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HomeProductsIntegrated Circuits (ICs)PMIC - Power Management - SpecializedTPS658623ZGUT
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TPS658623ZGUT - Texas Instruments

Manufacturer Part Number
TPS658623ZGUT
Manufacturer
Texas Instruments
Allelco Part Number
32D-TPS658623ZGUT
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
6,640 pcs available, New & Original
Parts Description
IC LI-ION BATT/PWR MGMT 169BGA
Package
169-BGA MicroStar (12x12)
Data sheet
TPS658623ZGUT.pdf

PCN Obsolescence/ EOL

Cylindrical Battery Holders.pdf
RoHs Status
ROHS3 Compliant
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In stock: 6640

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Specifications

TPS658623ZGUT Tech Specifications
Texas Instruments - TPS658623ZGUT technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TPS658623ZGUT

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply -
Supplier Device Package 169-BGA MicroStar (12x12)
Series -
Package / Case 169-LFBGA
Package Tape & Reel (TR)
Product Attribute Attribute Value
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Current - Supply -
Base Product Number TPS658623
Applications Display (LED Drivers), Handheld/Mobile Devices, Power Supply

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

Manufacturer Part Number

TPS658623ZGUT

Manufacturer

Texas Instruments

Introduction

The TPS658623ZGUT is a highly integrated power management integrated circuit (PMIC) designed to provide power management solutions for a wide range of applications, including display (LED drivers), handheld/mobile devices, and power supply systems.

Product Features and Performance

Highly integrated PMIC with multiple power rails and peripheral functions

Supports a variety of input voltage ranges and output voltage configurations

Provides efficient power conversion and regulation for various system components

Includes advanced power management features, such as load monitoring, thermal protection, and fault detection

Optimized for low power consumption and extended battery life in portable devices

Product Advantages

Comprehensive power management capabilities in a compact package

Flexible configuration options to meet diverse system requirements

Robust design with built-in safety and protection features

Efficient power conversion for improved energy efficiency and battery life

Key Reasons to Choose This Product

Comprehensive power management solution in a single chip

Optimized for low power, portable applications

Reliable and robust design with advanced safety features

Flexible configuration options to fit a wide range of system requirements

Quality and Safety Features

Robust design with built-in thermal protection and fault detection

Meets industry safety and reliability standards

Rigorous testing and quality control processes

Compatibility

The TPS658623ZGUT is designed to be compatible with a wide range of electronic devices and systems, including handheld/mobile devices, display applications, and power supply systems.

Application Areas

Display (LED drivers)

Handheld/mobile devices

Power supply systems

Product Lifecycle

The TPS658623ZGUT is an obsolete product, meaning it is no longer in active production. However, there may be equivalent or alternative models available from Texas Instruments. Customers are advised to contact our website's sales team for more information on alternative solutions.

Frequently Asked Questions(FAQ)

What are the key design considerations when integrating the TPS658623ZGUT into a handheld device with multiple power rails and LED backlight requirements?
The TPS658623ZGUT is optimized for handheld and mobile applications requiring integrated power management, including battery charging, system power sequencing, and display backlighting. When designing with this PMIC, engineers must account for its 169-BGA MicroStar (12x12) package footprint and ensure thermal management is addressed due to high pin density and current handling across multiple regulators. Careful attention to power rail sequencing—particularly between core logic, I/O, and display drivers—is essential to prevent latch-up or brownout conditions during transitions. Additionally, the device supports dynamic voltage scaling via I2C interface, which allows optimization of efficiency across different operational modes, but requires firmware coordination to avoid instability during mode changes.
How does the TPS658623ZGUT compare to discrete LDO and switching regulator solutions in terms of board space and system efficiency for portable electronics?
Compared to discrete LDOs and external buck/boost converters, the TPS658623ZGUT offers significant advantages in integration density and design simplification for portable devices. Its single-chip solution consolidates battery charging, step-down conversion, LED driver functionality, and power sequencing logic, reducing component count by up to 60% compared to traditional architectures. While individual discrete regulators can achieve higher peak efficiencies under light loads, the TPS658623ZGUT’s integrated architecture delivers competitive efficiency (>85% typical in active modes) while minimizing parasitic losses from interconnections. This integration also reduces PCB real estate by approximately 40%, critical for compact form factors like smartphones and tablets, though it may limit flexibility in output voltage selection or transient response tuning.
Can the TPS658623ZGUT support simultaneous operation of a main processor and a camera module during video capture without exceeding thermal limits?
Yes, the TPS658623ZGUT can manage simultaneous high-current loads such as a main SoC and camera module during video recording, provided the total power dissipation remains within thermal constraints. The device includes dedicated high-efficiency buck converters capable of delivering up to 1.5A per rail, with internal current limiting and thermal shutdown protection. However, sustained combined loads near maximum ratings generate significant heat in the 12x12 mm BGA package, necessitating adequate copper pour and thermal vias on the PCB underside. In typical smartphone configurations drawing 2–3A total from the PMIC under full load, junction temperatures may rise above ambient by 40–50°C, so layout optimization and airflow consideration are recommended to maintain safe operating conditions.
What precautions should be taken when using the TPS658623ZGUT to drive high-brightness OLED displays with pulsed current demands?
Driving high-brightness OLED displays with pulsed current demands requires careful attention to the TPS658623ZGUT’s LED driver architecture and transient response capabilities. The device features programmable boost converter outputs capable of sourcing up to 2.5A peak current, making it suitable for LED string driving. However, fast edge rates in display refresh cycles can induce ringing on the output capacitors if not properly decoupled. Designers should use low-ESR ceramic capacitors close to the LED terminals and ensure sufficient bulk capacitance at the input of the boost stage to handle instantaneous current surges without collapsing the supply voltage. Additionally, enabling spread-spectrum switching in the boost converter minimizes EMI interference that could affect sensitive display timing signals.
Is the TPS658623ZGUT suitable for battery-powered IoT devices requiring long standby lifetimes?
The TPS658623ZGUT supports efficient operation in battery-powered IoT applications through its low quiescent current (typically <10 µA in shutdown mode) and adaptive control algorithms that reduce switching frequency during light loads. In sleep-mode scenarios where only a few peripherals remain active, the device maintains efficiency above 75% even at 10 mA output currents, extending battery life compared to fixed-frequency regulators. However, for ultra-low-power designs targeting years of operation from coin-cell batteries, additional external low-dropout linear regulators may still be preferable for certain rails. The TPS658623ZGUT excels in hybrid workloads where moderate processing occurs periodically but spends significant time in deep sleep.
How does the Moisture Sensitivity Level (MSL) rating of MSL 3 impact reflow soldering process planning for assemblies using the TPS658623ZGUT?
With an MSL 3 rating indicating a floor life of 168 hours before baking is required, proper storage and handling procedures must be followed to prevent popcorning during reflow. The TPS658623ZGUT, housed in a 169-LFBGA package, is susceptible to moisture absorption over time, especially in humid environments. Manufacturers should track component usage after opening the original sealed bag and bake parts if more than 168 hours have elapsed unless stored in a dry cabinet with desiccant. During reflow, peak temperatures must not exceed the solder alloy melting point (typically 240–260°C), and dwell times above liquidus should be minimized to preserve bond reliability. Adherence to IPC-J-STD-033 guidelines ensures process integrity.
Can the TPS658623ZGUT operate reliably in automotive-grade temperature ranges, or is it limited to industrial use?
No, the TPS658623ZGUT is rated for operation from -40°C to +85°C, which aligns with commercial and industrial standards but falls short of AEC-Q100 Grade 2 (up to 105°C). Therefore, while suitable for non-automotive handheld or consumer mobile devices, it is not qualified for harsh automotive environments where extended temperature cycling or vibration resistance is required. For automotive applications, Texas Instruments offers alternative PMICs like the TPS65288 or TPS65990 with higher temperature tolerances and functional safety certifications. Engineers selecting the TPS658623ZGUT must confirm their target environment does not demand stricter environmental robustness beyond standard industrial specifications.
What role does the I2C interface play in optimizing power delivery with the TPS658623ZGUT, and how can it be leveraged during system boot-up?
The TPS658623ZGUT incorporates an I2C-compatible interface that enables dynamic configuration of power rails, monitoring registers, and fault responses. During boot-up, this interface allows the host processor to sequence voltage ramps, adjust output levels based on load needs, and monitor battery state-of-charge before handing off control. For example, the host can initiate a soft-start sequence, set precharge thresholds for Li-Ion cells, or disable unused peripherals to reduce inrush current. Post-boot, the I2C bus facilitates runtime adjustments such as dimming LED brightness or throttling CPU voltage during thermal events. Proper initialization timing—ensuring I2C communication begins before critical rails are enabled—is crucial to avoid undefined states.
Are there any limitations in using the TPS658623ZGUT for USB Power Delivery (USB-PD) compliant fast charging applications?
The TPS658623ZGUT supports Li-Ion battery charging with configurable input current limits, but it lacks native USB-PD protocol negotiation capability. While it can implement basic constant-current/constant-voltage (CC/CV) charging profiles compliant with legacy standards like BC1.2 or proprietary fast-charging methods such as Qualcomm Quick Charge, full USB-PD compliance requires an external PD controller. To support USB-PD with the TPS658623ZGUT, engineers must pair it with a separate IC that handles protocol signaling and dynamically adjusts VBUS voltage/current commands. This adds complexity but retains the benefits of the TPS658623ZGUT’s integrated power distribution for system rails.
How does the choice of input capacitor value affect stability when using the TPS658623ZGUT with noisy power sources such as wireless charging coils?
When powered by inductive coupling via wireless charging coils—common in Qi-enabled devices—the input stage of the TPS658623ZGUT must filter high-frequency noise induced during energy transfer. Insufficient input capacitance leads to voltage droop and potential instability in the switching regulators, especially under transient load steps. A minimum input capacitance of 10 µF ceramic (X5R or X7R dielectric) is typically required, but for robust performance near the 100 kHz to 2 MHz switching frequencies of the internal converters, values up to 22 µF with low ESR help dampen oscillations. Placement should be as close as possible to the VIN pins to minimize loop inductance and ensure clean power delivery despite AC ripple from the rectified wireless input.
What are the implications of selecting a lower-than-recommended output capacitor for the LED driver rails on the TPS658623ZGUT?
Selecting a lower-than-recommended output capacitor for the LED driver rails on the TPS658623ZGUT risks reduced transient response and potential regulation instability. The LED boost converter relies on sufficient output capacitance to maintain stable feedback during rapid current pulses from dimming or scanning sequences. Using capacitors with too low capacitance or excessive ESR increases output ripple and can cause the feedback loop to oscillate or fail to regulate accurately, leading to flickering LEDs or inaccurate brightness control. Texas Instruments recommends specific combinations of capacitance and ESR based on target current and switching frequency; deviating from these guidelines compromises both performance and reliability in display-intensive applications.
Can the TPS658623ZGUT support hot-swapping of batteries without risking damage to internal circuits?
The TPS658623ZGUT is not designed for true hot-swappable battery replacement under load. While it includes reverse-current protection and undervoltage lockout features, hot-swapping introduces surge transients and voltage differentials that may stress internal ESD structures or cause latch-up in the absence of external protection circuitry. If hot-swap capability is required, engineers should implement series fuses, TVS diodes, and ideal diode controllers at the battery input path prior to connecting to the TPS658623ZGUT’s VBAT pin. These measures isolate the PMIC from abrupt voltage changes and ensure safe operation during battery insertion or removal.
How does the TPS658623ZGUT handle fault conditions such as overvoltage on auxiliary rails versus core logic rails?
The TPS658623ZGUT provides differentiated fault protection tailored to each output rail. Core logic rails (e.g., VDD_CORE) typically employ hiccup-mode overcurrent protection that disables the converter until the fault clears, preventing thermal runaway. In contrast, auxiliary rails such as those driving LEDs may feature cycle-by-cycle current limiting to maintain functionality during overloads like shorted strings. Overvoltage faults on regulated outputs trigger immediate shutdown via internal comparators, with status reported through the I2C interface. This granular approach balances system resilience with continued usability in peripheral circuits during transient faults, avoiding unnecessary system resets while safeguarding sensitive loads.
What impact does improper grounding strategy have on EMI performance when routing signals near the TPS658623ZGUT’s switching nodes?
Improper grounding near the TPS658623ZGUT’s high-speed switching nodes significantly degrades EMI performance and can couple noise into analog or RF-sensitive circuits. The device’s internal regulators operate at frequencies ranging from 1.2 MHz to 2.4 MHz, generating conducted emissions that radiate via poor return paths. A solid ground plane beneath the BGA package acts as a shield and reference plane, minimizing loop area for switching currents. Splitting grounds or placing digital traces parallel to power inductors exacerbates crosstalk and increases radiated emissions beyond regulatory limits (e.g., FCC Part 15). Proper layout requires tight coupling of input/output capacitors to the same ground node and isolation of noisy switching loops from quiet signal paths.
Is it possible to cascade multiple TPS658623ZGUT units to increase total output current capacity?
Cascading multiple TPS658623ZGUT devices is neither supported nor recommended by Texas Instruments. Each unit manages independent power rails with dedicated control logic, and attempting to share loads across devices introduces synchronization challenges, unequal current sharing, and potential race conditions during startup/shutdown sequences. Furthermore, the I2C interface is designed for single-master communication, complicating multi-device addressing. Instead, designers seeking higher aggregate current should consider using higher-current variants within the same family (if available) or redesign the power architecture around a single PMIC with sufficient margin for future scalability. Parallel operation of identical PMICs requires extensive validation and is outside the intended application scope.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TPS658623ZGUT

Product Attribute TPS658621DZGUT TPS658623ZGUR TPS658623ZQZT TPS658630ZQZT
Part Number TPS658621DZGUT TPS658623ZGUR TPS658623ZQZT TPS658630ZQZT
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Voltage - Supply - - - -
Applications - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Base Product Number - DAC34H84 MAX500 ADS62P42
Mounting Type - Surface Mount Through Hole Surface Mount
Series - - - -
Current - Supply - - - -

TPS658623ZGUT Datasheet PDF

Download TPS658623ZGUT pdf datasheets and Texas Instruments documentation for TPS658623ZGUT - Texas Instruments.

PCN Obsolescence/ EOL
Cylindrical Battery Holders.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Texas Instruments

TPS658623ZGUT

Texas Instruments
32D-TPS658623ZGUT

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