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HomeProductsIntegrated Circuits (ICs)Embedded - MicroprocessorsOMAPL138BZCE4
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OMAPL138BZCE4 - Texas Instruments

Manufacturer Part Number
OMAPL138BZCE4
Manufacturer
Texas Instruments
Allelco Part Number
98D-OMAPL138BZCE4
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
21,331 pcs available, New & Original
Parts Description
OMAP DSP, 0-EXT BIT, 50MHZ, CMOS
Package
361-NFBGA (13x13)
Data sheet
-
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 21331
  • Unit Price: $29.90
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $29.90 $29.90
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

OMAPL138BZCE4 Tech Specifications
Texas Instruments - OMAPL138BZCE4 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL138BZCE4

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - I/O 1.8V, 3.3V
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Supplier Device Package 361-NFBGA (13x13)
Speed 456MHz
Series OMAP-L1x
Security Features Boot Security, Cryptography
SATA SATA 3Gbps (1)
RAM Controllers DDR2, LPDDR
Package / Case 361-LFBGA
Product Attribute Attribute Value
Package Bulk
Operating Temperature 0°C ~ 90°C (TJ)
Number of Cores/Bus Width 1 Core, 32-Bit
Mounting Type Surface Mount
Graphics Acceleration No
Ethernet 10/100Mbps (1)
Display & Interface Controllers LCD
Core Processor ARM926EJ-S
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
Additional Interfaces HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the OMAPL138BZCE4 compare to other OMAP-L1x processors in terms of clock speed and memory controller support when targeting low-power industrial applications?
The OMAPL138BZCE4 operates at a maximum core frequency of 456MHz, which is among the higher speeds within the OMAP-L1x family, enabling efficient signal processing tasks. It supports DDR2 and LPDDR RAM controllers, providing flexibility for cost-sensitive or power-optimized designs. Compared to lower-speed variants like the OMAPL137 (300MHz), this device offers better computational throughput while still maintaining the ARM926EJ-S architecture and integrated C674x DSP, making it suitable for real-time control and moderate data-processing workloads.
What are the key differences between the OMAPL138BZCE4 and similar ARM9-based embedded processors in terms of peripheral integration and power efficiency?
Unlike many standalone ARM9 microcontrollers, the OMAPL138BZCE4 integrates a dedicated C674x fixed-point DSP core alongside the ARM926EJ-S, enabling heterogeneous processing for audio/video encoding or motor control algorithms. It also includes multiple communication interfaces such as McASP, McBSP, HPI, and dual USB ports with PHYs—features not commonly found in general-purpose MCUs. While its 3.3V/1.8V I/O levels support mixed-voltage systems, its 456MHz operation and active cooling requirements may reduce overall system power efficiency compared to ultra-low-power Cortex-M variants.
Can the OMAPL138BZCE4 be used in automotive environments, and what design considerations apply given its operating temperature range?
The OMAPL138BZCE4 is rated for an industrial temperature range of 0°C to 90°C (TJ), which excludes most automotive-grade (-40°C to +125°C) requirements. Therefore, it is not qualified for AEC-Q100 compliance and should not be used in automotive safety-critical systems without additional environmental buffering. For non-automotive industrial applications—such as factory automation or test equipment—the specified range is adequate, but designers must ensure PCB layout, thermal management, and component derating align with sustained full-load operation near 90°C.
What impact does the 361-NFBGA package size have on board layout complexity when integrating the OMAPL138BZCE4 into a compact embedded system?
The 361-pin NFBGA (13x13 mm) package of the OMAPL138BZCE4 presents significant routing challenges due to high pin density and fine-pitch BGA requirements. Designers must employ at least four-layer PCBs with controlled impedance traces and careful via placement to meet timing and signal integrity constraints—especially for DDR2/LPDDR memory buses and high-speed interfaces like SATA. Proper solder paste stencil design and reflow profiling are critical to avoid popcorning or open joints, particularly given the Moisture Sensitivity Level 3 classification.
How does the presence of both USB 1.1 and USB 2.0 controllers affect system architecture decisions when using the OMAPL138BZCE4?
The inclusion of both USB 1.1 and USB 2.0 host/device controllers with integrated PHYs allows flexible connectivity options—for example, connecting legacy peripherals via USB 1.1 while supporting high-bandwidth devices like mass storage over USB 2.0. However, simultaneous use may compete for bandwidth or interrupt resources, requiring careful firmware scheduling. This dual capability avoids the need for external hubs or transceivers, simplifying hardware but increasing software complexity in multi-port applications.
Is boot security enabled by default on the OMAPL138BZCE4, and how does the cryptography module influence secure firmware deployment?
Boot security on the OMAPL138BZCE4 is not enabled by default; it must be configured through CP15 registers and external cryptographic keys stored in secure ROM or OTP memory. The device supports hardware-accelerated encryption/decryption routines via the cryptographic engine, which can offload SHA, AES, and RSA operations from the main CPU. This enables secure boot sequences and encrypted firmware updates, essential for defense or medical applications, though key management remains the designer’s responsibility.
What trade-offs exist between using the OMAPL138BZCE4 with DDR2 versus LPDDR memory, considering power consumption and performance targets?
LPDDR offers lower voltage (typically 1.2V vs 1.8V for DDR2) and reduced dynamic power, making it preferable for battery-powered edge devices. However, DDR2 provides higher bandwidth and broader availability in standard industrial modules. With the OMAPL138BZCE4, both types are supported through programmable controller settings, allowing designers to prioritize either energy efficiency or raw throughput. System-level simulations should account for memory latency and refresh overhead when selecting between the two.
How does the absence of integrated graphics acceleration limit or enable certain application domains for the OMAPL138BZCE4?
Since the OMAPL138BZCE4 lacks onboard GPU or display pipeline blocks, it cannot drive complex UIs or video overlays directly. Instead, it relies on external framebuffers and software rendering via the LCD controller, which limits use to basic text/graphics displays or offloading visual tasks to companion chips. This absence simplifies SoC architecture, reduces die size, and lowers power, favoring applications like sensor hubs, motor drives, or protocol converters where display resolution is modest.
What role does the HPI interface play in typical OMAPL138BZCE4-based systems, and how does it compare to alternative host interfaces like PCIe or SPI?
The High-Performance Parallel Interface (HPI) on the OMAPL138BZCE4 provides a direct 16-bit data bus between the ARM9 core and the C674x DSP, enabling low-latency data exchange for co-processing scenarios. Unlike SPI—which would require bit-banging and higher CPU overhead—or PCIe—which exceeds the SoC’s capabilities—HPI delivers deterministic throughput ideal for real-time signal chaining. It effectively bypasses shared memory bottlenecks, making it optimal for fixed-point algorithm offloading.
Are there known limitations in interrupt handling when running concurrent tasks on the ARM926EJ-S and C674x cores of the OMAPL138BZCE4?
Yes. Although the ARM926EJ-S and C674x share some interrupt lines, their vector tables and priority schemes are independent, which can lead to race conditions if not carefully synchronized. Shared peripherals like UART or SPI generate interrupts visible to both cores, requiring explicit handshaking or message passing (e.g., mailboxes) to prevent data corruption. Designers must avoid assuming atomic access across cores and instead implement mutual exclusion primitives in shared resource drivers.
How does the SATA 3Gbps interface on the OMAPL138BZCE4 compare functionally to eMMC or SD/MMC interfaces in terms of throughput and reliability for embedded storage?
SATA 3Gbps offers significantly higher sequential transfer rates (up to ~300MB/s) than SD/MMC (typically <50MB/s) or eMMC (varies but usually under 100MB/s), making it suitable for logging-intensive or media-rich applications. However, SATA requires more power, larger connectors, and complex PHY calibration, whereas MMC/SD interfaces are simpler and more robust against shock/vibration. The OMAPL138BZCE4 supports both, allowing tiered storage architectures—using MMC for boot code and SATA for bulk data—without external bridges.
What precautions should be taken during PCB assembly to avoid yield loss when soldering the OMAPL138BZCE4 in volume production?
Given the 361-NFBGA package and MSL 3 rating, strict adherence to IPC-J-STD-020 is required: components must be stored below 30% RH and assembled within 168 hours of opening the dry pack. Pre-bake may be necessary if floor life exceeds thresholds. Reflow profiles must include sufficient soak phases to activate flux uniformly across all pads, and inspection via AOI or X-ray is strongly recommended to detect voids or misalignment, especially around fine-pitch signals like DDRDQ lines.
How does the 10/100Mbps Ethernet MAC integrate with the rest of the OMAPL138BZCE4’s peripherals, and what OS considerations arise?
The Ethernet controller shares DMA channels and interrupt vectors with other subsystems, necessitating careful driver configuration in RTOS environments like TI-RTOS or Linux. It supports standard TCP/IP stacks but lacks hardware VLAN or QoS tagging, limiting advanced networking features. When combined with the LCD and USB controllers, designers must allocate sufficient heap memory and prioritize network task scheduling to avoid buffer overruns during peak loads.
Can the OMAPL138BZCE4 support Linux-based operating systems, and what kernel modifications might be needed for optimal performance?
Yes, the OMAPL138BZCE4 runs Linux distributions like Ångström or custom Yocto builds, thanks to TI’s support for the ARM926EJ-S architecture. However, early kernel versions may lack optimized cache management for the MMU or proper C674x co-processor drivers. Custom patches often improve page table handling and enable DSP firmware loading via remoteproc. Buildroot or Buildroot-based tools are commonly used to minimize footprint while retaining essential drivers for LCD, Ethernet, and USB.
What is the significance of the CP15 coprocessor in the OMAPL138BZCE4, and how is it utilized in secure or performance-critical contexts?
CP15 manages system-level controls including cache configuration, memory protection units (MPU), and exception vector mapping. In the OMAPL138BZCE4, it enables fine-grained access control for shared memory regions between ARM and DSP, supports TrustZone-like isolation (though not full ARM TrustZone), and facilitates low-power state transitions. Misconfiguration can lead to crashes or security holes, so register access should be restricted to trusted firmware only.
How does the choice of bulk packaging affect supply chain logistics and obsolescence risk for the OMAPL138BZCE4?
Bulk packaging implies the OMAPL138BZCE4 is intended for OEM manufacturing rather than prototyping, offering cost advantages at scale but requiring tighter inventory forecasting. As an older-generation part (discontinued since ~2015), long-term availability depends on TI’s end-of-life policy and secondary market dynamics. Designers should evaluate alternatives like AM335x or newer Sitara parts unless legacy compatibility mandates continued use of the OMAPL138BZCE4.
What are the implications of the HTSUS code 8542.31.0001 for international trade documentation involving the OMAPL138BZCE4?
The Harmonized Tariff Schedule code 8542.31.0001 classifies the OMAPL138BZCE4 as an "Electronic Integrated Circuit, Digital," subject to specific duty rates depending on country of import. Accurate declaration prevents customs delays, especially in regions like the U.S. where misclassification could incur penalties. Importers should verify local interpretations, as some jurisdictions treat microprocessors with DSP extensions under slightly different subheadings.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments OMAPL138BZCE4

Product Attribute OMAPL138BZCED4 OMAPL138BZCED4E OMAPL138BZCG4 OMAPL138BZCEA3
Part Number OMAPL138BZCED4 OMAPL138BZCED4E OMAPL138BZCG4 OMAPL138BZCEA3
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Mounting Type - Surface Mount Through Hole Surface Mount
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Graphics Acceleration - - - -
RAM Controllers - - - -
Speed - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Additional Interfaces - - - -
Security Features - - - -
Co-Processors/DSP - - - -
Number of Cores/Bus Width - - - -
SATA - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Display & Interface Controllers - - - -
Voltage - I/O - - - -
USB - - - -
Series - - - -
Ethernet - - - -
Core Processor - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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DHL & FedEx Shipment Charges Reference
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1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
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OMAPL138BZCE4 Image

OMAPL138BZCE4

Texas Instruments
98D-OMAPL138BZCE4

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