Packaging
New Tray 14/Sep/2020.pdf

HTML Datasheet
TMSDC6727B/26B/22B/20.pdf

RoHs Status: ROHS3 Compliant

~~Compare~~

Our certification

In stock: 6797

Unit Price: $13.66
Subtotal: $0.00

Want a better price?
Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity	Unit Price	Ext. Price
1+	$13.66	$13.66
200+	$5.29	$1,058.00
500+	$5.10	$2,550.00
1000+	$5.01	$5,010.00

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TMS320C6727BZDH275 Tech Specifications
Texas Instruments - TMS320C6727BZDH275 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TMS320C6727BZDH275

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - I/O	3.30V
Voltage - Core	1.20V
Type	Floating Point
Supplier Device Package	256-BGA (17x17)
Series	TMS320C672x
Package / Case	256-BGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 90°C (TC)
On-Chip RAM	288kB
Non-Volatile Memory	ROM (384kB)
Mounting Type	Surface Mount
Interface	EBI/EMI, HPI, I²C, McASP, SPI
Clock Rate	275MHz
Base Product Number	TMS320

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Parts Introduction

TMS320C6727BZDH275 (1)

Manufacturer Part Number

TMS320C6727BZDH275

Manufacturer

Texas Instruments

Introduction

High-performance digital signal processor tailored for industrial and commercial signal processing applications.

Product Features and Performance

Floating Point DSP capabilities

275MHz clock rate for rapid processing

On-chip ROM of 384kB for boot code and critical functions

On-chip 288kB RAM for high-speed data and instruction storage

Supports multiple interfaces including EBI/EMI, HPI, I2C, McASP, SPI

Surface mount 256-BGA package for compact integration

Product Advantages

High computational power for demanding applications

Large integrated memory facilitating complex algorithms

Variety of interfaces for flexible system design

Robust temperature range (0°C to 90°C operational)

Key Technical Parameters

Clock Rate: 275MHz

Non-Volatile Memory: ROM 384kB

On-Chip RAM: 288kB

Voltage - I/O: 3.30V

Voltage - Core: 1.20V

Operating Temperature: 0°C ~ 90°C

Mounting Type: Surface Mount

Package / Case: 256-BGA

Quality and Safety Features

Robust industrial grade operating temperature

Conformance to TI’s high-quality manufacturing standards

Compatibility

Multiple interface support ensures compatibility with various peripherals

256-BGA package commonly used in electronic systems

Application Areas

Industrial control

Telecommunications

Audio processing

Automotive systems

Medical imaging

Product Lifecycle

Status: Active

Not nearing discontinuation, with ongoing manufacturer support

Replacements or upgrades typically available, maintaining compatibility

Several Key Reasons to Choose This Product

Optimized for high-speed signal processing needs

Ample integrated memory for advanced algorithms without external components

Multiple I/O interfaces offer extensive connectivity

Proven reliability and longevity in critical applications

Extensive support and documentation from Texas Instruments

Compatibility with a range of industrial and commercial electronic systems

Active product status with continuity of supply and support from the manufacturer

Frequently Asked Questions(FAQ)

What are the key architectural trade-offs when selecting the TMS320C6727BZDH275 for high-performance floating-point signal processing applications?: The TMS320C6727BZDH275 delivers a 275MHz clock rate with a fully pipelined floating-point unit, enabling single-cycle execution of complex arithmetic operations critical for radar, medical imaging, and real-time control systems. However, this performance comes with a 1.20V core voltage requirement and a 3.30V I/O interface, necessitating dual-rail power delivery that increases board complexity. Designers must balance the 288kB on-chip RAM and 384kB ROM against external memory expansion needs via EBI/EMI, especially when implementing large lookup tables or buffering high-sample-rate data streams. The absence of on-chip flash means boot code must reside in external non-volatile memory, introducing latency and system-level reliability considerations.

How does the memory architecture of the TMS320C6727BZDH275 influence real-time deterministic behavior in embedded control systems?: With 288kB of tightly coupled on-chip RAM and no cache hierarchy, the TMS320C6727BZDH275 provides predictable memory access timing essential for hard real-time applications. This eliminates cache miss penalties that could disrupt timing-critical loops in motor control or audio beamforming algorithms. However, the fixed 384kB ROM limits firmware flexibility, requiring careful allocation of boot routines and calibration data. For applications exceeding these limits, external SDRAM accessed through the EBI/EMI interface introduces variable latency, potentially compromising determinism unless managed via memory partitioning and DMA-driven data movement.

What system-level implications arise from the 256-BGA (17x17) package and MSL 3 rating of the TMS320C6727BZDH275 during PCB assembly?: The 256-ball BGA package demands precise PCB layout with 0.8mm ball pitch, requiring impedance-controlled routing for high-speed signals like McASP and HPI. The MSL 3 classification (168 hours floor life) necessitates strict moisture control during storage and mandates baking if exposure exceeds limits, adding process overhead in high-mix manufacturing environments. Additionally, the surface-mount design requires reflow profiling compatible with lead-free solder, and thermal vias under the package are essential to manage junction temperatures, especially when operating near the 90°C TC limit under sustained computational load.

In what scenarios would the TMS320C6727BZDH275 be preferred over a fixed-point DSP despite higher power and cost?: The TMS320C6727BZDH275 excels in applications requiring dynamic range exceeding 96dB or algorithms involving transcendental functions, such as adaptive filtering, FFT-based spectral analysis, or sensor fusion with non-linear calibration. Fixed-point processors often require extensive scaling and saturation logic to avoid overflow, increasing code complexity and reducing maintainability. For example, in a 24-bit audio processing chain with gain staging across multiple channels, the native IEEE 754 single-precision support in the TMS320C6727BZDH275 eliminates quantization artifacts without manual Q-format management, reducing development time and improving signal fidelity.

How does the I/O voltage configuration of the TMS320C6727BZDH275 affect interfacing with modern low-voltage peripherals?: The 3.30V I/O voltage of the TMS320C6727BZDH275 presents compatibility challenges with newer 1.8V or 2.5V logic families commonly found in FPGAs, ADCs, and communication ICs. Level translation circuitry is typically required on all digital interfaces—including SPI, I2C, and McASP—introducing propagation delay and board area overhead. While the 3.3V levels improve noise immunity in industrial environments, they increase static power consumption in battery-powered systems. Designers must evaluate whether the robustness benefit outweighs the integration penalty, particularly in compact IoT edge nodes where voltage scaling is prioritized.

What are the thermal design considerations for the TMS320C6727BZDH275 when operating at 275MHz under continuous load?: At full computational load, the TMS320C6727BZDH275 can dissipate several watts due to its 275MHz operation and 1.20V core voltage. The 0°C to 90°C TC operating range assumes adequate heat sinking via the BGA substrate. Without proper thermal vias and a grounded copper pour, localized hot spots may develop, triggering thermal throttling or reducing long-term reliability. In enclosed systems, airflow or heatsinking becomes critical—especially when ambient temperatures approach 70°C. Power estimation tools from Texas Instruments should be used early in the design phase to model worst-case thermal profiles and avoid derating surprises.

How does the peripheral set of the TMS320C6727BZDH275 support multi-channel audio or data acquisition systems?: The integrated McASP (Multichannel Audio Serial Port) enables synchronous TDM or I2S streaming across multiple channels, making the TMS320C6727BZDH275 suitable for professional audio mixing or beamforming microphone arrays. Combined with SPI and I2C, it allows daisy-chaining of ADC/DAC devices while maintaining sample-accurate synchronization. The HPI (Host Port Interface) facilitates low-overhead communication with an external microcontroller or FPGA, useful in master-slave configurations where the DSP handles algorithm execution while a host manages user interface or network protocols. However, shared bus arbitration between peripherals can create contention, requiring careful scheduling to meet real-time deadlines.

What boot configuration options are available for the TMS320C6727BZDH275, and how do they impact system startup time?: The TMS320C6727BZDH275 boots from internal ROM, which contains a bootloader that supports multiple initialization paths including HPI, SPI, and parallel EMIF. This allows flexible firmware loading from external flash, EEPROM, or a host processor. However, the 384kB ROM cannot be reprogrammed, so application-specific boot code must either fit within this space or be staged through secondary loading. Boot time varies significantly: HPI boot is fastest but requires an active host, while SPI flash boot adds 50–200ms depending on clock rate and image size. For safety-critical systems, dual-image redundancy in external memory may be necessary, further extending initialization sequences.

How does the TMS320C6727BZDH275 compare to the TMS320C674x series in terms of power efficiency and integration for portable DSP applications?: While the TMS320C6727BZDH275 offers higher clock performance at 275MHz, the C674x series typically integrates more on-chip peripherals (e.g., LCD controller, enhanced timers) and supports lower core voltages (down to 1.0V), resulting in better mA/MHz efficiency. For battery-operated devices like handheld analyzers or wearable sensors, the C674x may provide longer runtime despite lower peak throughput. The TMS320C6727BZDH275 remains preferable when raw floating-point throughput outweighs power constraints, such as in line-powered industrial automation or baseband processing units where thermal headroom is available.

What design verification steps are recommended to ensure signal integrity on the high-speed interfaces of the TMS320C6727BZDH275?: Critical interfaces like McASP and EBI/EMI operate at speeds where transmission line effects dominate. Designers should perform pre-layout simulation of clock and data traces, ensuring impedance matching (typically 50Ω single-ended) and minimizing stub lengths. The 256-BGA package introduces significant parasitic inductance; decoupling capacitors must be placed within 2mm of power pins with low-inductance mounting. Post-layout SI/PI analysis should validate setup/hold margins, especially when interfacing with external SDRAM. Additionally, ground return paths beneath high-speed signals must be uninterrupted to prevent crosstalk, and differential pairs (if used) require tightly matched lengths (±50ps skew tolerance).

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TMS320C6727BZDH275

Product Attribute
Part Number	TMS320C6727BZDH250	TMS320C6727ZDH250	TMS320C6727BZDHMUD	TMS320C6727GDH250
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Voltage - I/O	-	-	-	-
Interface	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Non-Volatile Memory	-	-	-	-
Type	-	-	-	-
Voltage - Core	-	-	-	-
Clock Rate	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Series	-	-	-	-
On-Chip RAM	-	-	-	-

TMS320C6727BZDH275 Datasheet PDF

Download TMS320C6727BZDH275 pdf datasheets and Texas Instruments documentation for TMS320C6727BZDH275 - Texas Instruments.

PCN Packaging: New Tray 14/Sep/2020.pdf
HTML Datasheet: TMSDC6727B/26B/22B/20.pdf

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

Use your express account for shipment if you have one.
Use our account for the shipment. Refer to the table below for the approximate charges.

(Different time frame / countries / package size has different price.)

Delivery Method

Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

QC (Quality Warranty)
Payment Support
Packaging
Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.

Strict quality inspection builds a solid foundation for electronic component quality.

Visual inspection
Performance testing and reliability verification
Standardized full-process testing
Precise control of every parameter

We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Quality Inspection

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner

Efficient Supply Management
Cost-Saving Procurement
Fast Sourcing & Delivery

Contact us if you have any questions.

Phone: +00852 9146 4856
Email: info@allelco.com

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification

ISO 9001: 2015
ISO 13485: 2016
ISO 14001: 2015
ISO 28000: 2007
ISO 45001: 2018
GB/T 27922-2011

SMTA
IPC
ESD
PSMA