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Home Products Integrated Circuits (ICs)Embedded - DSP (Digital Signal Processors)~~TMS320C6727BZDHMUD~~

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TMS320C6727BZDHMUD - Texas Instruments

Name: Texas Instruments TMS320C6727BZDHMUD
Brand: Texas Instruments
SKU: TMS320C6727BZDHMUD
Price: 7.91 USD
Availability: InStock
Rating: 5 (4 reviews)

Manufacturer Part Number: TMS320C6727BZDHMUD

Manufacturer: Texas Instruments

Allelco Part Number: 98D-TMS320C6727BZDHMUD

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 38,459 pcs available, New & Original

Parts Description: IC FLOATING POINT DSP 256BGA

Package: 256-BGA (17x17)

Data sheet: TMS320C6727BZDH.pdf

PCN Packaging
2.73KHz.pdf

HTML Datasheet
TMS320C672x(B).pdf

RoHs Status: ROHS3 Compliant

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In stock: 38459

Unit Price: $21.57
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Quantity	Unit Price	Ext. Price
1+	$21.57	$21.57
200+	$8.35	$1,670.00
500+	$8.05	$4,025.00
1000+	$7.91	$7,910.00

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TMS320C6727BZDHMUD Tech Specifications
Texas Instruments - TMS320C6727BZDHMUD technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TMS320C6727BZDHMUD

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - I/O	3.30V
Type	Floating Point
Supplier Device Package	256-BGA (17x17)
Series	TMS320C672x
Package / Case	256-BGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 90°C (TC)
On-Chip RAM	288kB
Non-Volatile Memory	ROM (384kB)
Mounting Type	Surface Mount
Interface	EBI/EMI, HPI, I²C, McASP, SPI
Base Product Number	TMS320

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Frequently Asked Questions(FAQ)

How does the TMS320C6727BZDHMUD compare to other floating-point DSPs in terms of on-chip memory and interface flexibility for embedded signal processing applications?: The TMS320C6727BZDHMUD offers a balanced combination of 288kB of on-chip RAM and 384kB of ROM, providing sufficient local storage for real-time algorithm execution without external memory bottlenecks. Its support for multiple interfaces—including EBI/EMI, HPI, I2C, McASP, and SPI—enables seamless integration with peripherals such as sensors, ADCs, and communication modules. Compared to fixed-point DSPs like the C64x series, the C6727’s floating-point unit (FPU) reduces software complexity and improves dynamic range, making it more suitable for applications involving complex math operations like FFTs or control algorithms. However, when compared to higher-end C674x devices, the C6727 lacks some advanced features such as dual-core capabilities or enhanced cache hierarchies, limiting scalability in high-throughput environments.

What are the key thermal and electrical constraints when integrating the TMS320C6727BZDHMUD into a system operating at industrial temperature ranges?: The TMS320C6727BZDHMUD is rated for an operating junction temperature of 0°C to 90°C (TC), which aligns with standard industrial temperature conditions but excludes extreme environments such as automotive or aerospace systems requiring wider margins. At full load, power dissipation can reach approximately 1.2W under typical 3.3V I/O operation, necessitating careful PCB layout with adequate copper pour and thermal vias beneath the 256-BGA package to maintain junction temperature within safe limits. Since the device uses a 17x17 mm ball grid array with fine-pitch BGA balls, solder joint reliability under thermal cycling must be evaluated using IPC-9701 standards. Additionally, voltage regulators supplying the core must maintain stability across the entire temperature range to avoid timing violations or functional errors.

In what types of embedded systems would the TMS320C6727BZDHMUD be preferred over microcontrollers with integrated FPU?: The TMS320C6727BZDHMUD is well-suited for applications requiring high-performance digital signal processing, such as audio filtering, motor control with field-oriented algorithms, radar echo analysis, and software-defined radio front ends. Unlike microcontrollers with basic FPUs, the C6727’s VLIW architecture allows parallel execution of multiple instructions per cycle, achieving sustained throughput of up to 1,000 MFLOPS. This makes it ideal where deterministic latency and floating-point precision outweigh cost and power efficiency considerations. For simpler sensor data aggregation or low-rate control loops, ARM Cortex-M7 or RISC-V-based MCUs may offer better power-to-performance ratios, but for compute-intensive tasks involving matrix operations or real-time spectral analysis, the C6727 remains competitive due to its optimized instruction set and memory subsystem.

How should designers evaluate the impact of the TMS320C6727BZDHMUD’s memory architecture on real-time task scheduling?: The TMS320C6727BZDHMUD features a tightly coupled memory (TCM) organization that divides the 288kB of on-chip RAM into configurable blocks accessible via separate buses, reducing contention between data and program fetches. This design supports deterministic access latencies critical for hard real-time systems. Designers should allocate time-sensitive code and frequently accessed buffers into TCM regions to minimize jitter from off-chip memory accesses. Given the absence of a hardware cache, software-based caching strategies or DMA-assisted data transfers become essential for maintaining performance during bursty data streams. When compared to systems using external SDRAM with refresh overhead, the integrated memory eliminates DRAM controller complexity but demands careful partitioning to avoid memory bandwidth saturation under concurrent read/write operations.

What are the implications of using the TMS320C6727BZDHMUD in a RoHS3-compliant product line regarding material sourcing and manufacturing processes?: As a RoHS3-compliant device, the TMS320C6727BZDHMUD meets the latest restrictions on hazardous substances, including stricter limits on phthalates and expanded halogen content controls. This ensures compatibility with modern lead-free assembly lines and global regulatory frameworks such as EU ELV and China RoHS. Manufacturers must verify that their PCB laminate materials, soldering fluxes, and conformal coatings also adhere to RoHS3 specifications to prevent rework or rejection during qualification testing. While the device itself poses no compliance risk, system-level integration requires end-to-end traceability and documentation to support audits. The MSL rating of Level 3 (168 hours) further mandates controlled storage conditions post-reflow to mitigate moisture-induced popcorning during reflow soldering.

Can the TMS320C6727BZDHMUD be used in safety-critical applications, and what development tools and certifications support this?: While the TMS320C6727BZDHMUD does not carry formal safety integrity level (SIL) or functional safety certifications like ISO 26262 or IEC 61508 out-of-the-box, it can still be employed in safety-relevant systems through proper architectural mitigations. Developers can leverage TI’s Code Composer Studio with static analysis plugins and use lockstep execution modes if paired with redundant cores—though the C6727 is single-core. Software redundancy, watchdog timers, and error-correcting codes for memory accesses can enhance fault tolerance. Development kits such as the TMS320C6727 EVM include diagnostic firmware and boundary scan support, facilitating validation of timing constraints and memory consistency. However, achieving ASIL certification would require additional hardware monitoring circuitry and rigorous failure mode analysis beyond the processor alone.

What role does the EBI/EMI interface play in extending the TMS320C6727BZDHMUD’s memory capacity beyond its internal resources?: The Enhanced External Memory Interface (EBI/EMI) on the TMS320C6727BZDHMUD enables direct connection to synchronous or asynchronous SRAM, NOR flash, or SDRAM devices, effectively expanding available memory for large datasets or persistent storage. With support for 16-bit and 32-bit data widths and configurable wait states, the interface accommodates various peripheral timings while maintaining pipeline efficiency. For example, interfacing with a 256Mb QSPI NOR flash allows boot code execution directly from non-volatile memory, while external DDR2 could support video frame buffering in vision systems. Careful attention to address decoding and bus arbitration logic is required to avoid conflicts with other masters like the HPI host port. Compared to using only internal ROM, this flexibility supports larger application footprints without sacrificing performance.

How does the presence of both HPI and McASP interfaces influence system architecture decisions when selecting the TMS320C6727BZDHMUD?: The Host Port Interface (HPI) enables efficient data exchange between the TMS320C6727BZDHMUD and an external host processor such as a microcontroller or FPGA, facilitating configuration management and data logging without CPU intervention. Meanwhile, the Multi-channel Audio Serial Port (McASP) supports multi-channel, high-fidelity audio transmission at sample rates exceeding 96 kHz, ideal for professional audio equipment or VoIP gateways. These dual interfaces allow asymmetric workload distribution: the host handles protocol stacks and user interfaces, while the DSP executes real-time audio encoding/decoding. This separation reduces interrupt overhead and improves overall system responsiveness. However, shared memory between HPI and McASP traffic must be managed carefully to prevent buffer underruns, especially in low-latency scenarios demanding precise synchronization across serial links.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TMS320C6727BZDHMUD

Product Attribute
Part Number	TMS320C6727BZDH275	TMS320C6727BZDH300	TMS320C6727BZDH250	TMS320C6727ZDHA250
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Type	-	-	-	-
Non-Volatile Memory	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Interface	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
On-Chip RAM	-	-	-	-
Series	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Voltage - I/O	-	-	-	-

TMS320C6727BZDHMUD Datasheet PDF

Download TMS320C6727BZDHMUD pdf datasheets and Texas Instruments documentation for TMS320C6727BZDHMUD - Texas Instruments.

PCN Packaging: 2.73KHz.pdf
HTML Datasheet: TMS320C672x(B).pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

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