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Home Products Integrated Circuits (ICs)Embedded - DSP (Digital Signal Processors)~~TMS320C6727GDHA250~~

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TMS320C6727GDHA250 - Texas Instruments

Name: Texas Instruments TMS320C6727GDHA250
Brand: Texas Instruments
SKU: TMS320C6727GDHA250
Availability: InStock
Rating: 5 (3 reviews)

Manufacturer Part Number: TMS320C6727GDHA250

Manufacturer: Texas Instruments

Allelco Part Number: 98D-TMS320C6727GDHA250

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 17,915 pcs available, New & Original

Parts Description: IC FLOATING POINT DSP 256-BGA

Package: 256-BGA (17x17)

Data sheet: -

RoHs Status

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In stock: 17915

Specifications

TMS320C6727GDHA250 Tech Specifications
Texas Instruments - TMS320C6727GDHA250 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TMS320C6727GDHA250

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - I/O	3.30V
Voltage - Core	1.20V
Type	Floating Point
Supplier Device Package	256-BGA (17x17)
Series	TMS320C672x
Package / Case	256-BGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	-40°C ~ 105°C (TC)
On-Chip RAM	288kB
Non-Volatile Memory	ROM (384kB)
Mounting Type	Surface Mount
Interface	EBI/EMI, HPI, I²C, McASP, SPI
Clock Rate	250MHz
Base Product Number	TMS320

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS non-compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Frequently Asked Questions(FAQ)

How does the TMS320C6727GDHA250 handle real-time signal processing workloads given its 288kB of on-chip RAM and 250MHz clock rate, and what considerations apply when designing memory-intensive algorithms?: The TMS320C6727GDHA250’s 288kB of on-chip RAM provides a substantial local storage pool for intermediate data during floating-point operations, which is critical for minimizing external memory access latency. At a 250MHz core frequency, the device delivers sufficient computational throughput to support complex digital filter banks or FFT-based spectral analysis in real time. However, engineers must carefully partition data structures—such as coefficient tables or frame buffers—to fit within this constrained memory space while avoiding bank conflicts. For example, a 1024-point floating-point FFT with double-precision coefficients would consume approximately 8kB, leaving ample margin for stack and heap usage. Still, tasks requiring large lookup tables or streaming I/O without DMA assistance may necessitate external SDRAM or tighter loop unrolling to maintain cycle efficiency.

What are the implications of using the TMS320C6727GDHA250 in safety-critical or long-lifetime applications due to its RoHS non-compliant status and lack of formal certification?: While the TMS320C6727GDHA250 offers strong floating-point performance and integrated peripherals, its RoHS non-compliant designation means it contains restricted substances such as lead or certain brominated flame retardants, limiting its use in consumer electronics or regions enforcing strict environmental regulations. This also affects supply chain planning, as newer designs may require migration to RoHS-compliant derivatives like the C674x series if end-of-life projections exceed five years. Additionally, absence of ISO certifications or automotive-grade qualifications further narrows its applicability in domains such as medical devices or industrial control systems where reliability documentation is mandatory.

How does the TMS320C6727GDHA250 compare to other floating-point DSPs in terms of power efficiency and peripheral integration, particularly when interfacing with analog front-ends via McASP or SPI?: Compared to contemporaries like the TI C64x+ family, the TMS320C6727GDHA250 trades slightly higher static power consumption for superior single-cycle floating-point multiply-accumulate (FMA) capability, making it better suited for algorithm-heavy workloads rather than ultra-low-power edge nodes. Its inclusion of multiple serial ports—including McASP for TDM audio and SPI for sensor communication—reduces reliance on external logic compared to older architectures. However, unlike modern SoCs with integrated ADCs or Ethernet MACs, this device requires discrete components for mixed-signal conditioning, increasing BOM count but preserving deterministic timing in high-speed data acquisition loops.

Can the TMS320C6727GDHA250 be effectively used in multi-DSP configurations for parallel processing, and how does its HPI interface facilitate such setups?: Yes, the TMS320C6727GDHA250 supports co-processing through its Host Port Interface (HPI), which allows a master processor—typically an ARM or another DSP—to directly access its internal memory and registers. This enables efficient load-balancing strategies where one device manages task scheduling while others execute computationally intensive kernels. For instance, in radar beamforming applications, multiple C6727s could share raw ADC samples via shared memory mapped over HPI, reducing host overhead. Care must be taken to synchronize access and avoid race conditions, especially given the device’s lack of built-in cache coherence mechanisms.

What impact does the 1.2V core voltage have on thermal design and clock scaling capabilities when operating at full 250MHz across the -40°C to 105°C range?: The 1.2V core voltage contributes to relatively low dynamic power dissipation—approximately 1.8W under typical load at 250MHz—but still demands adequate heat spreading in compact layouts. Since the device operates across industrial temperature ranges, PCB materials and airflow must accommodate thermal cycling stresses. Although voltage cannot be scaled dynamically without violating timing closure, clock gating techniques can reduce active power during idle periods. Engineers should verify junction temperatures using IBIS models or worst-case corner simulations, as prolonged operation near 105°C ambient may trigger internal throttling or degrade electromigration margins.

Is the TMS320C6727GDHA250 suitable for booting from external ROM, and how does its 384kB internal ROM affect development workflows?: The TMS320C6727GDHA250 includes 384kB of masked ROM containing boot code and minimal runtime routines, allowing it to initialize basic peripherals without external firmware. However, this ROM is read-only and not user-programmable, so application logic must reside externally. During development, programmers often use JTAG to bypass boot sequences and flash external NOR/NAND memory, accelerating iteration cycles. In production, designers might leverage the ROM for secure key storage or minimal diagnostic firmware before transferring control to encrypted application code stored off-chip.

How does the EBI/EMI interface on the TMS320C6727GDHA250 support connection to common SDRAM or SRAM modules, and what timing constraints should be considered?: The Embedded Bus Interface (EBI) provides flexible address/data multiplexing and programmable wait-state insertion, enabling direct attachment to asynchronous SRAM or synchronous DRAM (SDRAM) without glue logic. Typical configurations include 16-bit wide buses supporting burst transfers up to 100MHz effective data rates. Engineers must account for propagation delays in traces longer than 1 inch, which can necessitate CAS latency adjustments or use of registered clocks in SDRAM interfaces. Also, careful partitioning of address lines and strobe signals is required to meet setup/hold requirements specified in the datasheet’s timing diagrams.

What role does I2C play in configuring the TMS320C6727GDHA250, and can it safely drive legacy sensor peripherals without additional level shifting?: The integrated I2C module simplifies configuration of slave devices such as EEPROMs, temperature sensors, or codec chips during system initialization. With standard-mode speeds up to 100kHz and fast-mode up to 400kHz, it efficiently handles register writes for calibration parameters. Since the I/O bank operates at 3.3V, interfacing with 5V-only sensors requires bidirectional level translators; attempting direct connection risks damaging either the sensor or the DSP. Using open-drain pull-ups compatible with 3.3V logic ensures compatibility across voltage domains while maintaining bus integrity.

How reliable is the TMS320C6727GDHA250 under extended temperature operation, and what failure modes should be anticipated in harsh environments?: Operating across -40°C to 105°C places the TMS320C6727GDHA250 within industrial-grade specifications, but long-term reliability depends on derating practices. Electromigration becomes more pronounced at elevated temperatures, especially in bond wires and vias, potentially leading to latent defects after several thousand hours. Thermal cycling between extremes may induce solder joint fatigue at the 256-BGA package interface. Mitigation strategies include limiting average junction temperature to below 90°C, ensuring uniform PCB thermal distribution, and avoiding rapid power-up sequences that cause localized hotspots.

What are the advantages of using the TMS320C6727GDHA250 over general-purpose microcontrollers for mathematical workloads, and where does it fall short?: Unlike MCUs optimized for control loops and event-driven tasks, the TMS320C6727GDHA250 features a VLIW architecture with eight functional units capable of executing up to six instructions per cycle, including dedicated floating-point pipelines. This makes it ideal for scientific computing, communications modulation/demodulation, or image filtering where raw MFLOPS matter. However, it lacks integrated CAN, USB OTG, or advanced PWM modules found in automotive MCUs, making it less convenient for embedded control applications. Moreover, real-time OS support is limited compared to Cortex-R variants, complicating task scheduling in deterministic systems.

How does the MSL 3 rating affect handling and shelf life for the TMS320C6727GDHA250, and what precautions apply during assembly?: With an MSL 3 classification, the TMS320C6727GDHA250 must be soldered within 168 hours of exposure to ambient humidity to prevent moisture-induced popcorning during reflow. After opening the moisture barrier bag, components should be baked at 125°C for 24 hours if stored beyond this window. Assembly houses must monitor floor life and use dry cabinets, especially in tropical climates. Failure to comply increases risk of delamination at the die attach interface, which can manifest as intermittent faults or immediate post-assembly failure.

Can the TMS320C6727GDHA250 run without external memory, and what functionality would remain available?: Yes, the TMS320C6727GDHA250 can operate entirely from its internal 288kB RAM and 384kB ROM, sufficient for small firmware images or diagnostic routines. This mode eliminates dependency on external memory ICs, reducing board complexity and cost. However, only code size fitting within combined program and data spaces will execute; larger applications require off-chip expansion. Even then, developers must manage stack depth carefully, as interrupt handlers and function call chains consume significant RAM unless optimized for tail recursion or static allocation.

What tools and compiler optimizations are recommended for maximizing performance on the TMS320C6727GDHA250, and how do they interact with its memory hierarchy?: TI’s Code Composer Studio (CCS) with the C6000 compiler provides profile-guided optimization, automatic vectorization for SIMD-like operations, and efficient inline assembly insertion. To exploit the memory architecture, developers should align data to 8-byte boundaries and prefer circular buffer addressing modes to minimize reload overhead. Loop unrolling and software pipelining are particularly effective due to the VLIW nature, but excessive register pressure can negate gains. Profiling with RTDX or hardware breakpoints helps identify bottlenecks hidden by compiler heuristics.

How does the absence of an MMU or cache affect software portability and debugging on the TMS320C6727GDHA250?: Without memory management unit (MMU) or cache, the TMS320C6727GDHA250 enforces flat physical addressing, simplifying driver development but eliminating virtual memory benefits. Debugging becomes more straightforward since memory maps are predictable, yet it increases risk of accidental corruption from pointer errors. Developers must implement their own memory protection schemes if running multiple tasks, relying instead on cooperative multitasking or RTOS abstractions that emulate isolation through careful resource partitioning.

What are the trade-offs between using the TMS320C6727GDHA250 versus FPGA-based solutions for prototyping high-speed digital signal processing algorithms?: The TMS320C6727GDHA250 offers deterministic execution, mature toolchains, and lower unit costs at volume, making it preferable for production-ready designs with fixed algorithms. In contrast, FPGAs allow algorithmic exploration and reconfiguration but introduce longer development cycles and higher per-unit expenses. For instance, implementing a custom CIC decimator may take weeks in HDL versus days in C on the C6727, though FPGAs avoid DSP block limitations. Choice hinges on whether flexibility outweighs deployment timeline and power budget constraints.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TMS320C6727GDHA250

Product Attribute
Part Number	TMS320C6727GDH250	TMS320C6727ZDHA250	TMS320C6727ZDH250	TMS320C6727BZDH250
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Interface	-	-	-	-
Non-Volatile Memory	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
On-Chip RAM	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Type	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Voltage - I/O	-	-	-	-
Series	-	-	-	-
Voltage - Core	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Clock Rate	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount

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Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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America	Brazil	7
Europe	Germany	5
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Oceania	Australia	6
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