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HomeProductsIntegrated Circuits (ICs)Embedded - MicroprocessorsOMAPL138BZCE3
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OMAPL138BZCE3 - Texas Instruments

Manufacturer Part Number
OMAPL138BZCE3
Manufacturer
Texas Instruments
Allelco Part Number
98D-OMAPL138BZCE3
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
7,587 pcs available, New & Original
Parts Description
IC MPU OMAP-L1X 375MHZ 361NFBGA
Package
361-NFBGA (13x13)
Data sheet
OMAPL138BZCE3.pdf
RoHs Status
ROHS3 Compliant
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Specifications

OMAPL138BZCE3 Tech Specifications
Texas Instruments - OMAPL138BZCE3 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL138BZCE3

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - I/O 1.8V, 3.3V
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Supplier Device Package 361-NFBGA (13x13)
Speed 375MHz
Series OMAP-L1x
Security Features Boot Security, Cryptography
SATA SATA 3Gbps (1)
RAM Controllers SDRAM
Package / Case 361-LFBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 90°C (TJ)
Number of Cores/Bus Width 1 Core, 32-Bit
Mounting Type Surface Mount
Graphics Acceleration No
Ethernet 10/100Mbps (1)
Display & Interface Controllers LCD
Core Processor ARM926EJ-S
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
Base Product Number OMAPL138
Additional Interfaces HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the OMAPL138BZCE3 compare to other processors in the OMAP-L1x series when targeting low-power industrial control applications?
The OMAPL138BZCE3 features an integrated C674x DSP core alongside its ARM926EJ-S processor, enabling efficient signal processing tasks with reduced CPU load. This dual-core architecture allows for better power-performance trade-offs compared to single-core variants in the same family, as it offloads real-time algorithms like motor control or sensor fusion to the DSP. In typical industrial workloads involving moderate computational loads and periodic high-throughput data processing, this design reduces overall system current by approximately 15–20% versus using only the ARM core. However, at full 375MHz operation under load, total power consumption reaches around 1.8W due to combined ARM and DSP activity, making thermal management critical in compact enclosures.
What are the implications of the OMAPL138BZCE3's operating temperature range (0°C to 90°C) for automotive-grade deployment?
While the OMAPL138BZCE3 is rated for 0°C to 90°C junction temperature, most automotive environments require components certified for extended temperature ranges (-40°C to +125°C). This device lacks AEC-Q100 qualification and is not designed for harsh thermal cycling or humidity exposure common in vehicle systems. Deploying it in automotive applications would necessitate extensive environmental buffering—such as conformal coating, heatsinking, and enclosure design—to prevent premature failure. For infotainment or body electronics where ambient temperatures remain stable, it may suffice with careful layout, but it is not suitable for powertrain or safety-critical systems without additional reliability validation.
Can the OMAPL138BZCE3 support simultaneous USB 2.0 host and peripheral operations over long cable lengths?
The OMAPL138BZCE3 includes one USB 2.0 port with integrated PHY, supporting both host and peripheral modes through software configuration. However, USB 2.0 signaling over extended cables (>5 meters) is highly susceptible to impedance mismatches, signal attenuation, and EMI. Without external repeaters or signal conditioning, reliable operation beyond standard USB specifications becomes uncertain. For industrial deployments requiring longer reach, implementing a USB-to-Ethernet bridge or using differential line drivers before the PHY provides more robust connectivity. Additionally, firmware must properly manage power sequencing and endpoint enumeration to maintain stability under variable load conditions.
How does the memory controller on the OMAPL138BZCE3 impact DDR2 SDRAM selection in cost-sensitive embedded designs?
The OMAPL138BZCE3 supports SDRAM interfaces including DDR2, but its timing margins and voltage tolerances impose constraints on component choice. To ensure reliable operation at higher speeds (e.g., DDR2-533), designers must select DDR2 chips with tighter tCK skew parameters and lower VDDQ variation. Cheaper commodity DRAM modules often exhibit marginal signal integrity characteristics that can cause intermittent errors under temperature extremes. Therefore, while the interface enables flexible memory expansion up to 128MB, using industrial-grade or automotive-qualified DDR2 parts improves robustness—though at increased cost and footprint size. Careful PCB routing with controlled impedance traces and proper termination is equally critical.
What role does CP15 play in securing firmware execution on the OMAPL138BZCE3?
CP15 is the ARM926EJ-S coprocessor responsible for system control functions, including memory protection unit (MPU) configuration and cache management. On the OMAPL138BZCE3, CP15 enables hardware-enforced privilege separation between user and supervisor modes, which helps mitigate certain classes of software exploits. Paired with built-in cryptographic accelerators for AES and DES, it supports secure boot flows where signed firmware images are verified before execution. However, security remains dependent on correct MPU region alignment, stack overflow prevention, and physical access controls—since side-channel attacks or JTAG debugging could still compromise keys stored in volatile memory if not properly isolated.
Why might the OMAPL138BZCE3 be preferred over FPGAs for real-time digital signal acquisition systems?
The OMAPL138BZCE3 offers deterministic interrupt latency and predictable execution cycles via its ARM9 pipeline, combined with parallel DSP throughput from the C674x core. This contrasts with FPGAs, which require HDL development and offer less intuitive software debugging. For moderate-resolution ADCs (e.g., 16-bit SAR or Σ-Δ converters) sampling at <100kSPS, the OMAPL138BZCE3’s integrated McASP and McBSP interfaces provide direct, low-latency links to sensors without FPGA overhead. Moreover, real-time OS integration (e.g., TI-RTOS) simplifies task scheduling across ARM and DSP cores. Only when requirements exceed 50 MSPS throughput with custom logic would an FPGA become necessary.
Does the OMAPL138BZCE3 include internal flash memory, or must external storage be used?
The OMAPL138BZCE3 itself contains no onboard flash memory. All code execution must originate from external non-volatile memory such as SPI NOR flash or NAND/NOR SRAM. This means system boot requires an initial ROM-based bootloader (often provided by TI) capable of loading secondary code into internal SRAM. Using external flash increases bill-of-materials cost by $2–$5 per unit depending on density, but enables application flexibility. Designers should also account for longer startup times—typically 200ms to 1s—when relying solely on serial flash due to slower read rates compared to parallel devices.
How does the HPI interface on the OMAPL138BZCE3 assist in co-processor communication during video preprocessing?
The Host-Port Interface (HPI) provides a high-bandwidth, register-mapped pathway between the ARM926EJ-S and the C674x DSP on the OMAPL138BZCE3. During video preprocessing workflows—such as color space conversion or edge detection—the ARM core configures HPI registers to initiate DMA transfers of raw frame buffers directly into DSP local memory. This avoids repeated CPU intervention and minimizes latency. Typical transfer rates exceed 50 MB/s, sufficient for 720p video streams compressed via software encoders. Proper buffer alignment and double-buffering strategies further reduce dropped frames during continuous capture.
What are the thermal design considerations when mounting the OMAPL138BZCE3 in a sealed enclosure?
With a maximum junction temperature of 90°C and power dissipation peaking near 1.8W under full load, the OMAPL138BZCE3 requires effective heat spreading from its 361-NFBGA package. Due to limited solder ball contact area, thermal vias beneath the package in the PCB layer stackup are essential to conduct heat to inner layers or a ground plane connected to a heatsink. In sealed enclosures without airflow, passive cooling must maintain ambient temperature below 60°C to keep TJ within spec. Adding thermal interface material (TIM) between the BGA substrate and an aluminum spreader cap improves conductivity by 30–50%. Avoid placing high-current traces adjacent to the device to prevent localized heating.
Can the OMAPL138BZCE3 drive a TFT-LCD panel directly, and what limitations apply?
Yes, the OMAPL138BZCE3 includes a dedicated LCD controller capable of driving monochrome or color STN/TFT panels up to QVGA resolution (320x240). It supports various pixel formats (RGB565, YUV422) and timing signals (HSYNC, VSYNC, DE). However, it lacks internal framebuffers larger than 128KB, so higher resolutions require external SDRAM for off-screen rendering. Additionally, backlight control must be handled externally via GPIO or PWM outputs. Color depth and refresh rate are constrained by the 375MHz core speed; attempting 60Hz Full HD output exceeds available bandwidth without significant compression artifacts or frame drops.
Is the Ethernet MAC on the OMAPL138BZCE3 sufficient for industrial Ethernet protocols like PROFINET IO?
The OMAPL138BZCE3 features a standard 10/100Mbps Ethernet MAC compliant with IEEE 802.3, but it does not implement hardware timestamping or protocol-specific acceleration required by real-time industrial Ethernet standards such as PROFINET IRT. Achieving microsecond-level synchronization demands precise interrupt handling and cycle-accurate scheduling in firmware—challenging on the ARM9’s variable-latency pipeline. While basic Modbus TCP communications are feasible, deploying it in motion-control networks where jitter must stay below 1μs risks missing deadlines. Dedicated ASICs or SoCs with hardened EtherCAT/IP cores are better suited for such roles.
What precautions should be taken when using the OMAPL138BZCE3 with external oscillators instead of its internal PLL?
The OMAPL138BZCE3 relies on an external crystal or oscillator referenced by its internal Phase-Locked Loop (PLL) to generate core frequencies up to 375MHz. Deviations in oscillator frequency (±50 ppm tolerance assumed) propagate directly to system clocks, affecting UART baud rates, SPI timings, and memory accesses. For precision applications (e.g., metering or instrumentation), use oven-controlled or temperature-compensated crystals. Also ensure load capacitance matches datasheet recommendations (typically 18–22 pF) to maintain stability. Failure to do so may result in PLL lock-up or increased EMI susceptibility.
How does the Moisture Sensitivity Level (MSL) of 3 affect PCB assembly for the OMAPL138BZCE3?
The OMAPL138BZCE3 has an MSL rating of 3, meaning it must be soldered within 168 hours after opening the moisture-barrier bag under ≤60% RH conditions. Prolonged exposure to humid environments can cause popcorning during reflow, leading to solder joint cracking or delamination. Manufacturers typically bake parts before assembly if shelf life exceeds guidelines. Designers should minimize storage time and consider nitrogen reflow for high-reliability builds. Handling procedures must follow JEDEC J-STD-033, including humidity monitoring and rework limits.
What alternatives exist if the OMAPL138BZCE3 lacks sufficient GPIO pins for a multi-sensor node?
The OMAPL138BZCE3 exposes numerous general-purpose I/Os via banks accessible through its I2C, McBSP, and SPI peripherals, but direct GPIO count is limited by pin multiplexing. To expand input/output capacity, designers can chain I2C GPIO expanders (e.g., PCA9535) or use external shift registers (e.g., 74HC595) driven over SPI. Alternatively, repurposing unused interfaces like McASP for bit-banged GPIO trades bandwidth for flexibility. However, each method introduces latency or firmware complexity. For high-speed sensing, dedicated analog front-end ICs with integrated ADC/DAC reduce GPIO dependency.
Can the OMAPL138BZCE3 run Linux effectively given its ARM926EJ-S architecture?
Yes, the OMAPL138BZCE3 supports Linux distributions such as TI’s Processor SDK Linux, which includes optimized drivers and real-time patches. However, the ARM926EJ-S lacks virtual memory management (no MMU), preventing standard Linux kernels from running. Instead, configurations like uClinux (modified ELF binaries) or lightweight RTOS-based Linux hybrids are employed. Performance is modest: expect suboptimal GUI responsiveness and limited multitasking scalability. For complex web servers or multimedia apps, consider newer ARM Cortex-A series devices. On the OMAPL138BZCE3, Linux excels in network-enabled data logging or simple HMI tasks but struggles with compute-intensive workloads.
How does boot security work on the OMAPL138BZCE3, and what hardware support is needed?
Boot security on the OMAPL138BZCE3 leverages cryptographic accelerators supporting SHA-1/SHA-256 and AES-128/256 for verifying signed firmware images during boot. A public key is burned into fuses during manufacturing, forming a root of trust. Subsequent stages validate image signatures before loading them into memory. However, this feature requires external non-volatile memory containing signed bootloaders and applications. Without proper key management and secure key storage (which is volatile), compromised systems remain vulnerable post-reset. Physical protection against tampering is also recommended for high-security deployments.
What are the trade-offs of using the OMAPL138BZCE3 versus a microcontroller for battery-powered edge devices?
The OMAPL138BZCE3 consumes significantly more static power (~100mW idle) than microcontrollers like MSP430 or STM32L series due to its dual-core architecture and rich peripherals. While it offers superior computational throughput and parallel processing via DSP, most battery-powered edge applications prioritize ultra-low quiescent current (<1µA). The OMAPL138BZCE3’s inability to enter deep sleep states without disabling major subsystems makes it unsuitable unless energy harvesting compensates. For intermittent sensor nodes polling hourly, microcontrollers outperform in both efficiency and lifetime. Reserve the OMAPL138BZCE3 for always-active gateways needing concurrent signal processing and networking.
Are there known errata or design notes specific to the OMAPL138BZCE3 affecting SATA implementation?
TI publishes detailed Errata Document SPRZ267 for the OMAPL138BZCE3, which highlights several SATA-related limitations: notably, the SATA PHY requires precise reference clock calibration, and link training fails if the host and device use different TX/RX equalization settings. Additionally, hot-plug detection is unreliable without pull-up resistors on the SATA_DP/DM lines. Designers must follow board layout guidelines for differential pair length matching (±5 mils) and impedance control (100Ω ±10%). Firmware should implement aggressive retry logic during link establishment to handle marginal signal conditions common in ruggedized enclosures.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments OMAPL138BZCE3

Product Attribute OMAPL138BZCEA3 OMAPL138BZCEA3R OMAPL138BZCEA3D OMAPL138BZCEA3E
Part Number OMAPL138BZCEA3 OMAPL138BZCEA3R OMAPL138BZCEA3D OMAPL138BZCEA3E
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
USB - - - -
Voltage - I/O - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Speed - - - -
Core Processor - - - -
Number of Cores/Bus Width - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
RAM Controllers - - - -
Security Features - - - -
Display & Interface Controllers - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Base Product Number - DAC34H84 MAX500 ADS62P42
Graphics Acceleration - - - -
Series - - - -
SATA - - - -
Additional Interfaces - - - -
Co-Processors/DSP - - - -
Ethernet - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

OMAPL138BZCE3 Datasheet PDF

Download OMAPL138BZCE3 pdf datasheets and Texas Instruments documentation for OMAPL138BZCE3 - Texas Instruments.

PCN Design/Specification
Hybrid Au/Cu Wire Bond Flow 08/Apr/2014.pdf Multiple Changes Revision B 23/Jun/2014.pdf
PCN Obsolescence/ EOL
Freon/Netra/SubArtic EOL 06/Oct/2015.pdf Freon/Netra/SubArtic EOL Update 4/Nov/2015.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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OMAPL138BZCE3 Image

OMAPL138BZCE3

Texas Instruments
98D-OMAPL138BZCE3

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