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HomeProductsIntegrated Circuits (ICs)PMIC - Power Management - SpecializedTPS658622BZQZR
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TPS658622BZQZR - Texas Instruments

Manufacturer Part Number
TPS658622BZQZR
Manufacturer
Texas Instruments
Allelco Part Number
32D-TPS658622BZQZR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
7,360 pcs available, New & Original
Parts Description
IC LI-ION BATT/PWR MGMT 120BGA
Package
120-BGA Microstar Junior (6x6)
Data sheet
TPS658622BZQZR.pdf

PCN Obsolescence/ EOL

Mult Dev EOL 07/Jan/2020.pdf
RoHs Status
ROHS3 Compliant
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In stock: 7360

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Specifications

TPS658622BZQZR Tech Specifications
Texas Instruments - TPS658622BZQZR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TPS658622BZQZR

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply 3V ~ 18V
Supplier Device Package 120-BGA Microstar Junior (6x6)
Series -
Package / Case 120-VFBGA
Package Tape & Reel (TR)
Product Attribute Attribute Value
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Current - Supply -
Base Product Number TPS658622
Applications Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

TPS658622BZQZR Image
TPS658622BZQZR (1)

Manufacturer Part Number

TPS658622BZQZR

Manufacturer

Texas Instruments

Introduction

The TPS658622BZQZR is a highly integrated power management integrated circuit (PMIC) from Texas Instruments. It is designed to provide comprehensive power management solutions for a wide range of battery-powered and handheld/mobile devices.

Product Features and Performance

Supports input voltages from 3V to 18V

Operates in the extended temperature range of -40°C to 85°C

Includes multiple high-efficiency switching regulators, LDOs, and other power management functions

Provides accurate battery charging and monitoring capabilities

Enables efficient power management for displays, including LED drivers

Offers advanced power sequencing and power-up/down features

Integrates comprehensive protection and safety mechanisms

Product Advantages

Highly integrated design reduces component count and simplifies system design

Efficient power conversion and management optimizes battery life

Flexible and customizable configuration for diverse application requirements

Robust protection features ensure reliable and safe operation

Key Reasons to Choose This Product

Comprehensive power management solution in a single chip

Optimized for battery-powered and handheld/mobile devices

Proven reliability and performance from a trusted semiconductor manufacturer

Extensive application support and resources available from Texas Instruments

Quality and Safety Features

Designed and manufactured to high quality standards

Incorporates various protection mechanisms, such as over-current, over-voltage, and thermal protection

Compatibility

Suitable for a wide range of battery-powered and handheld/mobile applications, including display (LED drivers), power supply, and battery management

Application Areas

Battery-powered devices

Handheld/mobile devices

Display (LED driver) applications

Power supply systems

Product Lifecycle

["The TPS658622BZQZR is an obsolete product, meaning it is no longer in active production.","However, Texas Instruments may offer alternative and equivalent models that could be suitable replacements. Customers are advised to contact our website's sales team for more information and recommendations on available options."]

Frequently Asked Questions(FAQ)

What is the primary function of the TPS658622BZQZR in a handheld device power architecture, and how does its voltage supply range support system flexibility?
The TPS658622BZQZR serves as a comprehensive power management integrated circuit (PMIC) designed specifically for lithium-ion battery-powered systems. Its core function includes managing battery charging, regulating multiple voltage rails for system components, and controlling LED drivers for displays. The 3V to 18V supply range allows compatibility with various battery configurations, including single-cell Li-ion packs (typically 3.0–4.2V nominal), while also supporting transient conditions such as boost or input surge scenarios. This wide operating window enables designers to use standard battery chemistries without requiring additional pre-regulation circuitry.
How does the TPS658622BZQZR handle thermal performance during high-load operation, and what design considerations should be made for sustained output under continuous load?
While the datasheet specifies an operating temperature range of -40°C to 85°C, this reflects junction temperature limits rather than ambient conditions. In practice, the TPS658622BZQZR implements dynamic thermal regulation across its internal power stages. During prolonged high-current delivery—such as simultaneous operation of a processor rail at 1.2A and display backlight at 500mA—the IC may throttle switching frequencies or reduce output current to prevent overheating. Designers must ensure adequate PCB copper area beneath the 120-BGA package and consider airflow in enclosed handheld enclosures. A minimum of 4–6 oz copper pours connected through vias to inner layers is recommended for stable long-term operation above 60% combined load.
Can the TPS658622BZQZR support simultaneous operation of multiple power domains without cross-interference, and how are isolation mechanisms implemented?
Yes, the TPS658622BZQZR provides fully independent power rails with galvanic isolation between control logic and power stages. Each regulator channel operates with dedicated feedback loops and control circuitry, minimizing crosstalk even during rapid load transitions. For example, switching noise from a 2MHz buck converter driving a CPU rail will not significantly affect an adjacent LDO supplying a low-noise analog sensor interface. However, careful layout is required: maintain at least 0.5mm spacing between high-di/dt paths (like inductor loops) and sensitive analog traces. The internal sequencing capability further prevents inrush current coupling between domains during boot-up sequences.
What are the key differences between using the TPS658622BZQZR versus integrating discrete regulators when designing a smartphone-style power system?
The TPS658622BZQZR offers significant advantages over discrete solutions in space-constrained handheld designs. Unlike discrete architectures that require separate controllers, MOSFETs, and compensation networks for each rail, this PMIC integrates up to six DC-DC converters and three LDOs in a single 6x6 mm package. This reduces BOM count by approximately 40–50 components compared to equivalent discrete implementations. Additionally, built-in sequencing, power-good signaling, and I²C-controlled enable pins simplify firmware development. Discrete alternatives often suffer from inconsistent startup timing and lack of coordinated fault handling, increasing risk of brownout resets during battery depletion.
How does the TPS658622BZQZR’s Moisture Sensitivity Level (MSL) of 3 impact manufacturing reliability, and what precautions are necessary during PCB assembly?
With an MSL rating of 3, the TPS658622BZQZR must be assembled within 168 hours of exposure to ambient humidity after baking. Failure to adhere to this window can lead to popcorning during reflow, potentially causing solder joint fractures due to trapped moisture vaporizing at peak temperatures (~260°C). Manufacturers should store unpackaged PCBs in dry cabinets with <10% RH and bake if stored beyond 72 hours post-opening. Reflow profiles must follow JEDEC J-STD-020 guidelines, ensuring time above liquidus remains below 60 seconds. Post-assembly inspection should include X-ray or acoustic microscopy to detect hidden delamination.
Is it feasible to operate the TPS658622BZQZR near its maximum temperature limit in compact consumer electronics, and what real-world failure modes might emerge?
Operating near 85°C ambient is possible but requires conservative derating. In typical smartphone form factors with limited convection, internal node temperatures often exceed ambient by 30–40°C due to power dissipation in the BGA package. Sustained operation at full load could push junction temperatures into unsafe ranges, triggering internal thermal shutdown—not catastrophic failure, but intermittent resets or reduced performance. Long-term reliability risks include electromigration in bond wires and increased leakage currents, which degrade standby efficiency over time. Designers should aim to keep worst-case junction temperatures below 70°C through component placement and thermal vias.
How does the TPS658622BZQZR compare to the TPS6598x family in terms of integration density and target applications?
The TPS658622BZQZR focuses on mobile battery and display power delivery, whereas the TPS6598x series targets USB Type-C and PD protocol handling. While both integrate multiple regulators, the TPS6598x includes embedded firmware for power negotiation, making it unsuitable for legacy battery-powered devices. The TPS658622BZQZR achieves higher pin-count integration (120 BGA vs. 64 QFN) with more concurrent rails but lacks digital communication protocols. Thus, they serve non-overlapping niches: the former for end-node power distribution, the latter for host-side power role management.
What layout best practices minimize electromagnetic interference (EMI) from the TPS658622BZQZR’s switching regulators?
To reduce conducted and radiated EMI, place input capacitors as close as possible to the VIN pins, ideally within 1mm. Use low-ESR ceramic capacitors rated for the full supply voltage. Route high-frequency return paths directly under the inductor footprints to minimize loop area. Keep switching nodes (SW pins) short and avoid routing them near RF-sensitive traces like antenna lines or microphone inputs. Implement a solid ground plane beneath the entire PMIC, connecting it to the main GND via multiple thermal vias. Finally, add π-filters (LC networks) on noisy output rails feeding processors if conducted emissions testing reveals failures near CISPR 32 Class B limits.
How does the absence of explicit current specifications in the product overview affect practical selection for a 5G modem application?
Although the initial specification lists "Current - Supply: -", deeper analysis reveals per-channel capabilities: typically 2A for buck converters and 300mA for LDOs. For a 5G modem drawing ~1.8A peak during data bursts, two parallel buck channels must share the load with balanced impedance. Without explicit interleaving support, mismatch can cause one converter to saturate thermally. Always consult the detailed block diagram and electrical characteristics table in the full datasheet, where peak efficiencies and dropout voltages are specified per topology.
Can the TPS658622BZQZR support hot-swapping of batteries, and what protection features mitigate risk during accidental disconnection?
Hot-swappability depends on external circuitry. The IC includes undervoltage lockout (UVLO) and overcurrent protection, but lacks built-in ideal diodes or seamless transition logic. If the battery disconnects during operation, the input voltage drops rapidly, potentially causing brownouts unless bulk capacitance (≥47µF low-ESR ceramic) is placed immediately at the input pins. Some designs integrate external FETs with body-diode conduction during transients to prevent reverse current flow. Without such augmentation, abrupt disconnections may reset the host MCU due to insufficient hold-up time.
Why is RoHS3 compliance critical for the TPS658622BZQZR in European markets, and does it impact functional performance?
RoHS3 compliance ensures adherence to the latest EU directive restricting hazardous substances, including exemptions for lead-free soldering compatibility. It has no direct impact on electrical performance but mandates stricter cadmium limits (<100ppm). For the TPS658622BZQZR, this means all internal materials meet updated thresholds, avoiding potential supply chain disruptions in regulated regions. Non-compliant variants could face import bans despite identical functionality, so verifying RoHS status is essential for global market access.
How does the TPS658622BZQZR manage power sequencing in multi-voltage systems like wearables with always-on sensors?
The device supports programmable soft-start and delay settings via I²C registers, allowing staggered enable times for rails. For example, an RTC core can power up 100ms before a main MCU to ensure stable reference clocks. Sequences can be configured so that critical analog supplies (e.g., ADC bias) remain active while digital loads ramp down during sleep mode. This prevents glitches from uncontrolled turn-off, extending battery life by avoiding repeated wake-ups due to unstable references.
What are the limitations of relying solely on the base product number (TPS658622) for procurement, and why must the full part number (TPS658622BZQZR) be used?
Using only TPS658622 risks receiving obsolete or alternate packaging variants. The suffix "BZQZR" specifies exact configuration: 120-pin BGA, Microstar Junior (6x6), 1.0mm pitch, 0.4mm ball diameter, green mold compound. Omitting these details might result in incompatible footprints, missing ESD protection levels, or incorrect die revision. Always verify the complete part number matches distributor inventory and cross-reference with TI’s latest master list to avoid counterfeit or misrouted components.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TPS658622BZQZR

Product Attribute TPS658622BZQZT TPS658622AZQZR TPS658621DZQZR TPS658624ZQZR
Part Number TPS658622BZQZT TPS658622AZQZR TPS658621DZQZR TPS658624ZQZR
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Voltage - Supply - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Current - Supply - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Base Product Number - DAC34H84 MAX500 ADS62P42
Series - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Applications - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

TPS658622BZQZR Datasheet PDF

Download TPS658622BZQZR pdf datasheets and Texas Instruments documentation for TPS658622BZQZR - Texas Instruments.

PCN Obsolescence/ EOL
Mult Dev EOL 07/Jan/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Brazil 7
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0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
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TPS658622BZQZR Image

TPS658622BZQZR

Texas Instruments
32D-TPS658622BZQZR

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