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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersSTM32F730Z8T6
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STM32F730Z8T6 - STMicroelectronics

Manufacturer Part Number
STM32F730Z8T6
Manufacturer
STMicroelectronics
Allelco Part Number
32D-STM32F730Z8T6
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
6,685 pcs available, New & Original
Parts Description
IC MCU 32BIT 64KB FLASH 144LQFP
Package
144-LQFP (20x20)
Data sheet
STM32F730Z8T6.pdf
RoHs Status
ROHS3 Compliant
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Specifications

STM32F730Z8T6 Tech Specifications
STMicroelectronics - STM32F730Z8T6 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - STM32F730Z8T6

Product Attribute Attribute Value
Manufacturer STMicroelectronics
Voltage - Supply (Vcc/Vdd) 1.7V ~ 3.6V
Supplier Device Package 144-LQFP (20x20)
Speed 216MHz
Series STM32F7
RAM Size 256K x 8
Program Memory Type FLASH
Program Memory Size 64KB (64K x 8)
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Package / Case 144-LQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 112
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 24x12b; D/A 2x12b
Core Size 32-Bit Single-Core
Core Processor ARM® Cortex®-M7
Connectivity CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, UART/USART, USB
Base Product Number STM32F730

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.31.0001

Parts Introduction

STM32F730Z8T6 Image
STM32F730Z8T6 (1)

Manufacturer Part Number

STM32F730Z8T6

Manufacturer

STMicroelectronics

Introduction

High-performance and DSP with FPU ARM Cortex-M7 MCU

Product Features and Performance

32-Bit Single-Core ARM Cortex-M7 processor

Speed up to 216MHz

Enhanced DSP instructions

Floating-point unit (FPU)

High code density

Product Advantages

High processing power

Excellent power efficiency

Advanced architecture for optimized code execution

Flexible memory options

Key Technical Parameters

Core Size: 32-Bit

Speed: 216MHz

Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, UART/USART, USB

I/Os: 112

Program Memory Size: 64KB

RAM Size: 256KB

Supply Voltage: 1.7V ~ 3.6V

A/D Converters: 24x12b

D/A Converters: 2x12b

Oscillator Type: Internal

Quality and Safety Features

Brown-out Detect/Reset

DMA

I2S

POR

PWM

WDT

Compatibility

Supports a wide range of development tools and software

Application Areas

Industrial automation

Consumer electronics

Automotive

Healthcare

Smart home devices

Product Lifecycle

Active status

Not nearing discontinuation

Replacements and upgrades available

Several Key Reasons to Choose This Product

High execution performance for complex algorithms

Low power consumption for energy-sensitive applications

Multiple connectivity options for diverse applications

Extensive developer resources and support

Wide operating temperature range for harsh environments

Large number of I/Os for peripheral flexibility

Robust package conducive for industrial use

Frequently Asked Questions(FAQ)

How does the STM32F730Z8T6 compare to other STM32F7 series microcontrollers in terms of program memory and clock speed, and what implications does this have for real-time application design?
The STM32F730Z8T6 features 64KB of embedded Flash memory and operates at up to 216MHz using its ARM Cortex-M7 core, which positions it as a mid-range device within the STM32F7 family. While higher-end models like the STM32F746 offer up to 1MB of Flash and similar maximum clock speeds, the F730Z8T6 provides sufficient code space and processing throughput for control-intensive applications such as motor control or sensor fusion where deterministic timing is critical. However, designers must consider that the limited 64KB Flash constrains complex firmware architectures—applications requiring extensive libraries or dynamic code generation may exceed this boundary. In contrast to lower-performance F7 variants such as the F722, the F730Z8T6 delivers significantly better computational throughput without requiring external memory interfaces.
What are the key differences between the STM32F730Z8T6 and the STM32F746NGH6 in terms of peripheral integration and power consumption for battery-powered industrial sensor nodes?
The STM32F730Z8T6 offers a compact 144-pin LQFP package with 112 I/Os and includes essential connectivity such as USB, CAN, SPI, and I2C, making it suitable for space-constrained embedded systems. However, compared to the STM32F746NGH6—which supports larger memory configurations (up to 1MB Flash), dual-bank Flash for live updates, and advanced analog peripherals—the F730Z8T6 lacks some high-bandwidth interfaces like Ethernet MAC and has reduced RAM (256KB vs. 320KB). For low-power sensor nodes, both devices support dynamic voltage scaling down to 1.7V supply, but the F746NGH6 includes additional power-saving modes optimized for extended operation. The F730Z8T6’s tighter pin count and smaller footprint reduce board area and parasitic capacitance, potentially lowering leakage current slightly, though actual savings depend heavily on firmware implementation and peripheral utilization.
Can the STM32F730Z8T6 reliably operate in automotive environments, given its operating temperature range and certification status?
No, the STM32F730Z8T6 is not qualified for full automotive-grade reliability due to its commercial-grade specification of -40°C to 85°C and lack of AEC-Q100 certification. While it can function in many industrial settings within this range, automotive applications typically require components rated for -40°C to +125°C and undergoing rigorous stress testing under ISO/TS 16949 standards. The device’s MSL 3 classification and RoHS3 compliance ensure environmental safety but do not imply enhanced thermal resilience. Designers seeking automotive compliance should consider STMicroelectronics’ AEC-Q100-qualified STM32G4 or STM32H7 lines instead. That said, in non-critical automotive subsystems where cost and size outweigh extreme temperature demands, the F730Z8T6 may be used with appropriate derating and system-level thermal management.
What is the impact of the STM32F730Z8T6’s 256KB RAM size on multitasking performance in embedded Linux or RTOS-based applications?
With 256KB of RAM, the STM32F730Z8T6 is generally insufficient for running full Linux distributions or complex RTOS environments requiring multiple concurrent tasks with large stacks and heaps. Even lightweight Linux implementations like Zephyr or FreeRTOS with moderate middleware consume several hundred kilobytes just for kernel and driver overhead. The 256KB limit restricts the number of active threads, buffers for communication queues, and runtime allocation pools—especially problematic when handling high-speed data acquisition via ADCs or DMA transfers. In contrast, higher-memory STM32F7 devices like the F746 support 320KB–384KB RAM, enabling more robust task scheduling and larger data buffering. For most bare-metal or minimal RTOS use cases—such as PID loops or state machines—the RAM is adequate, but developers must carefully manage memory usage to avoid fragmentation or stack overflow.
How does the internal oscillator accuracy of the STM32F730Z8T6 affect timing-sensitive applications like USB CDC communication or precise PWM generation?
The STM32F730Z8T6 relies on an internal 16MHz RC oscillator (±1% typical accuracy) for clocking unless an external crystal is used. This level of precision is often inadequate for timing-critical protocols like USB 2.0 Full-Speed, which requires ±0.25% frequency stability to meet protocol timing margins. Similarly, high-resolution PWM generation benefits from stable clock sources; deviations in the internal oscillator can introduce jitter in duty cycle accuracy. While the device includes a Phase-Locked Loop (PLL) that can multiply the internal clock to 216MHz, phase noise and drift from the base oscillator propagate through multiplication. Therefore, for USB or synchronized multi-channel motor control, an external 8MHz or 16MHz crystal with load capacitors is strongly recommended. Using the internal oscillator introduces unpredictable latency variations that may violate application timing budgets over temperature and aging.
Is the STM32F730Z8T6 suitable for cryptographic applications requiring secure boot or hardware encryption, and what limitations exist?
No, the STM32F730Z8T6 lacks dedicated security features such as TrustZone, secure debug disable, or AES-256 engine found in higher-end STM32 families like the STM32U5 or STM32MP1. It does include basic read-out protection levels and a unique ID, but these offer only minimal obfuscation against physical attacks. Without tamper detection or secure key storage, sensitive data processed by the Cortex-M7 could be extracted via glitching or side-channel analysis. For cryptographic workloads involving secure boot, firmware signing, or encrypted storage, designers should use STM32G0/G4 series with AES-NI or STM32H7 with HASH/DAC peripherals. The F730Z8T6 remains viable for non-security-critical cryptographic operations using software libraries like mbed TLS, provided keys are handled securely in RAM and never persisted unencrypted.
What considerations apply when interfacing the STM32F730Z8T6 with external QSPI flash memory for firmware storage?
The STM32F730Z8T6 supports Quad-SPI (QSPI) up to 133MHz, allowing fast read/write access to external serial flash devices. However, the 64KB internal Flash limits interrupt vector table placement and early-stage bootloader execution—critical firmware must reside either in external QSPI NOR or use the built-in ROM loader (System Memory) during initial programming. Designers must ensure that the external flash supports XIP (execute-in-place) mode if running code directly from it; otherwise, time-consuming copies to internal RAM degrade performance. Additionally, the small RAM buffer (256KB) constrains DMA transfer sizes during bulk writes or erases, increasing latency. Compared to microcontrollers with larger internal Flash like the STM32F746, the F730Z8T6 demands careful partitioning of code and data across internal and external memories, with attention to address mapping and bus contention when sharing peripherals like SDRAM controllers.
How does the voltage supply range of 1.7V to 3.6V in the STM32F730Z8T6 influence power supply design in portable medical devices?
The STM32F730Z8T6’s wide supply window accommodates both lithium-ion batteries (down to ~3.0V when discharged) and regulated 3.3V rails, simplifying power architecture in portable devices. However, operation below 2.0V risks instability in analog peripherals like the 24-channel 12-bit ADC, whose effective resolution degrades due to reference voltage drift. Medical applications often require high-precision measurements, so maintaining VDD above 2.7V ensures optimal SNR and linearity. Power sequencing must also respect the chip’s brown-out detection threshold (~1.7V), preventing erratic behavior during brownout events. Unlike ultra-low-power MCUs designed for coin-cell operation, the F730Z8T6 draws significant quiescent current in active mode (~10mA at 216MHz), making it unsuitable for years-long battery life unless duty-cycled aggressively. Thus, while voltage flexibility aids compatibility, system-level efficiency hinges on minimizing idle current and leveraging deep sleep modes between sensing intervals.
What trade-offs exist between using the STM32F730Z8T6 and an FPGA for real-time signal processing tasks like FIR filtering or FFT computation?
The STM32F730Z8T6 delivers deterministic performance for fixed-function DSP algorithms via its single-cycle MAC unit and optimized CMSIS-DSP library, achieving throughput of several hundred MFLOPS. However, it lacks parallelism and cannot pipeline operations beyond instruction-level parallelism, limiting performance on highly data-dependent tasks. An FPGA like Xilinx Artix-7 or Intel Cyclone V offers reconfigurable logic that can implement custom datapaths with zero-latency pipelining, outperforming the MCU by orders of magnitude in throughput but at higher cost, power, and development complexity. For moderate filter banks or embedded vision preprocessing (e.g., edge detection), the F730Z8T6 suffices, especially when integrated with hardware accelerators like Chrom-ART. But for real-time spectral analysis or beamforming, an FPGA co-processor becomes necessary, trading software flexibility for raw compute density.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics STM32F730Z8T6

Product Attribute STM32F730Z8T6TR STM32F730V8T6TR STM32F730V8T6 STM32F730R8T6
Part Number STM32F730Z8T6TR STM32F730V8T6TR STM32F730V8T6 STM32F730R8T6
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
EEPROM Size - - - -
RAM Size - - - -
Speed - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Core Processor - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Connectivity - - - -
Number of I/O - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Program Memory Size - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Oscillator Type - - - -
Program Memory Type - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Core Size - - - -
Peripherals - - - -
Data Converters - - - -
Series - - - -

STM32F730Z8T6 Datasheet PDF

Download STM32F730Z8T6 pdf datasheets and STMicroelectronics documentation for STM32F730Z8T6 - STMicroelectronics.

Datasheets
STM32F730x8 Datasheet.pdf
PCN Packaging
Material Barrier Bag 17/Dec/2020.pdf
PCN Assembly/Origin
Mult Dev Assembly Source Add 5/Mar/2019.pdf
HTML Datasheet
STM32F7 & STM32H7 Programming Manual.pdf
Errata
STM32F72zzz & STM32F73zzz Errata.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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STM32F730Z8T6 Image

STM32F730Z8T6

STMicroelectronics
32D-STM32F730Z8T6

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