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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersSTM32F732IEK6
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STM32F732IEK6 - STMicroelectronics

Manufacturer Part Number
STM32F732IEK6
Manufacturer
STMicroelectronics
Allelco Part Number
98D-STM32F732IEK6
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
46,070 pcs available, New & Original
Parts Description
IC MCU 32BIT 512KB FLSH 176UFBGA
Package
176+25UFBGA (10x10)
Data sheet
STM32F732IEK6.pdf

PCN Packaging

2.73KHz.pdf

PCN Assembly/Origin

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 46070
  • Unit Price: $11.403
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $11.403 $11.40
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

STM32F732IEK6 Tech Specifications
STMicroelectronics - STM32F732IEK6 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - STM32F732IEK6

Product Attribute Attribute Value
Manufacturer STMicroelectronics
Voltage - Supply (Vcc/Vdd) 1.7V ~ 3.6V
Supplier Device Package 176+25UFBGA (10x10)
Speed 216MHz
Series STM32F7
RAM Size 256K x 8
Program Memory Type FLASH
Program Memory Size 512KB (512K x 8)
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Package / Case 201-UFBGA
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 140
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 24x12b; D/A 2x12b
Core Size 32-Bit Single-Core
Core Processor ARM® Cortex®-M7
Connectivity CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, UART/USART, USB
Base Product Number STM32F732

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the STM32F732IEK6 compare to other STM32F7 series microcontrollers in terms of core performance and memory configuration?
The STM32F732IEK6 features a 32-bit ARM Cortex-M7 core operating at up to 216MHz, which places it among the higher-performance members of the STM32F7 series. It offers 512KB of embedded Flash memory and 256KB of RAM, providing sufficient code storage and runtime data handling for complex applications such as motor control, audio processing, or real-time communication systems. While some F7 variants may offer larger memory footprints—such as 1MB Flash or dual-bank configurations—the F732IEK6 balances performance with cost for mid-range industrial and embedded designs where 512KB is adequate but expansion is not required.
What are the key trade-offs when selecting the STM32F732IEK6 for a high-speed data acquisition system requiring both analog inputs and fast digital interfaces?
The STM32F732IEK6 includes 24x 12-bit ADC channels and dual 12-bit DACs, enabling precise analog signal measurement and generation within a single device. However, integrating multiple high-speed peripherals such as USB OTG HS, QSPI, or SAI simultaneously can strain the internal bus bandwidth due to shared memory access. Designers must carefully allocate DMA channels and prioritize peripheral clocking to avoid bottlenecks, especially when sampling at full resolution across many ADC inputs while transmitting data via SPI or Ethernet. This necessitates careful firmware planning beyond just component selection.
Can the STM32F732IEK6 reliably support CAN FD (Flexible Data Rate) communication in an automotive-grade environment?
No, the STM32F732IEK6 does not include native CAN FD support. It supports standard CAN 2.0B via its built-in CAN controllers, which are suitable for legacy automotive or industrial networks but cannot meet modern high-speed CAN FD requirements. For applications requiring CAN FD, designers would need to add external transceivers or consider alternative STM32 models like those in the STM32H7 series, which include dedicated CAN FD IP blocks. The F732IEK6 remains viable for non-CAN FD automotive subsystems or industrial automation with conventional CAN.
What power consumption characteristics should be expected from the STM32F732IEK6 during active operation versus sleep modes?
In active mode at 216MHz with all peripherals enabled, the STM32F732IEK6 typically consumes between 18–22 mA under nominal voltage (3.3V), depending on peripheral activity and code efficiency. During sleep mode using the Cortex-M7’s low-power states, current drops to approximately 1.2–1.5 mA, and deep sleep with RTC running can reduce it further to under 10 µA. These figures assume optimal software configuration, including disabling unused clocks and peripherals. Real-world consumption will vary based on I/O switching rates, flash wait states, and external load conditions.
How does the package size of the STM32F732IEK6 impact PCB layout complexity compared to LQFP alternatives?
The STM32F732IEK6 uses a 176+25UFBGA package measuring 10x10 mm, which reduces footprint by roughly 40% compared to equivalent pin-count LQFP packages. However, this comes at the cost of significantly increased routing difficulty due to ball grid array placement. Designers must employ advanced PCB manufacturing techniques—such as microvias, controlled impedance traces, and proper solder mask definition—to ensure reliable assembly. Additionally, thermal management becomes more critical due to the dense pinout and lack of exposed thermal pads, requiring careful consideration of reflow profiles and heat dissipation paths.
Is the STM32F732IEK6 suitable for battery-powered edge devices requiring long-term autonomy?
Yes, but with constraints. The device supports multiple low-power modes down to ultra-low leakage states, making it appropriate for intermittent-operation edge devices. However, its maximum frequency of 216MHz implies higher peak power draw than ultra-low-power STM32 families like G0 or L5. Therefore, while feasible for duty-cycled applications—such as sensor nodes that wake periodically for data collection—it may not achieve the same years-long battery life as lower-clock-speed MCUs unless aggressive clock gating and peripheral shutdown are implemented in firmware.
What are the implications of the STM32F732IEK6’s internal oscillator tolerance for time-sensitive applications?
The STM32F732IEK6 relies on an internal 16 MHz RC oscillator with typical accuracy of ±2%, which translates to significant timing drift over temperature and voltage variations. For applications requiring precise timing—such as PWM synchronization or UART baud rate generation—this may necessitate calibration routines or external crystal oscillators. While the PLL allows fine-tuning of system clock accuracy, the base RC oscillator alone is insufficient for hard real-time protocols like EtherCAT or IEEE 1588 without compensation mechanisms.
How does the STM32F732IEK6 handle simultaneous use of USB OTG FS and SDIO/MMC interfaces without resource conflicts?
The STM32F732IEK6 supports concurrent operation of USB OTG FS and SDIO/MMC through separate DMA streams and interrupt lines, but both share the same AHB bus and memory bandwidth. Without careful DMA arbitration and buffer management, transferring large blocks of data—such as streaming video over USB while logging to an SD card—can cause contention and latency spikes. Optimal performance requires interleaving transfers, using double buffering, and prioritizing critical paths in firmware, often leveraging the Cortex-M7’s enhanced DMA controller capabilities.
What considerations apply when booting the STM32F732IEK6 from external QSPI Flash instead of internal memory?
When booting from external QSPI Flash, the STM32F732IEK6 requires initialization of the QSPI interface early in the reset sequence, which must be configured before any code execution begins. This demands either an internal bootloader (if available) or a secondary MCU to assist, unless the application supports XIP (execute-in-place). Performance is limited by QSPI clock speed—typically up to 108 MHz in dual/quad mode—and code locality becomes crucial; frequently accessed functions should reside in internal RAM or cache (if enabled). Debugging becomes more challenging due to reduced visibility into early boot stages.
How does the STM32F732IEK6’s operating temperature range affect reliability in harsh environments?
With a rated operating temperature of -40°C to +85°C, the STM32F732IEK6 meets industrial-grade specifications, ensuring functional integrity in most environmental stress scenarios. However, long-term reliability depends not only on the IC itself but also on PCB materials, solder joint integrity under thermal cycling, and decoupling capacitor performance at extremes. At the upper end (+85°C), leakage currents increase slightly, potentially affecting power budgets in low-voltage designs. Similarly, low temperatures may delay startup times if external crystals are used. Proper derating and environmental testing remain essential for mission-critical deployments.
Can the STM32F732IEK6 drive multiple high-current loads directly from its GPIO pins?
No, GPIO pins on the STM32F732IEK6 are designed for general-purpose digital I/O with typical sourcing/sinking current limits of ±25 mA per pin and absolute maximum ratings around ±20 mA sustained. Driving high-current loads—such as LEDs without drivers or relays without buffers—exceeds these limits and risks damaging the die. External transistors, MOSFETs, or dedicated driver ICs must be used for loads exceeding 5–10 mA, particularly in industrial settings where inductive kickback or noise immunity is a concern.
What security features does the STM32F732IEK6 provide for protecting firmware and sensitive data?
The STM32F732IEK6 includes hardware-based security features such as read-out protection (RDP), write protection (WRP), and option bytes to lock memory regions. It also supports TrustZone-like functionality through privileged/non-privileged access control, although it lacks dedicated crypto-accelerators found in higher-end H7 variants. While AES encryption can be performed in software, it consumes CPU cycles and lacks hardware offload. For secure boot or encrypted firmware updates, additional external tamper detection circuits or co-processors may be necessary depending on threat model requirements.
How does the STM32F732IEK6’s DMA architecture improve performance in multi-sensor fusion applications?
The STM32F732IEK6 integrates seven independent DMAC channels supporting peripheral-to-memory, memory-to-peripheral, and memory-to-memory transfers without CPU intervention. In multi-sensor setups—such as combining IMU data via SPI, ADC readings from analog sensors, and UART telemetry—DMA enables near-simultaneous data capture and preprocessing, minimizing jitter and freeing the Cortex-M7 core for fusion algorithms. Efficient use of scatter-gather lists and circular buffers allows continuous streaming even at high sample rates, reducing latency below what would be achievable with polling-based approaches.
Is it possible to upgrade firmware over-the-air (OTA) using the STM32F732IEK6 without risking bricking the device?
Yes, but only with robust design practices. The STM32F732IEK6 supports bootloader-based OTA updates via interfaces like UART, USB, or Ethernet, provided the bootloader resides in protected Flash sectors and has rollback safeguards. Risks include interrupted transmissions, corrupted images, or failed verification checks. To mitigate these, implement dual-bank Flash (if available on derivative) or reserve a recovery partition, use CRC validation, and include watchdog timers. Firmware signing adds another layer but requires cryptographic infrastructure, which may not be present unless augmented externally.
How does the STM32F732IEK6 compare to the STM32H743VI in terms of real-time processing capability for motor control loops?
While the STM32F732IEK6 offers strong DSP instructions and FPU support, the STM32H743VI operates at up to 480MHz with larger caches and integrated math accelerators, delivering superior performance for computationally intensive motor control tasks involving field-oriented control (FOC) or encoder interpolation. The F732IEK6 may suffice for simpler BLDC or stepper motor drives with moderate update rates (<10kHz), but the H743VI handles higher-resolution encoders and faster loops more efficiently. Memory bandwidth and instruction throughput differences become significant under sustained algorithmic load.
What precautions are needed when interfacing the STM32F732IEK6 with 5V logic levels from external sensors?
The STM32F732IEK6 operates at 1.7V to 3.6V, so direct connection to 5V signals violates absolute maximum ratings and risks permanent damage. Level shifting must be achieved using bidirectional translators (e.g., TXS0108E) or resistive dividers with Schottky diodes for clamping, depending on speed requirements. For high-speed serial links like SPI or I2C, dedicated level-shifter ICs with low propagation delay are recommended. Always verify signal rise/fall times and ensure compatibility with the MCU’s input thresholds, which shift with supply voltage.
How does the STM32F732IEK6’s package support thermal performance in compact enclosures?
The 176+25UFBGA package lacks an exposed thermal pad, limiting direct heat sinking compared to QFN or LQFP variants. Thermal resistance is higher, meaning junction temperatures rise more quickly under sustained load. In compact enclosures, passive convection is insufficient; forced airflow or thermally conductive adhesives may be required. Designers should monitor power dissipation (Pd = Vdd × Idd) and ensure worst-case operating conditions stay within the 85°C ambient limit, possibly throttling clock speeds or disabling unused peripherals during peak loads.
What development tools and middleware are officially supported for the STM32F732IEK6?
STMicroelectronics provides full support through STM32CubeIDE, STM32CubeMX, and HAL/LL libraries optimized for the Cortex-M7. Third-party toolchains like Keil MDK and IAR Embedded Workbench also support the device. Middleware includes FatFS for file systems, FreeRTOS, and LLCD drivers, though some advanced features (like USB device stacks) require license fees. Evaluation boards such as the STM32F732I-EVAL provide reference schematics and bring-up examples, accelerating prototype development and reducing integration risks.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics STM32F732IEK6

Product Attribute STM32F732IET6 STM32F732RET6 STM32F730I8K6TR STM32F732ZET6
Part Number STM32F732IET6 STM32F732RET6 STM32F730I8K6TR STM32F732ZET6
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Number of I/O - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Series - - - -
Program Memory Type - - - -
Core Size - - - -
Connectivity - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Peripherals - - - -
Data Converters - - - -
Speed - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Program Memory Size - - - -
EEPROM Size - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Oscillator Type - - - -
RAM Size - - - -
Core Processor - - - -

STM32F732IEK6 Datasheet PDF

Download STM32F732IEK6 pdf datasheets and STMicroelectronics documentation for STM32F732IEK6 - STMicroelectronics.

PCN Packaging
2.73KHz.pdf
PCN Assembly/Origin
2.73KHz.pdf
HTML Datasheet
STM32F7 Series Brochure.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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STM32F732IEK6 Image

STM32F732IEK6

STMicroelectronics
98D-STM32F732IEK6

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