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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersSTM32F730Z8T6TR
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STM32F730Z8T6TR - STMicroelectronics

Manufacturer Part Number
STM32F730Z8T6TR
Manufacturer
STMicroelectronics
Allelco Part Number
98D-STM32F730Z8T6TR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
49,129 pcs available, New & Original
Parts Description
IC MCU 32BIT 64KB FLASH 144LQFP
Package
144-LQFP (20x20)
Data sheet
STM32F730Z8T6TR.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 49129
  • Unit Price: $8.829
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $8.829 $8.83
10+ $8.463 $84.63
30+ $7.827 $234.81
100+ $7.272 $727.20
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

STM32F730Z8T6TR Tech Specifications
STMicroelectronics - STM32F730Z8T6TR technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - STM32F730Z8T6TR

Product Attribute Attribute Value
Manufacturer STMicroelectronics
Voltage - Supply (Vcc/Vdd) 1.7V ~ 3.6V
Supplier Device Package 144-LQFP (20x20)
Speed 216MHz
Series STM32F7
RAM Size 256K x 8
Program Memory Type FLASH
Program Memory Size 64KB (64K x 8)
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Package / Case 144-LQFP
Package Tape & Reel (TR)
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 112
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 24x12b; D/A 2x12b
Core Size 32-Bit Single-Core
Core Processor ARM® Cortex®-M7
Connectivity CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, UART/USART, USB
Base Product Number STM32F730

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected

Frequently Asked Questions(FAQ)

How does the STM32F730Z8T6TR's 216MHz ARM Cortex-M7 core compare to lower-clock-speed variants like the STM32F4 series in terms of real-time processing throughput for industrial control applications?
The STM32F730Z8T6TR operates at 216MHz with an ARM Cortex-M7 core, delivering significantly higher instruction per cycle (IPC) performance compared to typical STM32F4 devices running at 180MHz or less. This enables faster interrupt latency and more efficient handling of complex control algorithms. For instance, a PID loop executing 500 instructions could complete approximately 30% faster on the F730Z8T6TR, assuming similar compiler optimizations, which is critical in time-sensitive motor control or sensor fusion tasks.
What are the key differences between the STM32F730Z8T6TR and other STM32F7 family members such as the STM32F746, particularly regarding memory architecture and peripheral integration?
While both belong to the STM32F7 series, the STM32F730Z8T6TR features 64KB of flash and 256KB of RAM, making it suitable for smaller-footprint embedded systems. In contrast, the STM32F746 offers up to 1MB of flash and 320KB of RAM, along with integrated graphics controllers and Ethernet MACs. The F730Z8T6TR omits high-bandwidth peripherals like Ethernet and LCD-TFT interfaces, focusing instead on compact connectivity—USB OTG, CAN, QSPI, and SAI—ideal for cost-sensitive or space-constrained industrial nodes where core computational power must be balanced against resource constraints.
Can the STM32F730Z8T6TR reliably operate in automotive environments given its -40°C to +85°C temperature range?
The STM32F730Z8T6TR is rated for industrial temperature operation from -40°C to +85°C, which exceeds standard commercial-grade components but falls short of AEC-Q100 Grade 2 (up to +105°C). For non-automotive industrial applications—such as factory automation, HVAC controls, or test equipment—this range provides sufficient robustness. However, in full automotive systems requiring long-term reliability under extreme thermal cycling, additional qualification testing and environmental stress screening would be necessary beyond datasheet specifications.
How should PCB layout considerations differ when routing signals for the STM32F730Z8T6TR’s high-speed interfaces like USB and QSPI?
The STM32F730Z8T6TR includes USB 2.0 HS OTG, Quad-SPI, and SAI interfaces that demand careful impedance control and signal integrity management. For USB differential pairs, maintain 90Ω differential impedance with length matching within ±5mm. QSPI traces should be routed as controlled-impedance lines (typically 50Ω single-ended) with minimal vias and matched lengths across all four data lines. Ground planes beneath these nets reduce crosstalk, and decoupling capacitors must be placed within 1–2mm of VDD pins due to the IC’s fast transient response requirements at 1.8V/3.6V supply rails.
Is the 64KB flash memory of the STM32F730Z8T6TR sufficient for implementing over-the-air (OTA) firmware updates with security verification?
Implementing secure OTA requires reserving a portion of flash for bootloader, metadata, rollback sectors, and encrypted application images. Assuming a 128-byte sector erase granularity and a typical OTA package size of 10–20KB, the 64KB flash allows only modest update capabilities—perhaps one major revision with fallback. Larger firmware stacks or frequent feature updates may exceed available space without aggressive compression or delta-update strategies, increasing development complexity compared to larger STM32F7 variants.
How does the STM32F730Z8T6TR’s dual 12-bit DACs perform in analog output accuracy when used for precision voltage references in sensor calibration circuits?
The STM32F730Z8T6TR integrates two 12-bit DAC channels with 12-bit linearity and ±1 LSB integral nonlinearity, yielding typical resolution of ~0.024% full-scale. When driven from internal 1.8V reference, output stability depends heavily on external filtering and load isolation. In practice, for sensor calibration requiring ±1mV accuracy over 0–3.3V range, external buffer amplifiers and low-ESR bypass capacitors are essential. Absolute accuracy is limited by reference drift (±20ppm/°C), so temperature-stable designs may require external references despite the onboard option.
What trade-offs exist between using the STM32F730Z8T6TR’s internal oscillator versus an external crystal for timing-critical communication protocols like CAN bus arbitration?
The STM32F730Z8T6TR supports a 216MHz internal RC oscillator trimmed to ±1% accuracy, sufficient for basic system clocking but inadequate for precise CAN bit timing unless calibrated periodically. For reliable CAN operation at 500kbps over long cables, an external 4–26MHz crystal paired with the PLL provides better phase margin and jitter performance. Internal oscillator drift over temperature can cause bit errors during arbitration phases, especially in multi-node networks where synchronization sensitivity increases exponentially with baud rate.
How does the STM32F730Z8T6TR handle power consumption during sleep modes when battery-powered IoT edge devices are deployed?
In Stop mode with RTC active and Flash off, the STM32F730Z8T6TR draws approximately 12µA at 3.3V, while Standby mode reduces this to ~2µA by shutting down most circuitry except backup registers and reset circuitry. These values assume optimal configuration: disabling unnecessary clocks, minimizing leakage through GPIOs, and using low-power timers. For continuous operation over months on coin-cell batteries, developers must implement aggressive duty-cycling and leverage the MCU’s dynamic voltage scaling via the PWR module, though the absence of advanced ultra-low-power features found in STM32L4 or ULP MCUs limits ultimate energy efficiency.
Are there known limitations when using the STM32F730Z8T6TR’s DMA controllers concurrently with multiple high-throughput peripherals like SAI and QSPI?
Yes. Although the STM32F730Z8T6TR supports eight DMA streams with flexible channel mapping, shared resources such as the DMA1 request multiplexer limit simultaneous high-bandwidth transfers. Attempting simultaneous full-duplex SAI audio streaming and QSPI NOR flash reads may cause contention if not carefully scheduled. Realistic maximum sustained throughput drops by 15–20% when both peripherals operate continuously without interleaved bursts, necessitating software arbitration or use of separate DMA controllers (e.g., DMA2) for truly parallel data movement.
How does the STM32F730Z8T6TR support cryptographic acceleration for secure boot and firmware authentication?
The STM32F730Z8T6TR includes an AES-256 hardware accelerator supporting ECB, CBC, CTR, and GCM modes, plus SHA-2 engine for hashing operations. This enables efficient implementation of secure boot chains using X.509 certificates or PSA Certified Level 1 compliance. However, unlike higher-end F7 variants with RNG and TRNG modules, the F730Z8T6TR relies on deterministic RNG seeds derived from internal noise sources, requiring external entropy injection or periodic reseeding for cryptographic robustness in regulated environments.
What considerations apply when connecting the STM32F730Z8T6TR to external SRAM via its FSMC interface?
The STM32F730Z8T6TR exposes the Flexible Static Memory Controller (FSMC) supporting asynchronous NOR/PSRAM interfaces up to 32-bit data width. When interfacing with SRAM chips like IS61WV25616BLL, timing parameters must align with the memory’s access window: address setup/hold times, data valid delays, and write enable pulse widths. Typical configurations use extended wait states (2–4 cycles) for slower memories, increasing effective latency but ensuring reliable operation. Signal integrity becomes critical beyond 50MHz clock speeds due to capacitive loading on AD[0:15] and address lines.
How does the STM32F730Z8T6TR’s I²C peripheral behave when driving legacy sensors with slow rise times over longer bus lengths?
The STM32F730Z8T6TR’s I²C blocks support standard-mode (100kHz) and fast-mode (400kHz), but lack true fast-mode-plus capability. On buses exceeding 20cm with parasitic capacitance >400pF, standard-mode operation becomes unstable due to excessive rise times violating tSU;DAT requirements. Solutions include adding pull-up resistors with lower values (e.g., 2.2kΩ vs. 4.7kΩ), using I²C buffers, or switching to SPI for higher-speed devices. The internal Schmitt triggers help tolerate noise, but protocol timing margins shrink significantly in noisy industrial settings.
Can the STM32F730Z8T6TR drive multiple LEDs simultaneously without current-limiting resistors?
No. Each GPIO pin on the STM32F730Z8T6TR can source/sink up to 25mA continuously, but total package current must remain below 100mA to avoid thermal issues. Driving multiple LEDs directly risks exceeding individual pin ratings or cumulative dissipation limits. Instead, use external transistors or dedicated LED drivers (e.g., TLC5917) for arrays exceeding two or three LEDs, ensuring safe operating conditions and predictable brightness control via PWM from TIMx peripherals.
What impact does enabling the internal brown-out detection have on startup time and power-up sequencing for the STM32F730Z8T6TR?
Enabling BOR (Brown-Out Reset) adds negligible startup delay—typically <1ms—but ensures stable operation once VDD exceeds threshold (1.7V nominal). During power ramp-up from cold start, BOR prevents erratic behavior if supply dips occur, at the cost of slightly increased quiescent current (~1–2µA). For systems using soft-start regulators or battery backups, BOR should remain enabled; however, in lab prototypes with clean supplies, it may be disabled temporarily to accelerate debug cycles without affecting functional safety.
How does the STM32F730Z8T6TR’s USB OTG FS peripheral support device-mode enumeration in hostless embedded designs?
The USB OTG FS controller implements full-speed (12Mbps) USB device stack compatible with CDC, HID, or MSC class drivers. Enumeration succeeds after proper pull-up resistor configuration (1.5kΩ to 3.3V) and VBUS detection. Firmware must initialize the USB clock via PLLQ divider, configure endpoint descriptors, and handle SET_ADDRESS/SET_CONFIGURATION requests. Unlike HS variants, it lacks PHY-level equalization, so cable quality matters: reliable operation typically limited to 3m passive cables under moderate EMI conditions.
What precautions are necessary when using the STM32F730Z8T6TR’s ADC in simultaneous sampling mode across multiple channels?
The STM32F730Z8T6TR’s 24-channel ADC uses a shared SAR converter with configurable scan groups. Simultaneous sampling requires grouping channels into the same regular sequence and enabling injected mode for precise trigger alignment. However, inter-channel skew exceeds 100ns due to internal multiplexer settling, limiting true simultaneity. For applications demanding microsecond-level synchronization (e.g., current sensing in BLDC motors), external multiplexers or dedicated ADCs are preferable. Additionally, input impedance varies with sampling time selection, affecting gain accuracy in high-impedance sensor bridges.
How does the STM32F730Z8T6TR’s LIN bus implementation comply with protocol timing requirements for automotive diagnostic applications?
The STM32F730Z8T6TR includes a dedicated LIN master/slave peripheral compliant with LIN 2.2 specification. Bit timing accuracy depends on APB1 clock stability: at 48MHz APB1, achievable baud rates span 2.4–20kbps with <2% error. Wake-up frames must be detected within 100µs, achievable via interrupt-driven polling. However, absence of automatic checksum validation requires software CRC-16 implementation for full compliance, increasing CPU load during high-frequency message reception in gateway nodes.
What design implications arise from the STM32F730Z8T6TR’s 144-pin LQFP package in high-vibration industrial enclosures?
The 144-LQFP (20x20mm) package uses 0.5mm pitch leads, demanding precise solder joint integrity under mechanical stress. In vibration-prone environments, conformal coating or potting compounds improve solder fatigue resistance, but increase repairability challenges. Thermal expansion mismatches between FR4 PCBs and silicon die can induce stress at corners, potentially cracking solder balls over time. Reliability modeling suggests mean time between failures (MTBF) decreases by ~30% compared to QFN packages in shock environments, necessitating robust mechanical anchoring or alternative packaging if long-term ruggedness is critical.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics STM32F730Z8T6TR

Product Attribute STM32F730V8T6TR STM32F730Z8T6 STM32F730I8K6TR STM32F730V8T6
Part Number STM32F730V8T6TR STM32F730Z8T6 STM32F730I8K6TR STM32F730V8T6
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Oscillator Type - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Base Product Number - DAC34H84 MAX500 ADS62P42
Core Processor - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Program Memory Type - - - -
Core Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Speed - - - -
EEPROM Size - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Voltage - Supply (Vcc/Vdd) - - - -
Number of I/O - - - -
Peripherals - - - -
Program Memory Size - - - -
Connectivity - - - -
RAM Size - - - -
Data Converters - - - -
Series - - - -

STM32F730Z8T6TR Datasheet PDF

Download STM32F730Z8T6TR pdf datasheets and STMicroelectronics documentation for STM32F730Z8T6TR - STMicroelectronics.

PCN Packaging
Material Barrier Bag 17/Dec/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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STM32F730Z8T6TR Image

STM32F730Z8T6TR

STMicroelectronics
98D-STM32F730Z8T6TR

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