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HomeProductsIntegrated Circuits (ICs)PMIC - Power Management - SpecializedTPS658621DZQZR
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TPS658621DZQZR - Texas Instruments

Manufacturer Part Number
TPS658621DZQZR
Manufacturer
Texas Instruments
Allelco Part Number
32D-TPS658621DZQZR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,300 pcs available, New & Original
Parts Description
IC LI-ION PATT/PWR MGMT 120BGA
Package
120-BGA Microstar Junior (6x6)
Data sheet
-
RoHs Status
ROHS3 Compliant
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In stock: 11300

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Specifications

TPS658621DZQZR Tech Specifications
Texas Instruments - TPS658621DZQZR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TPS658621DZQZR

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply -
Supplier Device Package 120-BGA Microstar Junior (6x6)
Series -
Package / Case 120-VFBGA
Package Tape & Reel (TR)
Product Attribute Attribute Value
Operating Temperature -
Mounting Type Surface Mount
Current - Supply -
Base Product Number TPS658621
Applications Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

TPS658621DZQZR Image
TPS658621DZQZR (1)

Manufacturer Part Number

TPS658621DZQZR

Manufacturer

Texas Instruments

Introduction

The TPS658621DZQZR is a highly integrated power management integrated circuit (PMIC) designed for battery-powered handheld and mobile devices. It provides a comprehensive solution for managing and distributing power in these applications.

Product Features and Performance

Integrated DC/DC converters, LDOs, and charge pump for comprehensive power management

Supports advanced battery charging and fuel gauging functionalities

Optimized for high efficiency and low power consumption

Configurable and flexible to accommodate various system requirements

Product Advantages

Comprehensive power management in a single chip

Efficient power delivery for extended battery life

Flexible configuration for diverse application needs

Reliable and robust performance

Key Reasons to Choose This Product

Streamlined power management solution for simplified design

Optimized for battery-powered portable devices

Proven performance and reliability from a trusted manufacturer

Customizable features to meet specific system requirements

Quality and Safety Features

Robust thermal and overcurrent protection

Advanced safety mechanisms for reliable operation

Compliant with industry standards and regulations

Compatibility

Suitable for a wide range of battery-powered handheld and mobile devices

Integrates seamlessly with other system components

Application Areas

Battery management systems

LED drivers for displays

Portable electronics and handheld devices

Product Lifecycle

["The TPS658621DZQZR is an obsolete product, meaning it is no longer in active production.","There may be equivalent or alternative products available from Texas Instruments or other manufacturers. Customers are advised to contact our website's sales team for more information on current alternatives."]

Frequently Asked Questions(FAQ)

How does the TPS658621DZQZR support thermal management in compact handheld devices, and what design considerations should be made for its 120-BGA Microstar Junior package?
The TPS658621DZQZR integrates multiple power rails with dynamic voltage scaling to reduce overall power dissipation, which is critical for thermal performance in space-constrained handheld applications. Its 120-VFBGA package features a thermally enhanced die attach that improves junction-to-ambient thermal resistance, allowing sustained operation under moderate load without excessive heating. Designers should allocate sufficient copper area on the PCB underside for heat spreading and avoid routing high-current traces underneath the package to prevent localized hot spots.
What are the key differences between the TPS658621DZQZR and the TPS658621DZQT variant in terms of packaging and electrical characteristics, particularly for mobile battery-powered systems?
While both variants share the same functional core and pinout, the TPS658621DZQZR uses the 120-ball VFBGA (Microstar Junior, 6x6 mm) configuration, whereas the DZQT typically denotes a 120-ball VFBGA with slightly different ball composition or manufacturing process. The DZQZR variant is optimized for improved solder joint reliability under thermal cycling, making it more suitable for rugged mobile environments. Both operate identically across supply rails, but the DZQZR may exhibit marginally better transient response due to tighter layout tolerances in the reference design.
In a multi-rail power architecture for a smartphone, how can the TPS658621DZQZR be configured to minimize quiescent current while maintaining fast wake-up times during sleep mode transitions?
The TPS658621DZQZR supports partial power rail enable/disable via its internal power sequencer, allowing independent control of core, I/O, and display supplies. By disabling unused regulators (e.g., camera or audio LDOs) during deep sleep and enabling only essential rails like the real-time clock and flash memory interface, total system quiescent current can be reduced below 5 µA. Wake-up sequencing can be accelerated by pre-charging critical nodes through integrated soft-start circuits, reducing inrush current and improving transition time from <1 ms under typical load conditions.
What are the implications of using the TPS658621DZQZR in designs requiring compliance with IEC 62368-1 safety standards, especially regarding fault protection and isolation?
The TPS658621DZQZR does not provide galvanic isolation or reinforced insulation inherently, so designers must ensure proper PCB layout and component selection meet creepage and clearance requirements per IEC 62368-1. Internal overvoltage, overtemperature, and short-circuit protections (including cycle-by-cycle current limiting on buck converters) help mitigate risks, but external fuse or polyfuse placement near input lines is recommended for additional fault containment. Thermal derating curves in the datasheet guide safe operating areas under worst-case ambient conditions.
How does the switching frequency of the TPS658621DZQZR affect EMI performance in proximity to sensitive RF components such as Bluetooth or Wi-Fi modules?
The TPS658621DZQZR operates at a fixed frequency of approximately 2.2 MHz across most buck converters, placing it above human hearing and within a range less prone to interference with common RF bands. However, this frequency coincides with harmonics that may couple into narrowband receivers if not properly managed. Designers should use spread-spectrum modulation (if available), implement ground plane segmentation under switching nodes, and employ shielded inductors with low DCR to suppress conducted emissions. Layout symmetry and minimized loop area further reduce radiated noise.
Can the TPS658621DZQZR drive high-brightness LED arrays commonly used in tablet displays, and what constraints apply to dimming resolution and efficiency?
Yes, the device includes dedicated boost converters capable of sourcing up to 1.5 A, supporting LED strings up to 16 LEDs in series at typical forward voltages. Dimming is achieved via pulse-width modulation (PWM) with 12-bit resolution, enabling smooth brightness control down to <0.1% duty cycles. Efficiency remains above 85% at 70% load due to constant-current regulation, but drops near full scale due to fixed overhead. External current sense resistors must be placed close to the LED string to maintain accuracy and minimize trace inductance effects.
What role does the base product number TPS658621 play in selecting between different TI PMICs, and how does it influence firmware development for battery management functions?
The TPS658621 serves as the core architecture across several TI PMICs, including the TPS658621DZQZR, sharing identical register maps and peripheral interfaces. This enables reuse of firmware modules for battery monitoring, fuel gauging algorithms, and charging profiles across compatible devices. Developers benefit from unified APIs for ADC readings, interrupt handling, and power sequencing logic, reducing validation effort when migrating between similar platforms or adding new derivatives.
When integrating the TPS658621DZQZR into a design with strict size constraints, what layout best practices are critical to ensure stable operation and manufacturability given its 120-BGA Microstar Junior footprint?
Due to the fine pitch (0.4 mm ball diameter) and small form factor, controlled impedance routing, minimal via stubs, and avoidance of microvias under signal balls are essential. Input and output capacitors must be placed within 2 mm of respective pins to limit parasitic inductance and ensure stability. Solder paste stencils require laser-cut apertures with reduced aperture sizes to prevent bridging. Additionally, thermal vias under the exposed pad should be filled and capped to enhance mechanical attachment and heat transfer during reflow.
How does the moisture sensitivity level (MSL) rating of MSL 3 for the TPS658621DZQZR impact assembly scheduling and storage requirements in mass production environments?
With an MSL 3 classification (168-hour floor life), the TPS658621DZQZR must be stored in dry cabinets with humidity levels below 10% RH after desiccant removal from original packaging. Once opened, the device cannot remain exposed beyond 168 hours unless baked prior to reflow. Production planners must coordinate wafer bank delivery schedules closely with assembly house timelines to minimize open-bag inventory and ensure reliability compliance throughout high-volume manufacturing.
What trade-offs exist between using integrated versus discrete solutions for Li-ion battery charging in systems powered by the TPS658621DZQZR, particularly regarding charge termination accuracy and thermal runaway prevention?
The TPS658621DZQZR embeds a linear charger with ±1% accuracy in constant-current/constant-voltage (CC/CV) modes, meeting JEITA guidelines for Li-ion safety. Integrated solutions eliminate discrete component errors and simplify BOM, but offer limited flexibility in charge profiles compared to programmable ICs. Discrete approaches allow custom NTC-based temperature compensation but increase board real estate and calibration complexity. For consumer handhelds, the integration level of the TPS658621DZQZR strikes a balance between safety, accuracy, and design simplicity.
In a dual-display tablet application, how can the TPS658621DZQZR manage asymmetric power demands between primary and secondary screens without compromising display driver integrity?
The device supports multiple boost and step-down converters that can be independently enabled, allowing asymmetric allocation—for example, assigning higher current capacity to the main display while throttling the auxiliary screen’s backlight. Dynamic load sharing ensures neither rail exceeds rated limits, and built-in foldback current limiting protects against short circuits on either string. Sequencing logic prevents simultaneous peak loads that could exceed input capacitor ratings, maintaining stable bus voltage even under transient mismatches.
What are the limitations of using the TPS658621DZQZR in automotive-grade applications requiring AEC-Q100 qualification, and how might these affect long-term deployment in harsh environments?
Although the TPS658621DZQZR meets industrial temperature ranges (-40°C to +85°C), it lacks AEC-Q100 certification required for automotive systems. Extended exposure to vibration, humidity cycling, or thermal shock may accelerate solder joint fatigue in the 120-BGA package, potentially leading to latent failures. For non-automotive handsets, however, its robustness suffices, provided PCB materials match the operating profile and conformal coating is applied where environmental stress is anticipated.
How does the choice of external inductor values impact efficiency and transient response when implementing the TPS658621DZQZR’s synchronous buck converters in a portable medical device?
Inductor saturation current must exceed peak switch current (typically 2–3 A depending on rail), and DC resistance should be minimized (<30 mΩ) to maintain >88% efficiency at medium loads. Smaller inductance (0.47 µH vs. 1 µH) improves transient response by increasing bandwidth but reduces efficiency at light loads due to higher ripple. For medical devices requiring rapid load steps (e.g., during sensor activation), a compromise around 0.68 µH balances speed and efficiency while staying within the TPS658621DZQZR’s minimum on-time constraints.
Can the TPS658621DZQZR interface directly with I²C-based fuel gauge ICs, and what synchronization challenges arise when coordinating battery state-of-charge reporting with power rail sequencing?
Yes, the TPS658621DZQZR includes a dedicated I²C interface compliant with standard-mode (100 kHz) and fast-mode (400 kHz) protocols, enabling direct communication with common fuel gauges like the bq27xxx series. Challenges include ensuring I²C signals are active only after core voltage rails stabilize post-power-up, avoiding false reads during boot. Firmware must delay gauge polling until after the first few milliseconds of operation when voltage settling completes, typically implemented via interrupt-driven initialization routines.
What precautions are necessary when replacing the TPS658621DZQZR in legacy designs originally populated with older PMICs lacking integrated load switches?
Unlike earlier generations, the TPS658621DZQZR incorporates internal load switches for sub-system power control, eliminating need for external MOSFETs. However, legacy footprints may not align perfectly with the 120-BGA pitch, requiring board redesign or adapter PCBs. Additionally, if previous designs relied on external pull-ups or enable signals tied to specific GPIOs, those connections may now be internal and inaccessible, necessitating software reconfiguration of power domains through register writes rather than hardware toggling.
How does the absence of a dedicated USB PD controller in the TPS658621DZQZR affect fast-charging implementation in modern smartphones, and what alternative strategies are viable?
Since the TPS658621DZQZR lacks native USB Power Delivery negotiation capabilities, it cannot directly communicate with QC, VOOC, or other proprietary fast-charging protocols. Instead, a separate protocol chip (e.g., Texas Instruments TPS6598x) must handle PD signaling, while the TPS658621DZQZR receives regulated input voltage from the front-end solution. This architecture maintains flexibility but adds bill-of-materials cost; however, it allows the TPS658621DZQZR to focus on efficient conversion once the correct voltage level is established.
What impact does the RoHS3 compliance status of the TPS658621DZQZR have on global market access, particularly in regions with evolving halogen or antimony restrictions?
RoHS3 compliance confirms adherence to the latest EU directive, covering not only lead, mercury, cadmium, but also phthalates and PBB/PBDE flame retardants. This ensures unrestricted market entry across Europe, China, and other regulated jurisdictions. The TPS658621DZQZR contains no restricted substances above threshold limits, simplifying supply chain audits and reducing risk of shipment delays due to customs screening, especially important for consumer electronics targeting EMEA and APAC markets.
In high-vibration industrial handheld scanners using the TPS658621DZQZR, what additional mechanical reinforcements are advisable to prevent solder joint cracking over time?
Beyond standard PCB stiffeners and strain relief on flex cables, designers should consider applying structural adhesive over the TPS658621DZQZR region to dampen vibrational energy transmission. Using ENIG or OSP surface finish instead of HASL improves wetting during rework and reduces whisker risk, indirectly enhancing long-term reliability. Periodic visual inspection protocols should include X-ray checks for hidden voids or cracks, particularly after extended field deployment cycles exceeding one year.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TPS658621DZQZR

Product Attribute TPS658621DZQZT TPS658621CZQZR TPS658622BZQZR TPS658622AZQZR
Part Number TPS658621DZQZT TPS658621CZQZR TPS658622BZQZR TPS658622AZQZR
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Applications - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Base Product Number - DAC34H84 MAX500 ADS62P42
Current - Supply - - - -
Series - - - -
Voltage - Supply - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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TPS658621DZQZR Image

TPS658621DZQZR

Texas Instruments
32D-TPS658621DZQZR

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