About us Contact Us Submit BOM
RFQs(0)
English
Close Menu
View All

Please refer to the English Version as our Official Version.Return

Europe
France(Français) Germany(Deutsch) Italy(Italia) Russian(русский) Poland(polski) Czech(Čeština) Luxembourg(Lëtzebuergesch) Netherlands(Nederland) Iceland(íslenska) Hungarian(Magyarország) Spain(español) Portugal(Português) Turkey(Türk dili) Bulgaria(Български език) Ukraine(Україна) Greece(Ελλάδα) Israel(עִבְרִית) Sweden(Svenska) Finland(Svenska) Finland(Suomi) Romania(românesc) Moldova(românesc) Slovakia(Slovenská) Denmark(Dansk) Slovenia(Slovenija) Slovenia(Hrvatska) Croatia(Hrvatska) Serbia(Hrvatska) Montenegro(Hrvatska) Bosnia and Herzegovina(Hrvatska) Lithuania(lietuvių) Spain(Português) Switzerland(Deutsch) United Kingdom(English)
Asia/Pacific
Japan(日本語) Korea(한국의) Thailand(ภาษาไทย) Malaysia(Melayu) Singapore(Melayu) Vietnam(Tiếng Việt) Philippines(Pilipino)
Africa, India and Middle East
United Arab Emirates(العربية) Iran(فارسی) Tajikistan(فارسی) India(हिंदी) Madagascar(malaɡasʲ)
South America / Oceania
New Zealand(Maori) Brazil(Português) Angola(Português) Mozambique(Português)
North America
United States(English) Canada(English) Haiti(Ayiti) Mexico(español)
HomeProductsIntegrated Circuits (ICs)Embedded - MicroprocessorsOMAPL138AZCE3
OMAPL138AZCE3 Image
OMAPL138AZCE3 Image - 1
Image may be representation.
See specifications for product details.
Share
 Favorite
EXPRESS OPTION
Payment method

OMAPL138AZCE3 - Texas Instruments

Manufacturer Part Number
OMAPL138AZCE3
Manufacturer
Texas Instruments
Allelco Part Number
98D-OMAPL138AZCE3
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,941 pcs available, New & Original
Parts Description
IC MPU OMAP-L1X 300MHZ 361NFBGA
Package
361-NFBGA (13x13)
Data sheet
OMAPL138AZCE3.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 11941

Required fields are indicated by an asterisk (*)
Please send RFQ, we will respond immediately.

Quantity

Specifications

OMAPL138AZCE3 Tech Specifications
Texas Instruments - OMAPL138AZCE3 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL138AZCE3

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - I/O 1.8V, 3.3V
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Supplier Device Package 361-NFBGA (13x13)
Speed 300MHz
Series OMAP-L1x
Security Features Boot Security, Cryptography
SATA SATA 3Gbps (1)
RAM Controllers SDRAM
Package / Case 361-LFBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 90°C (TJ)
Number of Cores/Bus Width 1 Core, 32-Bit
Mounting Type Surface Mount
Graphics Acceleration No
Ethernet 10/100Mbps (1)
Display & Interface Controllers LCD
Core Processor ARM926EJ-S
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
Base Product Number OMAPL138
Additional Interfaces HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

What are the key differences between the OMAPL138AZCE3 and its substitute part number OMAPL138EZCE3, particularly in terms of availability and manufacturing status?
The primary distinction lies in packaging or manufacturing traceability. While both OMAPL138AZCE3 and OMAPL138EZCE3 share identical electrical characteristics—including a 300MHz ARM926EJ-S core, C674x DSP, dual USB interfaces, and 361-NFBGA pinout—the suffix variation often indicates a change in assembly site, lead-free compliance variant, or supply chain designation. In practice, engineers should verify current inventory levels with distributors, as AZCE may reflect a newer revision with improved reliability metrics, whereas EZCE could denote an earlier production lot. Both parts support the same boot security and cryptographic features, but design documentation should confirm compatibility with specific board layouts due to potential solder paste stencil or reflow profile differences.
How does the power delivery network (PDN) design for the OMAPL138AZCE3 need to be optimized given its mixed-voltage I/O domains at 1.8V and 3.3V?
The OMAPL138AZCE3 operates with internal logic at 1.8V while exposing 3.3V I/O pins for legacy peripheral compatibility. This requires careful decoupling topology: place high-frequency (0.1µF) ceramic capacitors within 1mm of each power pin, supplemented by bulk capacitance (10µF tantalum or X5R/X7R MLCCs) near the BGA’s power entry points. A solid ground plane under the package minimizes inductance, and separate analog and digital ground returns must converge at a single point to avoid noise coupling into the C674x DSP subsystem. Voltage regulators feeding the core and I/O rails should exhibit low output ripple (<30mVpp), as excessive noise can degrade signal integrity on McBSP, McASP, or HPI interfaces operating at up to 100Mbps.
Can the OMAPL138AZCE3 directly drive an LCD panel without an external controller, and what interface constraints apply?
Yes, the OMAPL138AZCE3 includes integrated LCD controllers capable of interfacing with monochrome or color panels via parallel RGB, TCON, or serial interfaces. However, resolution support is limited to VGA (640x480) at 60Hz when using the native LCD module, due to internal memory bandwidth constraints from shared access with SDRAM and the C674x DSP. Engineers must allocate sufficient external SDRAM (minimum 16MB recommended) and configure the LCD clock divider appropriately—typically using the 300MHz system clock divided by 2 or 4 depending on pixel rate. Additionally, backlight control and touchscreen integration require GPIO or PWM signals not managed by the LCD controller itself.
What are the thermal considerations when deploying the OMAPL138AZCE3 in industrial environments exceeding 70°C ambient temperature?
With a maximum junction temperature of 90°C and typical dissipations around 2–3W under full DSP and ARM load, the OMAPL138AZCE3 demands effective heat dissipation even in compact designs. Natural convection alone is insufficient; a copper pour on the top layer connected to inner-layer ground planes, combined with vias under the BGA, significantly improves thermal conductivity. In high-reliability applications, adding a heatsink or forced airflow ensures TJ remains below 85°C during sustained operation. Thermal simulation using TI’s PowerTroubleshooter or similar tools helps estimate delta-T across the package-to-air path, especially critical when co-locating high-speed transceivers like SATA or Ethernet PHYs.
How does the OMAPL138AZCE3 handle secure boot processes, and what cryptographic accelerators are available?
The OMAPL138AZCE3 supports secure boot through hardware-rooted trust anchors, including RSA-2048/3072 signature verification and SHA-256 hashing, leveraging dedicated cryptographic engines accessible via CP15 registers. Boot code is validated against a pre-programmed public key stored in One-Time Programmable (OTP) fuses, preventing unauthorized firmware execution. Developers must ensure that the ROM boot loader and subsequent stages comply with this chain of trust. For real-time encryption needs, the C674x DSP can offload AES, DES, or TRNG operations, reducing CPU overhead by up to 80% compared to software implementations on the ARM926EJ-S core.
When selecting between the OMAPL138AZCE3 and alternative embedded processors like AM335x-based SoCs, what trade-offs emerge regarding real-time performance?
The OMAPL138AZCE3 trades raw processing speed for deterministic real-time response thanks to its heterogeneous architecture combining a single-core ARM926EJ-S (max 300MHz) with a fixed-function C674x VLIW DSP. Unlike AM335x variants running Cortex-A8/A8 cores at higher frequencies (up to 720MHz), the OMAPL138 lacks out-of-order execution and branch prediction, making it less suited for general-purpose OS tasks requiring high IPC. However, for audio/video processing, motor control, or sensor fusion, the C674x delivers predictable latency with zero interrupt jitter—critical for industrial automation. Engineers must evaluate whether Linux/RTOS requirements or pure throughput justify choosing a more powerful but less deterministic platform.
What impact does sharing SDRAM between the ARM and DSP subsystems have on application timing in systems using the OMAPL138AZCE3?
Memory arbitration between the ARM926EJ-S and C674x DSP in the OMAPL138AZCE3 creates contention that affects worst-case execution time (WCET). Without explicit memory partitioning via MPU or cache-coherent extensions, simultaneous accesses result in bus cycles being serialized, increasing latency unpredictably. Applications requiring tight synchronization—such as real-time image capture followed immediately by DSP filtering—must use shared buffers with semaphores or double-buffering techniques. TI provides reference examples showing that misaligned memory mapping can inflate response times by 30–50%, so proper linker script configuration and cache policies (e.g., disabling L1 for shared regions) are essential.
Is the OMAPL138AZCE3 suitable for battery-powered portable devices, and what power-saving modes should be employed?
While technically feasible, the OMAPL138AZCE3 is suboptimal for ultra-low-power portable applications due to its static leakage currents in active mode (~300mW idle) and lack of dynamic voltage/frequency scaling. Instead, designers targeting extended battery life should consider newer SoCs with deep sleep states. That said, if used, aggressive power gating of unused peripherals (USB, Ethernet, LCD) through CMEM modules, combined with DSP standby modes during idle periods, can reduce average consumption to ~100mW. Always disable unused PLLs and configure wake-up sources carefully, as unintended interrupts from GPIO or McBSP can cause frequent state transitions that negate savings.
How do the multiple UART interfaces on the OMAPL138AZCE3 affect RS-232 versus RS-485 implementation choices?
The OMAPL138AZCE3 provides two full-duplex UARTs with programmable baud rates up to 1.5Mbps, supporting standard TTL-level signaling. To implement RS-232, external transceivers like MAX3232 are required; for RS-485, differential drivers/receivers such as SN65HVD72 add necessary signal conversion and direction control. Importantly, UARTs lack built-in termination or bias resistors, so layout must account for impedance matching in long-run configurations. Additionally, only one UART typically shares pins with other functions (e.g., GPIO), so hardware routing decisions must precede software driver development to avoid conflicts.
What precautions are necessary when soldering the OMAPL138AZCE3 in high-volume manufacturing?
Given its 361-pin NFBGA package (13x13), the OMAPL138AZCE3 demands precise stencil thickness (typically 125–150µm) and accurate alignment (±25µm) during reflow. Solder paste composition should match IPC Class 3 standards, and reflow profiles must include a slow ramp-up below 150°C to prevent tombstoning, followed by a peak temperature of 240–245°C for 60–90 seconds to ensure complete wetting. Post-assembly, automated optical inspection (AOI) detects voids >15% in critical power/ground balls, which could compromise thermal and electrical performance. Adherence to MSL 3 handling guidelines prevents moisture-induced popcorning during wave soldering or reflow.
Can the OMAPL138AZCE3 interface with modern NVMe SSDs, or is SATA 3Gbps the maximum supported storage speed?
No, the OMAPL138AZCE3 only supports SATA 3Gbps (SATA II) via its integrated SATA controller, limiting sequential read/write speeds to approximately 250–300 MB/s. NVMe over PCIe is unavailable due to absence of PCIe root complex functionality. For faster storage, external USB 2.0 (max 480Mbps) or SD/MMC cards via the MultiMediaCard interface offer alternatives, though neither matches SATA throughput. Designers needing NVMe should migrate to TI’s Jacinto or Sitara platforms with PCIe Gen2 support.
How does electromagnetic interference (EMI) from the Ethernet PHY affect nearby ADC circuits when using the OMAPL138AZCE3?
The integrated 10/100 Ethernet PHY on the OMAPL138AZCE3 generates high-frequency switching noise that couples into adjacent analog traces, particularly impacting precision ADCs or reference voltages. To mitigate, separate analog and digital ground planes with a single-point connection near the BGA, route Ethernet differential pairs orthogonally over power planes, and shield sensitive lines with grounded guard traces. Ferrite beads on the 3.3V rail feeding the PHY, combined with common-mode chokes in the magnetics, suppress conducted emissions. TI recommends maintaining at least 2mm clearance between Ethernet TX/RX nets and analog inputs to reduce capacitive crosstalk.
What debugging capabilities exist for diagnosing hangs or deadlocks in software running on the OMAPL138AZCE3?
The OMAPL138AZCE3 supports JTAG and Serial Wire Debug (SWD) via its Test Access Port (TAP), allowing real-time instruction tracing and memory inspection. Integrated breakpoints and watchpoints halt execution precisely, while the ARM926EJ-S includes a Data Watchpoint and Trace (DWT) unit for monitoring specific address ranges. For DSP-side debugging, CCS (Code Composer Studio) integrates with the C674x ETM, enabling cycle-accurate profiling. However, shared memory regions complicate visibility; using non-cacheable buffers for debug logs avoids corruption during cache flushes. External logic analyzers can also monitor HPI or McBSP buses for protocol-level analysis.
Should the OMAPL138AZCE3 be paired with DDR2 or DDR3 SDRAM, and why?
The OMAPL138AZCE3 specifies support for DDR2 SDRAM only, not DDR3. Its memory controller was designed prior to DDR3 adoption, operating at lower voltages (1.8V vs. DDR3’s 1.5V) and narrower data widths (typically x16/x32). Attempting to use DDR3 modules risks undefined behavior due to timing mismatches and voltage incompatibility. Available options include MT46V32M16xx series chips, offering up to 128MB per chip. For systems requiring larger memory densities, multiple DDR2 banks or migration to newer platforms like AM57xx is advisable.
How reliable is the boot ROM on the OMAPL138AZCE3 in field-deployed systems, and what fallback mechanisms exist?
The OMAPL138AZCE3 includes factory-programmed ROM boot code that initializes clocks, memory, and loads secondary boot images from SPI NOR flash, eMMC, or SD card. However, ROM bugs—especially in early silicon revisions—have caused failures when certain pin strapping options were misconfigured. To enhance reliability, implement redundant boot partitions with CRC checks and automatic rollback upon failure detection. Additionally, using ECC-protected NAND or QSPI flash reduces silent data corruption risks. Field updates should follow TI’s secure boot guidelines to preserve cryptographic validation throughout the upgrade process.
What are the limitations of the OMAPL138AZCE3 when implementing USB host functionality with high-current peripherals?
Although the OMAPL138AZCE3 integrates both USB 1.1 and USB 2.0 host ports with on-chip transceivers, driving high-power devices (e.g., external HDDs drawing >500mA) requires careful consideration of VBUS supply stability and current limits. Internal overcurrent protection typically triggers at 550mA, causing port shutdown. Solutions include adding external FETs with current sensing, using powered hubs, or ensuring local 5V regulation with adequate decoupling. Signal integrity becomes critical beyond 50cm cables; differential pair length matching (±5mil tolerance) and impedance control (90Ω ±10%) prevent eye diagram closure at 480Mbps.
How does the presence of multiple communication interfaces (SPI, I2C, UART, etc.) influence PCB routing complexity in OMAPL138AZCE3-based designs?
The OMAPL138AZCE3 offers extensive connectivity (HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART), but concurrent usage increases crosstalk and signal integrity challenges. High-speed interfaces like SPI at 20MHz or McASP at 128ksps require controlled-impedance traces, length-matched pairs, and avoidance of sharp bends near reference planes. Shared pins (e.g., UART0 multiplexed with GPIO) necessitate pull-up/down resistors and Schottky diodes to prevent contention during power-up sequencing. Proper decoupling and stackup design (e.g., 4-layer with dedicated power/ground layers) mitigates these effects, but signal integrity analysis tools are strongly recommended before finalization.
Why might the OMAPL138AZCE3 be preferred over FPGA-based solutions in certain industrial control applications?
The OMAPL138AZCE3 provides deterministic latency and low jitter—critical for closed-loop control systems—by integrating specialized peripherals like McBSP and McASP with hardware FIFO management, avoiding FPGA resource scheduling delays. Its fixed-function DSP accelerates math-intensive tasks (e.g., PID loops, FFTs) without consuming ARM926EJ-S cycles, improving real-time responsiveness. Additionally, reduced component count lowers bill of materials (BOM) cost and board area compared to FPGA + MCU combinations. While FPGAs offer greater flexibility, the OMAPL138 strikes a balance for applications where timing predictability outweighs reconfigurability needs.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments OMAPL138AZCE3

Product Attribute OMAPL138AZCEA3 OMAPL138BZCE3 OMAPL138AZWT3 OMAPL138BZCE4
Part Number OMAPL138AZCEA3 OMAPL138BZCE3 OMAPL138AZWT3 OMAPL138BZCE4
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
SATA - - - -
Series - - - -
Ethernet - - - -
Voltage - I/O - - - -
Security Features - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Number of Cores/Bus Width - - - -
Additional Interfaces - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Core Processor - - - -
USB - - - -
Graphics Acceleration - - - -
Display & Interface Controllers - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Speed - - - -
Co-Processors/DSP - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
RAM Controllers - - - -

OMAPL138AZCE3 Datasheet PDF

Download OMAPL138AZCE3 pdf datasheets and Texas Instruments documentation for OMAPL138AZCE3 - Texas Instruments.

Datasheets
OMAP-L138 Datasheet.pdf
PCN Obsolescence/ EOL
Freon/Netra/SubArtic EOL 06/Oct/2015.pdf Freon/Netra/SubArtic EOL Update 4/Nov/2015.pdf

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
Quality Inspection Image - 01
Quality Inspection Image - 02
Quality Inspection Image - 03
Quality Inspection Image - 04

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
OMAPL138AZCE3 Image

OMAPL138AZCE3

Texas Instruments
98D-OMAPL138AZCE3

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

Allelco
About Us
History
Certifications
Recruitment
Policies
Terms & Conditions
Privacy Policy
Cookie Policy
Services
Order Tracking
Return & Replacement
Frequently Asked Questions
Contact Us
Order
Shipping & Delivering
Payment Methods
My Account
The BlogsHot PartsChange LanguageNewsSite map
Contact Us
Headquarters Address:
Room C 13/F Harvard Commercial Building
105-111 Thomson Road Wan Chai
HongKong
Service Tel: +852-91464856
Service Email: info@allelco.com
Follow us
Copyright © 2012-2025 AllelcoElec.com. All rights reserved.
0 RFQ
Shopping cart (0 Items)
It is empty.
Submit RFQ
Compare List (0 Items)
It is empty.
Feedback

Your feedback matters! At Allelco, we value the user experience and strive to improve it constantly.
Please share your comments with us via our feedback form, and we'll respond promptly.
Thank you for choosing Allelco.

Subject
E-mail
Comments
Captcha
Drag or click to upload file
Upload File
types: .xls, .xlsx, .doc, .docx, .jpg, .png and .pdf.
Max file size: 10MB