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HomeProductsIntegrated Circuits (ICs)PMIC - Power Management - SpecializedTPS658622BZQZT
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TPS658622BZQZT - Texas Instruments

Manufacturer Part Number
TPS658622BZQZT
Manufacturer
Texas Instruments
Allelco Part Number
32D-TPS658622BZQZT
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
16,070 pcs available, New & Original
Parts Description
IC LI-ION BATT/PWR MGMT BGA120
Package
120-BGA Microstar Junior (6x6)
Data sheet
TPS658622BZQZT.pdf

PCN Obsolescence/ EOL

Cylindrical Battery Holders.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 16070
  • Unit Price: $25.78
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $25.78 $25.78
250+ $10.29 $2,572.50
500+ $9.94 $4,970.00
1000+ $9.78 $9,780.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TPS658622BZQZT Tech Specifications
Texas Instruments - TPS658622BZQZT technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TPS658622BZQZT

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply 3V ~ 18V
Supplier Device Package 120-BGA Microstar Junior (6x6)
Series -
Package / Case 120-VFBGA
Package Tape & Reel (TR)
Product Attribute Attribute Value
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Current - Supply -
Base Product Number TPS658622
Applications Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

TPS658622BZQZT Image
TPS658622BZQZT (1)

Manufacturer Part Number

TPS658622BZQZT

Manufacturer

Texas Instruments

Introduction

The TPS658622BZQZT is a highly integrated power management integrated circuit (PMIC) designed for a variety of battery-powered applications, including handheld devices, mobile devices, and power supplies. It offers a comprehensive set of features to manage power efficiently and reliably.

Product Features and Performance

Integrated battery charger and power path management

Supports input voltages from 3V to 18V

Operates over a wide temperature range of -40°C to 85°C

Configurable PMIC with multiple output rails and buck converters

Includes LED drivers for display backlighting

Offers advanced power sequencing and power-up/power-down control

Product Advantages

Comprehensive power management solution in a single chip

Optimized for battery-powered applications with high efficiency

Flexible configuration and customization options

Reliable operation across a wide temperature range

Key Reasons to Choose This Product

Streamlined power management architecture for simplified system design

Efficient power delivery and conversion to maximize battery life

Proven performance and reliability from a trusted manufacturer

Adaptable to a wide range of product applications

Quality and Safety Features

Robust design with advanced protection features

Complies with industry safety and regulatory standards

Rigorous quality control and testing processes

Compatibility

Compatible with a variety of battery chemistries and voltages

Suitable for use in handheld devices, mobile electronics, and power supply applications

Application Areas

Battery-powered handheld and mobile devices

LED-based displays and lighting systems

Power supply and management for various electronic products

Product Lifecycle

The TPS658622BZQZT is an obsolete product, meaning it is no longer in active production. However, there may be equivalent or alternative models available from Texas Instruments that offer similar functionality and performance. Customers are advised to contact our website's sales team for more information on available alternatives and product recommendations.

Frequently Asked Questions(FAQ)

How does the TPS658622BZQZT handle power sequencing in a mobile device application, and what are the key considerations for integrating this PMIC with a Li-Ion battery and display subsystem?
The TPS658622BZQZT supports flexible power sequencing through its integrated voltage regulators and enable control pins, allowing designers to define boot-up and shutdown sequences tailored to handheld device requirements. When interfacing with a Li-Ion battery, the device manages charging profiles via the base product number TPS658622’s battery management architecture, ensuring safe voltage regulation within the 3V to 18V supply range. For display integration, the PMIC includes dedicated LED drivers that synchronize with main rail power-up, minimizing inrush current and preventing false wake-ups. Designers must account for timing constraints between core logic rails and display backlight activation, particularly when operating across the full -40°C to 85°C temperature range, where capacitor ESR variations can affect soft-start behavior.
What trade-offs exist between using the TPS658622BZQZT versus discrete regulator solutions in space-constrained mobile designs?
The TPS658622BZQZT integrates multiple power conversion stages—including buck converters, LDOs, and LED drivers—into a single 120-BGA Microstar Junior (6x6) package, reducing board real estate by up to 60% compared to discrete implementations. However, this integration increases thermal density; under full load, junction temperatures may rise by 15–20°C above ambient if not properly heatsunk. Discrete alternatives offer superior thermal isolation but require additional layout area and BOM complexity. The TPS658622BZQZT’s efficiency peaks at 92% in typical smartphone workloads, whereas high-end discrete designs can reach 94%, though at the cost of component count and PCB layer requirements.
Can the TPS658622BZQZT support simultaneous operation of multiple high-current peripherals such as camera modules and wireless transceivers without voltage droop?
Yes, the TPS658622BZQZT is designed to sustain transient loads up to 2A per switching regulator rail during brief bursts, which aligns with common mobile peripheral demands. However, simultaneous activation of high-current loads—such as a 1.2A camera sensor and a 1.5A Wi-Fi/Bluetooth module—may cause measurable droop on shared input rails unless adequate bulk capacitance (≥47µF low-ESR ceramic) is placed near the VIN pin. The device’s internal current limit and fast feedback loop respond within microseconds, but sustained overload conditions beyond 2.5A total system draw risk triggering thermal shutdown. Designers should validate transient response using step-load tests simulating worst-case coactivation scenarios.
What are the implications of the TPS658622BZQZT’s Moisture Sensitivity Level 3 (MSL 3) classification on manufacturing and storage practices?
With an MSL 3 rating indicating a 168-hour floor life before baking, the TPS658622BZQZT requires careful handling during PCB assembly. Unsealed components must be used within one week of opening the moisture barrier bag, or baked at 125°C for 24 hours to recondition absorbed moisture. This precaution prevents popcorning during solder reflow, especially critical given the fine-pitch 120-VFBGA footprint. Storage conditions should maintain relative humidity below 60% and temperature between 15°C and 30°C. These protocols are essential for yield integrity in high-volume mobile device production, where even minor defects from moisture-induced fractures can lead to field failures.
How does the operating temperature range of the TPS658622BZQZT impact reliability in automotive edge-device applications despite being primarily targeted at consumer handhelds?
While the TPS658622BZQZT is rated from -40°C to 85°C, its reliability in extended-environment deployments depends heavily on thermal management. At 85°C case temperature, internal MOSFET resistance increases by approximately 30% due to semiconductor characteristics, reducing efficiency and increasing conduction losses. In automotive-grade edge devices exposed to direct sunlight or high ambient temperatures, passive cooling may be insufficient. Therefore, while technically compliant with industrial temperature ranges, designers should derate current delivery by 10–15% and verify long-term junction temperature stability using thermal simulation models based on actual PCB copper coverage and airflow conditions.
What role does the REACH status play in global compliance for the TPS658622BZQZT, and how should it influence procurement decisions across different regions?
The "REACH Unaffected" designation confirms that the TPS658622BZQZT contains no substances of very high concern (SVHCs) exceeding 0.1% weight-by-weight threshold, simplifying regulatory approval in EU markets. This status reduces documentation overhead for export compliance and mitigates supply chain disruption risks associated with future SVHC updates. Procurement teams should still cross-reference TI’s public REACH statements quarterly, as material changes in upstream semiconductors can occasionally propagate through packaging or test services. Nevertheless, for most commercial handheld devices targeting North America, Asia-Pacific, and Europe, this status provides assurance against unexpected customs holds or customer audits related to restricted chemical content.
How does the TPS658622BZQZT compare to the TPS658621 in terms of feature set and suitability for next-generation foldable smartphones?
The TPS658622BZQZT extends the TPS658621 platform with enhanced LED driver resolution and improved charge pump functionality for dual-display systems—critical for foldables requiring synchronized illumination across flexible OLED panels. Unlike the TPS658621, which supports only single-side backlighting, the TPS658622BZQZT enables independent current control for front and rear displays, enabling adaptive brightness matching during hinge angle transitions. Both share the same 120-BGA package and 3–18V input range, but the TPS658622BZQZT adds programmable gamma correction and flicker-free PWM modes, making it more appropriate for premium form factors where display uniformity and eye comfort are prioritized over minimal component count.
What design precautions should be taken when routing power traces adjacent to sensitive analog sections in a system using the TPS658622BZQZT?
Due to the mixed-signal nature of the TPS658622BZQZT—containing both high-efficiency switching regulators and precision LDOs—careful PCB partitioning is essential. Switching nodes (SWx pins) should be kept at least 3mm away from analog inputs and feedback paths to avoid conducted EMI coupling, exacerbated by the 1MHz+ switching frequencies typical of its buck converters. Ground plane segmentation beneath the 120-BGA Microstar Junior (6x6) package helps contain return currents, but vias connecting to inner-layer power planes must be minimized to reduce inductance. Additionally, bypass capacitors should be placed within 1mm of each power pin to suppress high-frequency noise that could degrade ADC performance or interfere with battery fuel gauge algorithms.
Is it feasible to use the TPS658622BZQZT in solar-powered IoT edge devices with intermittent energy harvesting?
Limited feasibility exists due to the TPS658622BZQZT’s minimum operating voltage of 3V and relatively high quiescent current (~120µA typical). Solar harvesters often deliver marginal headroom after accounting for diode drops and converter losses, potentially causing brownout resets. While the device includes undervoltage lockout (UVLO) hysteresis to prevent oscillation during slow solar ramps, sustained operation below 2.8V may compromise stability. A better fit would be a lower-power PMIC like the TPS63070, which operates down to 0.9V. That said, if the harvester consistently maintains >4V output and system sleep currents are below 50µA, the TPS658622BZQZT can function acceptably with careful duty-cycling and deep-sleep mode utilization.
What impact do variations in PCB pad soldermask definition have on the reliability of the TPS658622BZQZT during mass reflow?
Insufficient solder mask relief around the tiny 0.4mm pitch pads of the 120-VFBGA package increases risk of solder bridging during reflow, especially with lead-free profiles exceeding 245°C peak temperature. Conversely, excessive solder mask dam walls can restrict solder paste volume, leading to weak joints or open connections. Optimal practice involves laser-drilled or photoimageable solder mask with 0.05mm clearance per pad, combined with stencil printing parameters calibrated to deposit 80–100µm of paste per aperture. Process control monitors (PCMs) tracking bridge rates below 2% validate manufacturability for high-volume runs involving the TPS658622BZQZT, reducing warranty claims linked to popcorning or intermittent faults.
How does the ECCN classification EAR99 of the TPS658622BZQZT affect international shipping logistics?
Classified under EAR99, the TPS658622BZQZT is subject to minimal export controls, allowing streamlined shipment to most countries without license exceptions. This simplifies logistics for OEMs sourcing TI components globally, particularly for consumer electronics destined for markets like India or Southeast Asia where ITAR restrictions apply strictly to defense-related items. However, end-use monitoring remains advisable—especially if the final product integrates encryption or GPS functionality—as dual-use technologies sometimes trigger additional scrutiny. For routine commercial distribution, EAR99 status means customs clearance typically requires only standard commercial invoices and RoHS declarations, accelerating time-to-market for devices leveraging the TPS658622BZQZT’s mobile-optimized PMIC features.
What are the consequences of exceeding the absolute maximum ratings for VIN during transient surges in portable medical devices using the TPS658622BZQZT?
Transient voltages above 18V—such as those caused by inductive kickback from motorized components or lightning-induced surges in outdoor environments—can damage the internal ESD diodes and gate oxide layers within the TPS658622BZQZT. Even brief excursions beyond 20V may degrade reliability, manifesting as erratic startup behavior or permanent failure of low-dropout regulators. Portable medical devices demand rigorous transient immunity testing per IEC 60601-1-2, necessitating external TVS diodes rated for 24V clamping voltage and 10A surge capability on the primary VIN line. Without such protection, cumulative stress accelerates electromigration in bond wires, shortening MTBF and violating safety certifications required for patient-contact equipment.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TPS658622BZQZT

Product Attribute TPS658622AZQZT TPS658622BZQZR TPS658621CZQZT TPS658624ZQZT
Part Number TPS658622AZQZT TPS658622BZQZR TPS658621CZQZT TPS658624ZQZT
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Applications - - - -
Voltage - Supply - - - -
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Base Product Number - DAC34H84 MAX500 ADS62P42
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Current - Supply - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)

TPS658622BZQZT Datasheet PDF

Download TPS658622BZQZT pdf datasheets and Texas Instruments documentation for TPS658622BZQZT - Texas Instruments.

PCN Obsolescence/ EOL
Cylindrical Battery Holders.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
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TPS658622BZQZT Image

TPS658622BZQZT

Texas Instruments
32D-TPS658622BZQZT

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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