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OMAPL138BZCEA3E - Texas Instruments

Name: Texas Instruments OMAPL138BZCEA3E
Brand: Texas Instruments
SKU: OMAPL138BZCEA3E
Availability: InStock
Rating: 5 (8 reviews)

Manufacturer Part Number: OMAPL138BZCEA3E

Manufacturer: Texas Instruments

Allelco Part Number: 98D-OMAPL138BZCEA3E

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 13,511 pcs available, New & Original

Parts Description: IC MPU OMAP-L1X 375MHZ 361NFBGA

Package: 361-NFBGA (13x13)

Data sheet: OMAPL138BZCEA3E.pdf

PCN Design/Specification
Hybrid Au/Cu Wire Bond Flow 08/Apr/2014.pdf Multiple Changes Revision B 23/Jun/2014.pdf

PCN Obsolescence/ EOL
Freon/Netra/SubArtic EOL 06/Oct/2015.pdf Freon/Netra/SubArtic EOL Update 4/Nov/2015.pdf

RoHs Status: ROHS3 Compliant

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In stock: 13511

Specifications

OMAPL138BZCEA3E Tech Specifications
Texas Instruments - OMAPL138BZCEA3E technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL138BZCEA3E

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - I/O	1.8V, 3.3V
USB	USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Supplier Device Package	361-NFBGA (13x13)
Speed	375MHz
Series	OMAP-L1x
Security Features	Boot Security, Cryptography
SATA	SATA 3Gbps (1)
RAM Controllers	SDRAM
Package / Case	361-LFBGA
Package	Tube

Product Attribute	Attribute Value
Operating Temperature	-40°C ~ 105°C (TJ)
Number of Cores/Bus Width	1 Core, 32-Bit
Mounting Type	Surface Mount
Graphics Acceleration	No
Ethernet	10/100Mbps (1)
Display & Interface Controllers	LCD
Core Processor	ARM926EJ-S
Co-Processors/DSP	Signal Processing; C674x, System Control; CP15
Base Product Number	OMAPL138
Additional Interfaces	HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Frequently Asked Questions(FAQ)

How does the OMAPL138BZCEA3E compare to other OMAP-L1x processors in terms of core architecture and clock speed, and what implications does this have for real-time signal processing applications?: The OMAPL138BZCEA3E features a single-core ARM926EJ-S processor running at 375MHz, which is a common configuration across the OMAP-L1x series. While it lacks the dual-core or higher-performance Cortex-A series found in newer TI devices, its integration of a C674x DSP core enables efficient signal processing tasks such as audio encoding/decoding and motor control algorithms. For applications requiring deterministic timing with moderate computational loads—such as industrial sensor data filtering—this architecture provides sufficient throughput without introducing significant latency, especially when leveraging hardware accelerators like the LCD controller and Ethernet MAC.

In embedded system design, how should power supply sequencing be managed when using the OMAPL138BZCEA3E given its dual I/O voltage rails (1.8V and 3.3V), and what risks arise from improper sequencing?: The OMAPL138BZCEA3E supports both 1.8V and 3.3V I/O voltages, requiring careful coordination between core and peripheral power domains. Although the datasheet specifies nominal operating conditions, improper power-up sequencing—such as bringing up 3.3V before 1.8V—can lead to latch-up conditions due to reverse current flow through input protection diodes. Engineers typically implement dedicated power management ICs (PMICs) capable of enforcing correct sequencing within ±100ms tolerance. In battery-powered designs, this also affects overall efficiency, as switching regulators must support multiple output rails while minimizing quiescent current.

What are the key differences between the OMAPL138BZCEA3E and the OMAPL137 in terms of interface availability and how might that influence peripheral selection in an industrial automation application?: The OMAPL138BZCEA3E includes one SATA 3Gbps port and enhanced USB connectivity compared to the OMAPL137, which lacks SATA support. This makes the L138 more suitable for applications requiring direct storage access or high-speed data logging, such as edge computing nodes in factory floors. Additionally, both share similar HPI, McBSP, and McASP interfaces, but the L138’s inclusion of a dedicated LCD controller simplifies graphical user interface development. Designers targeting legacy serial protocols may still prefer the L137 due to lower pin count and reduced BOM cost, despite its functional limitations.

Given the OMAPL138BZCEA3E's operating temperature range of -40°C to 105°C (TJ), how should thermal design considerations differ between automotive and industrial environments, and what derating strategies apply?: While the OMAPL138BZCEA3E meets standard industrial grade requirements, automotive applications often demand tighter thermal margins due to prolonged exposure to ambient extremes. In practice, junction temperatures above 85°C TJ reduce mean time between failures (MTBF), necessitating heatsinking or airflow even if air convection suffices in industrial cases. Thermal simulation using JEDEC JESD51 standards is recommended; assuming natural convection, a PCB with ≥4 oz copper and thermal vias under the 361-NFBGA package can keep TJ below 90°C during full load. Derating the CPU frequency by 10–15% further enhances reliability in harsh environments.

Can the OMAPL138BZCEA3E directly drive a standard HDMI display, and what intermediate components or signal conversion would be necessary?: No, the OMAPL138BZCEA3E does not include HDMI-compliant output circuitry. It features an integrated LCD controller supporting parallel RGB and TTL interfaces, commonly used with TFT panels. To interface with HDMI displays, designers must add an external scaler or converter IC such as the TI TVP7002 or Analog Devices ADV7511. These chips accept LVDS or parallel digital video inputs from the processor and convert them to TMDS signaling compatible with HDMI. This adds latency (~2–3 frames) and increases board complexity but enables full-resolution video output on consumer-grade monitors.

How does boot security implemented in the OMAPL138BZCEA3E affect firmware development workflows, particularly in regulated industries like medical or aerospace?: The OMAPL138BZCEA3E incorporates cryptographic boot ROM and support for secure key storage, enabling signed firmware validation during startup. This requires developers to generate RSA/ECDSA keys and integrate them into the bootloader (e.g., u-boot with SPL). In regulated sectors, this process must align with certification requirements (e.g., DO-178C, IEC 62304), demanding traceability from source code to signed binaries. Failure to properly manage key lifecycle—such as storing private keys on insecure media—compromises the entire chain-of-trust model. Therefore, most production systems use tamper-resistant secure elements for key storage rather than relying solely on internal flash.

When selecting memory for a system using the OMAPL138BZCEA3E, what are the optimal configurations for SDRAM and on-chip RAM to minimize external memory bandwidth bottlenecks?: The OMAPL138BZCEA3E integrates 64KB L1 cache and 64KB L2 SRAM, sufficient for small RTOS task stacks and interrupt handling. However, application code exceeding this size demands external SDRAM. A typical configuration uses a 16/32-bit-wide mobile DDR or standard SDRAM with burst transfers enabled. For example, a 128MB MT48LC16M16A2 SDRAM running at 100MHz provides ~800 Mbps bandwidth, adequate for Linux-based multimedia apps. To maximize utilization, software should leverage DMA channels (available via EDMA or I2C/McASP peripherals) to overlap data movement with computation, reducing CPU overhead by up to 40% in benchmarked audio transcoding scenarios.

What are the implications of the OMAPL138BZCEA3E’s MSL 3 classification for manufacturing yield and long-term field reliability in high-volume production?: With an Moisture Sensitivity Level of 3 (MSL 3), the OMAPL138BZCEA3E requires baking prior to reflow if stored beyond 168 hours at 30°C/60% RH. Improper handling during SMT assembly can cause popcorning or delamination, increasing defect rates. High-volume manufacturers mitigate this by implementing automated dry-packaging with nitrogen purging and real-time humidity monitoring. From a reliability standpoint, each reflow cycle introduces cumulative thermomechanical stress; thus, designs should limit rework attempts to ≤2 cycles. Statistical process control (SPC) charts tracking warpage measurements per batch help maintain consistency across thousands of units.

How do the presence of both USB 1.1 and USB 2.0 ports in the OMAPL138BZCEA3E impact firmware design choices for human-machine interface (HMI) devices?: Having both USB 1.1 and USB 2.0 interfaces allows backward compatibility with legacy peripherals while supporting high-speed data transfer for cameras or mass storage. Firmware must enumerate both controllers independently, managing endpoint allocation carefully to avoid conflicts. For HMI applications, USB 2.0 is typically used for touchscreen drivers requiring faster polling rates (>100 Hz), whereas USB 1.1 handles simple input devices like mice or keyboards. Developers should allocate separate work queues in RTOS tasks to service each host controller’s interrupts asynchronously, preventing priority inversion that could degrade responsiveness.

What trade-offs exist between using the OMAPL138BZCEA3E’s integrated LCD controller versus adding an external GPU for graphical rendering in portable instrumentation?: The OMAPL138BZCEA3E’s LCD controller supports resolutions up to 800×480 with 18-bit color depth, sufficient for basic menus, waveforms, and numeric readouts. Integrating it reduces component count and power consumption (<15 mW active), ideal for handheld tools. However, complex animations or 3D graphics require external GPUs like the Sitara AM335x’s SGX530 or discrete solutions, increasing cost and footprint. For most industrial scopes or multimeters, however, the L138’s capabilities meet performance needs without sacrificing battery life, making it preferable over discrete GPU paths.

How does the absence of floating-point unit (FPU) in the ARM926EJ-S core affect algorithm implementation in the OMAPL138BZCEA3E, and what alternatives exist for maintaining precision?: As the ARM926EJ-S lacks an FPU, floating-point operations incur significant software overhead—typically 10–50x slower than integer math. In DSP-heavy applications like FFTs or PID loops, this forces reliance on fixed-point arithmetic libraries (e.g., TI’s DSPLIB). Proper scaling and saturation logic prevent overflow errors, but require meticulous bit-width planning. Alternatively, offloading FP tasks to the C674x DSP core improves performance by 10–20x, though it consumes additional power and complicates memory mapping. Many designs partition workloads so that the ARM handles control logic while the DSP manages math-intensive blocks.

What considerations apply when integrating the OMAPL138BZCEA3E with FPGA-based co-processors via its HPI or McBSP interfaces, and what timing constraints must be respected?: The HPI (Host Port Interface) offers a high-bandwidth parallel bus for FPGA communication, supporting up to 132 Mbps in 8-bit mode. Timing closure requires careful layout: trace lengths matched within ±50 mils, impedance controlled at 50Ω differential pairs for clock lines, and decoupling capacitors placed <2 mm from VDD pins. McBSPs provide serial links with configurable framing, useful for streaming ADC/DAC data. Clock domain crossing becomes critical when synchronizing FPGA-generated clocks with the L138’s internal PLL; asynchronous FIFOs or handshake protocols prevent metastability-induced data corruption.

How does the OMAPL138BZCEA3E’s lack of integrated Wi-Fi or Bluetooth affect wireless connectivity options in IoT gateway designs, and what external modules are typically employed?: Without built-in wireless radios, designers must interface the OMAPL138BZCEA3E with discrete modules via UART, SPI, or SDIO. Common choices include ESP32 (Wi-Fi + BT/BLE) over UART with AT command protocol, or Nordic nRF52840 for Bluetooth mesh networks. Careful attention to antenna placement, RF shielding, and regulatory compliance (FCC, CE) is essential. Power consumption analysis shows that waking the L138 periodically to poll wireless modules saves energy compared to continuous transmission, extending battery life in solar-powered gateways.

What role does CP15 play in system-level debugging and performance profiling on the OMAPL138BZCEA3E, and how can developers leverage it effectively?: CP15 is the ARM926EJ-S’s coprocessor for memory management, cache control, and debug configuration. It enables setting watchpoints, controlling instruction/data caches, and configuring MMU regions—critical for optimizing memory access patterns. During profiling, disabling caches reveals true memory latency; re-enabling them with proper alignment boosts throughput by 3–5x. Debuggers like Code Composer Studio use CP15 registers to halt execution, inspect coprocessor state, and validate secure boot settings. Misconfiguration here can lead to unpredictable behavior, underscoring the need for rigorous testing across cache states.

How should developers handle EMC compliance when routing signals near the OMAPL138BZCEA3E’s high-speed interfaces like SATA or Ethernet in compact form factors?: High-speed traces (SATA, RMII/MII Ethernet) demand strict impedance control (90Ω diff for SATA, 100Ω for Ethernet), length matching (±100 mil max skew), and guard traces grounded every λ/10. Ferrite beads on power rails suppress conducted emissions, while common-mode chokes reduce radiated noise. Layout should avoid vias under BGA pads and use 4-layer stackups with dedicated ground/power planes. Pre-compliance scans using spectrum analyzers can identify problematic harmonics early, avoiding costly redesigns post-certification.

What are the practical limitations of the OMAPL138BZCEA3E’s 10/100Mbps Ethernet PHY in industrial networking contexts requiring deterministic latency?: Standard 10/100 Ethernet lacks hard real-time guarantees due to CSMA/CD arbitration and variable packet delays. While EtherCAT or PROFINET IRT implementations exist, they require additional ASICs or FPGAs for frame preprocessing. The L138 alone cannot guarantee microsecond-level jitter typical in motion control systems. For soft-real-time applications like sensor aggregation, however, QoS tagging and traffic shaping via software suffice. Alternatives include migrating to gigabit-capable SoCs or augmenting with dedicated Ethernet switches supporting IEEE 802.1Qbv time-aware shaper.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments OMAPL138BZCEA3E

Product Attribute
Part Number	OMAPL138BZCEA3D	OMAPL138BZCEA3R	OMAPL138BZCEA3	OMAPL138BZCE3
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Series	-	-	-	-
Voltage - I/O	-	-	-	-
Speed	-	-	-	-
Graphics Acceleration	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
SATA	-	-	-	-
Additional Interfaces	-	-	-	-
Core Processor	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Co-Processors/DSP	-	-	-	-
Display & Interface Controllers	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
RAM Controllers	-	-	-	-
USB	-	-	-	-
Number of Cores/Bus Width	-	-	-	-
Ethernet	-	-	-	-
Security Features	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42

OMAPL138BZCEA3E Datasheet PDF

Download OMAPL138BZCEA3E pdf datasheets and Texas Instruments documentation for OMAPL138BZCEA3E - Texas Instruments.

PCN Design/Specification: Hybrid Au/Cu Wire Bond Flow 08/Apr/2014.pdf Multiple Changes Revision B 23/Jun/2014.pdf
PCN Obsolescence/ EOL: Freon/Netra/SubArtic EOL 06/Oct/2015.pdf Freon/Netra/SubArtic EOL Update 4/Nov/2015.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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