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Home Products Integrated Circuits (ICs)Embedded - DSP (Digital Signal Processors)~~TMS320C6727ZDH300~~

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TMS320C6727ZDH300 - Texas Instruments

Name: Texas Instruments TMS320C6727ZDH300
Brand: Texas Instruments
SKU: TMS320C6727ZDH300
Availability: InStock
Rating: 5 (9 reviews)

Manufacturer Part Number: TMS320C6727ZDH300

Manufacturer: Texas Instruments

Allelco Part Number: 98D-TMS320C6727ZDH300

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 6,787 pcs available, New & Original

Parts Description: IC FLOATING-POINT DSP 256-BGA

Package: 256-BGA (17x17)

Data sheet: -

RoHs Status: ROHS3 Compliant

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In stock: 6787

Specifications

TMS320C6727ZDH300 Tech Specifications
Texas Instruments - TMS320C6727ZDH300 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TMS320C6727ZDH300

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - I/O	3.30V
Voltage - Core	1.20V
Type	Floating Point
Supplier Device Package	256-BGA (17x17)
Series	TMS320C672x
Package / Case	256-BGA
Package	Tube

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 90°C (TC)
On-Chip RAM	288kB
Non-Volatile Memory	ROM (384kB)
Mounting Type	Surface Mount
Interface	EBI/EMI, HPI, I²C, McASP, SPI
Clock Rate	300MHz
Base Product Number	TMS320

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Frequently Asked Questions(FAQ)

What are the key architectural differences between the TMS320C6727ZDH300 and other floating-point DSPs in the TMS320C672x series, particularly in terms of memory hierarchy and computational throughput?: The TMS320C6727ZDH300 features a single-core VLIW architecture with six functional units capable of executing up to 12 operations per cycle at 300MHz, delivering peak performance of approximately 3.6 GFLOPS. Unlike some dual-core variants in the C672x family, it maintains a unified memory space with 384kB of on-chip ROM and 288kB of RAM distributed across L1 and L2 memory blocks. This configuration provides higher instruction-level parallelism but lacks the inter-processor communication overhead seen in multi-core implementations, making it more suitable for tightly coupled signal processing tasks where data locality is critical.

How does the TMS320C6727ZDH300's power consumption profile compare to contemporary fixed-point DSPs when operating at full clock speed, and what design considerations arise from its dual voltage architecture?: At 300MHz, the TMS320C6727ZDH300 consumes approximately 1.2W typical power with core voltage at 1.2V and I/O at 3.3V. Compared to equivalent-performance fixed-point devices like the TMS320C6674, this represents a 40-50% increase in dynamic power due to floating-point arithmetic overhead. The dual voltage requirement necessitates careful power sequencing during startup and requires level shifters or voltage translators when interfacing legacy 5V logic peripherals, adding complexity to mixed-voltage system designs.

In real-time embedded applications requiring deterministic latency, how does the TMS320C6727ZDH300's cache behavior affect worst-case execution time analysis compared to software-managed memory approaches?: The TMS320C6727ZDH300 implements a Harvard architecture with separate instruction and data caches that can introduce variable latency depending on cache hits/misses. For latency-critical applications such as motor control feedback loops, direct memory access through the EBI/EMI interface bypassing cache layers may be necessary to achieve predictable sub-microsecond response times. This typically reduces average performance by 15-20% but ensures timing predictability essential for safety-certified systems.

When selecting between the TMS320C6727ZDH300 and ARM Cortex-M7 processors for digital filter implementations, what factors beyond raw FLOPS should influence the decision regarding floating-point unit utilization efficiency?: While the TMS320C6727ZDH300 delivers higher theoretical FLOPS, ARM Cortex-M7 processors often demonstrate better energy efficiency per operation due to simpler pipeline structures and lower clock frequencies (typically 200-400MHz). For FIR filters with less than 100 taps, the Cortex-M7 may complete computations faster due to lower branch misprediction penalties and optimized SIMD instructions. The TMS320C6727ZDH300 becomes advantageous only when implementing complex matrix operations or adaptive algorithms requiring sustained vector processing capabilities beyond what Cortex-M7 can deliver within power constraints.

What considerations apply when using the TMS320C6727ZDH300's McASP module for audio codec interfacing versus SPI-based alternatives in industrial control systems?: The McASP interface on the TMS320C6727ZDH300 supports TDM modes up to 8 channels at 192kHz sample rates with hardware synchronization, reducing CPU overhead for multi-channel audio applications. However, for simple sensor data acquisition via serial interfaces, standard SPI modules provide sufficient bandwidth at lower protocol complexity. SPI achieves reliable point-to-point communication over longer distances (>1m) without requiring precise bit-clock alignment, whereas McASP demands strict timing relationships between frame sync and clock signals that complicate PCB layout and require careful impedance matching in high-speed environments.

How does temperature derating affect the operational stability of the TMS320C6727ZDH300 when deployed in automotive edge computing nodes near power electronics?: Operating near 90°C maximum junction temperature reduces available margin for transient thermal events common in automotive environments with pulsed loads from DC-DC converters. Each 10°C increase above 70°C typically decreases mean time between failures by 20-30% due to electromigration effects in copper interconnects. Designers must ensure adequate airflow or heat sinking to maintain case temperatures below 75°C under peak load conditions, as exceeding 85°C can trigger undocumented clock throttling mechanisms that degrade real-time performance unpredictably.

What impact does the 256-BGA package geometry have on PCB routing density when implementing the TMS320C6727ZDH300 in compact medical imaging devices?: The 17x17mm BGA footprint requires at least 12-layer PCBs with microvias to route all 256 pins, increasing manufacturing cost and decreasing yield rates by 5-10%. Signal integrity challenges include simultaneous switching noise coupling between adjacent balls carrying DDR2 memory interfaces, necessitating careful placement of decoupling capacitors within 2mm of power pins. Thermal management also suffers due to limited exposed pad area, requiring thermal vias under the device to transfer heat to inner ground planes effectively.

How should developers approach debugging floating-point exception handling in the TMS320C6727ZDH300 when encountering NaN propagation issues in radar signal processing algorithms?: Floating-point exceptions in the TMS320C6727ZDH300 are masked by default but can be enabled through the FPSCR register. When NaN values propagate unexpectedly, enable sticky flags for invalid operations and check exponent overflow conditions before division operations. Implement sanity checks using integer comparisons on mantissa bits rather than relying solely on floating-point condition codes, as IEEE 754 compliance allows subtle variations in quiet NaN representation that may bypass standard exception detection mechanisms in optimized code sections.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TMS320C6727ZDH300

Product Attribute
Part Number	TMS320C6727BZDH300	TMS320C6727GDH300	TMS320C6727ZDH250	TMS320C6727ZDHA250
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Clock Rate	-	-	-	-
Type	-	-	-	-
Non-Volatile Memory	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Interface	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Voltage - I/O	-	-	-	-
Series	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Base Product Number	-	DAC34H84	MAX500	ADS62P42
On-Chip RAM	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Voltage - Core	-	-	-	-

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
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