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HomeProductsIntegrated Circuits (ICs)Embedded - MicroprocessorsOMAPL137DZKBT3
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OMAPL137DZKBT3 - Texas Instruments

Manufacturer Part Number
OMAPL137DZKBT3
Manufacturer
Texas Instruments
Allelco Part Number
32D-OMAPL137DZKBT3
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
14,392 pcs available, New & Original
Parts Description
IC MPU OMAP-L1X 375MHZ 256BGA
Package
256-BGA (17x17)
Data sheet
OMAPL137DZKBT3.pdf

PCN Packaging

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
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In stock: 14392

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Specifications

OMAPL137DZKBT3 Tech Specifications
Texas Instruments - OMAPL137DZKBT3 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL137DZKBT3

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - I/O 1.8V, 3.3V
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Supplier Device Package 256-BGA (17x17)
Speed 375MHz
Series OMAP-L1x
Security Features -
SATA -
RAM Controllers SDRAM
Package / Case 256-BGA
Package Tray
Product Attribute Attribute Value
Operating Temperature -40°C ~ 125°C (TJ)
Number of Cores/Bus Width 1 Core, 32-Bit
Mounting Type Surface Mount
Graphics Acceleration No
Ethernet 10/100Mbps (1)
Display & Interface Controllers LCD
Core Processor ARM926EJ-S
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
Base Product Number OMAPL137
Additional Interfaces HPI, I²C, McASP, MMC/SD, SPI, UART

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

Manufacturer Part Number

OMAPL137DZKBT3

Manufacturer

Texas Instruments

Introduction

The OMAPL137DZKBT3 is a high-performance applications processor based on the enhanced OMAP-L1x series.

Product Features and Performance

Integrated ARM926EJ-S core

32-Bit bus width for efficient data handling

Operates at 375MHz clock speed

Signal processing C674x DSP

System Control CP15 for managing system resources

Support for SDRAM memory controllers

LCD display controller for user interfaces

10/100Mbps Ethernet connectivity

USB 1.1 and USB 2.0 support with PHY

Dual voltage I/O at 1.8V and 3.3V

Extended operating temperature range from -40°C to 125°C

Product Advantages

Combination of ARM and DSP core ideal for high-performance processing

Real-time signal processing capabilities

Broad interface support for connectivity with peripherals and networks

Suitable for harsh environments with extended temperature range

Key Technical Parameters

1 Core ARM926EJ-S

32-Bit bus width

375MHz speed

10/100Mbps Ethernet

SDRAM support

Surface Mount 256-BGA package

8V and 3.3V I/O voltage support

Quality and Safety Features

Extended temperature range for high reliability

BGA package for a secure solder connection

Compatibility

Supports various interfaces like HPI, I2C, McASP, MMC/SD, SPI, UART for versatile use in different systems

Application Areas

Industrial automation

Medical electronics

Communication infrastructure

Automotive peripherals

Consumer electronics

Product Lifecycle

Active status

Not indicated as nearing discontinuation

Potential availability of replacements or upgrades

Several Key Reasons to Choose This Product

Efficient signal and data processing with integrated high-performance cores

Robust connectivity options for different applications

Designed for reliability in harsh temperature environments

Versatile use across multiple industries due to broad interface support

Continued support and availability from Texas Instruments

Frequently Asked Questions(FAQ)

What are the key differences between OMAPL137DZKBT3 and OMAPL138DZKBT3 in terms of clock speed and memory controller support?
The OMAPL137DZKBT3 operates at a maximum core frequency of 375MHz and supports SDRAM memory controllers, while the OMAPL138DZKBT3 achieves up to 456MHz with enhanced SDRAM and DDR2/LPDDR memory interface capabilities. This difference allows the OMAPL138 to handle higher data throughput in bandwidth-intensive embedded applications, though both share the same ARM926EJ-S core and 256-BGA package configuration.
How does the power consumption profile of OMAPL137DZKBT3 compare when running at full 375MHz versus lower frequencies in typical industrial control applications?
At 375MHz under nominal load, the OMAPL137DZKBT3 draws approximately 1.2W from its core supply rails, with I/O consuming an additional 0.3W from the 1.8V and 3.3V domains. When throttled to 200MHz, core current drops by roughly 40%, resulting in about 0.7W total dynamic power. This makes dynamic frequency scaling valuable in battery-powered or thermally constrained systems where duty cycling is feasible.
Can OMAPL137DZKBT3 interface directly with modern DDR3 memory modules without external logic?
No, the OMAPL137DZKBT3 includes an SDRAM-only memory controller and lacks native support for DDR3 interfaces. Attempting to use DDR3 modules would require an external memory bridge or controller, increasing board complexity and cost. For systems requiring DDR3, Texas Instruments recommends evaluating newer OMAP variants such as the AM3x series which include DDR3 support.
What are the timing implications of connecting multiple peripherals simultaneously on OMAPL137DZKBT3’s McASP, SPI, and UART interfaces during real-time sensor acquisition?
Simultaneous use of McASP (multi-channel audio serial port), SPI, and UART on the OMAPL137DZKBT3 introduces bus arbitration latency due to shared ARM926EJ-S system bus access. In worst-case scenarios with high-frequency SPI transactions and UART interrupts enabled, response jitter can increase by up to 15 microseconds compared to single-interface operation. Proper DMA channel allocation and interrupt prioritization are essential for deterministic behavior.
Is it feasible to implement secure boot using OMAPL137DZKBT3 given its lack of dedicated security hardware features?
While the OMAPL137DZKBT3 does not include cryptographic accelerators or trusted execution environments, secure boot can be implemented through software-based chain-of-trust using the ARM926EJ-S’s built-in JTAG debug disable and ROM bootloader protections. However, this approach offers only basic protection against casual tampering and should not be relied upon for high-assurance systems. Additional external security ICs are recommended for sensitive deployments.
How does the -40°C to +125°C operating range of OMAPL137DZKBT3 impact solder joint reliability in automotive-grade designs?
The wide temperature range necessitates careful PCB layout and component selection to mitigate thermal cycling stress. On the 17x17mm 256-BGA package, coefficient of thermal expansion (CTE) mismatches between silicon and FR4 substrate can induce solder fatigue after ~1,000 cycles across the full junction temperature range. Using low-thermal-mass PCBs and SAC305 lead-free solder with adequate pad sizing helps extend lifetime beyond 10 years under normal automotive conditions.
What is the maximum practical resolution achievable with the integrated LCD controller on OMAPL137DZKBT3 driving a standard VGA panel?
The OMAPL137DZKBT3’s LCD controller supports resolutions up to 800x600 pixels at 60Hz refresh rates when paired with an external pixel clock generator. Driving a native 640x480 VGA panel requires precise timing generation via the McASP or programmable clocks, and may limit color depth to 16-bit due to internal FIFO constraints. Higher resolutions exceed the internal RAM bandwidth and are not supported without external frame buffer augmentation.
Why might designers choose OMAPL137DZKBT3 over a pure FPGA solution in vision processing applications despite its modest DSP performance?
Although the C674x DSP on the OMAPL137DZKBT3 delivers only 600MMACS peak performance, its integration with ARM926EJ-S enables tight software-hardware co-design for task partitioning—such as offloading image preprocessing to the DSP while handling UI logic on the main CPU. This reduces overall system cost, power, and board space compared to deploying a larger FPGA, especially in moderate-complexity vision tasks like edge detection or simple object tracking.
What precautions must be taken when routing signals adjacent to the power pins of OMAPL137DZKBT3 to avoid noise coupling?
Due to the high-speed digital switching within the 375MHz ARM926EJ-S core and associated peripherals, signal traces routed near VDD_CORE, VDD_IO, or VSS planes on the OMAPL137DZKBT3 must maintain a minimum clearance of 3 mils from power pads and use guard rings or ground stitching vias every λ/10 at 375MHz (~0.4 mm). Additionally, decoupling capacitors should be placed within 1 mm of each power pin to suppress high-frequency transients.
How does moisture sensitivity level (MSL) 3 classification affect storage and handling of OMAPL137DZKBT3 trays prior to reflow soldering?
MSL 3 indicates that OMAPL137DZKBT3 components begin absorbing moisture after 168 hours in ambient conditions above 60% RH. To prevent popcorning during reflow, trays must be stored in dry cabinets (<10% RH) or nitrogen-flushed environments before reaching 168-hour threshold. Once opened, assembly must occur within 168 hours if no baking is performed, per JEDEC J-STD-033 guidelines.
Are there known limitations when using USB 2.0 host mode on OMAPL137DZKBT3 with non-standard PHYs?
Yes, the OMAPL137DZKBT3 integrates a USB 2.0 OTG PHY compliant with UTMI+ specification, but compatibility with third-party PHYs depends on strict adherence to timing parameters such as SOF packet interval and endpoint buffering alignment. Mismatched PHY implementations may cause enumeration failures or intermittent data corruption, particularly at high-speed signaling rates above 480 Mbps.
What impact does disabling CP15 co-processor functions have on system performance and stability when optimizing OMAPL137DZKBT3 for low-power modes?
Disabling unused CP15 features like cache lockdown or MMU regions can reduce context save/restore overhead during sleep transitions, lowering wake-up latency by up to 12%. However, inadvertently disabling critical CP15 operations (e.g., branch prediction control) may degrade instruction fetch efficiency by 8–15% in sustained compute workloads, potentially outweighing power savings in performance-sensitive applications.
Can the OMAPL137DZKBT3 support simultaneous operation of both USB 1.1 and USB 2.0 interfaces without bandwidth contention?
The OMAPL137DZKBT3 provides two independent USB ports—one USB 1.1 (12 Mbps max) and one USB 2.0 (480 Mbps max)—each with dedicated PHYs and endpoints. Since they operate on separate physical buses and endpoint address spaces, full-duplex operation is possible without bandwidth sharing. However, both share the same ARM926EJ-S system bus, so concurrent bulk transfers could introduce microsecond-level delays under heavy load.
What considerations apply when implementing I2C communication between OMAPL137DZKBT3 and multiple slaves on the same bus?
The OMAPL137DZKBT3’s I2C module supports multi-master arbitration, but pull-up resistor values must be carefully chosen based on bus capacitance and desired slew rate. With multiple slaves drawing varying amounts of current, rise times exceeding 1 µs may cause missed ACKs or clock stretching conflicts. Typical values range from 2.2 kΩ to 4.7 kΩ depending on trace length and device count, with ≤ 400 pF total bus capacitance recommended for 400 kHz operation.
How does the absence of hardware floating-point unit in the ARM926EJ-S core affect numerical computation routines on OMAPL137DZKBT3?
The ARM926EJ-S core lacks an FPU, so floating-point operations on OMAPL137DZKBT3 require either software emulation or reliance on the C674x DSP. Software emulation incurs significant overhead—approximately 50 cycles per float operation at 375MHz—making it impractical for real-time control loops. Leveraging the DSP for math-intensive tasks improves performance by orders of magnitude but increases development complexity.
What role does the HPI interface play in OMAPL137DZKBT3-based systems when interfacing with external image sensors?
The Host Port Interface (HPI) on OMAPL137DZKBT3 enables direct memory-mapped access to external devices such as image sensors or coprocessors, bypassing the main CPU. This allows high-throughput streaming of raw pixel data into on-chip SRAM or external SDRAM without CPU intervention, reducing latency and freeing up ARM926EJ-S cycles for image processing tasks—critical in embedded vision pipelines.
Does the OMAPL137DZKBT3 support hot-swapping of SD/MMC cards during runtime?
Yes, the SD/MMC interface on OMAPL137DZKBT3 supports card detection pins and command-line initialization protocols that allow hot-plug recognition. However, firmware must manage insertion/deletion events carefully, including unmounting filesystems and reinitializing the bus state. Power sequencing must also comply with SD Physical Layer Specification v2.0 to avoid damaging the card or host controller.
What are the implications of using the McASP in TDM mode versus SP mode on OMAPL137DZKBT3 for audio codec integration?
In Time-Division Multiplex (TDM) mode, McASP on OMAPL137DZKBT3 supports up to 8 stereo channels synchronized via a shared bit clock, ideal for multi-microphone beamforming arrays. In Serial Port (SP) mode, only one or two channels are supported with simpler framing. TDM increases flexibility but demands precise clock alignment; misconfiguration can result in clipped audio or complete failure to initialize the codec.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments OMAPL137DZKBT3

Product Attribute OMAPL137CZKBT3 OMAPL137DZKBA3 OMAPL137DZKB3 OMAPL137CZKBA3
Part Number OMAPL137CZKBT3 OMAPL137DZKBA3 OMAPL137DZKB3 OMAPL137CZKBA3
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
SATA - - - -
Graphics Acceleration - - - -
Ethernet - - - -
Speed - - - -
Core Processor - - - -
Security Features - - - -
Number of Cores/Bus Width - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Base Product Number - DAC34H84 MAX500 ADS62P42
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
USB - - - -
Co-Processors/DSP - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Voltage - I/O - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Display & Interface Controllers - - - -
RAM Controllers - - - -
Additional Interfaces - - - -

OMAPL137DZKBT3 Datasheet PDF

Download OMAPL137DZKBT3 pdf datasheets and Texas Instruments documentation for OMAPL137DZKBT3 - Texas Instruments.

PCN Packaging
2.73KHz.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Texas Instruments

OMAPL137DZKBT3

Texas Instruments
32D-OMAPL137DZKBT3

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