Data sheet: OMAPL137DZKB3.pdf

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Specifications

OMAPL137DZKB3 Tech Specifications
Texas Instruments - OMAPL137DZKB3 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL137DZKB3

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - I/O	1.8V, 3.3V
USB	USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Supplier Device Package	256-BGA (17x17)
Speed	375MHz
Series	OMAP-L1x
Security Features	-
SATA	-
RAM Controllers	SDRAM
Package / Case	256-BGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 90°C (TJ)
Number of Cores/Bus Width	1 Core, 32-Bit
Mounting Type	Surface Mount
Graphics Acceleration	No
Ethernet	10/100Mbps (1)
Display & Interface Controllers	LCD
Core Processor	ARM926EJ-S
Co-Processors/DSP	Signal Processing; C674x, System Control; CP15
Base Product Number	OMAPL137
Additional Interfaces	HPI, I²C, McASP, MMC/SD, SPI, UART

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Parts Introduction

Manufacturer Part Number

OMAPL137DZKB3

Manufacturer

Texas Instruments

Introduction

The OMAPL137DZKB3 is a highly integrated embedded microprocessor designed for industrial applications.

Product Features and Performance

ARM926EJ-S Core Processor

Single-Core, 32-Bit Architecture

375MHz Operating Speed

Co-Processors for Signal Processing (C674x) and System Control (CP15)

SDRAM RAM Controllers

LCD Display and Interface Controllers

10/100Mbps Ethernet Connectivity

Onboard USB 1.1 and USB 2.0 Support with PHY

Product Advantages

High-performance ARM core for efficient processing

Dedicated DSP for advanced signal processing tasks

Integrated peripherals reducing the need for additional components

Broad connectivity options including Ethernet and USB

Key Technical Parameters

Core: ARM926EJ-S

Number of Cores: 1

Bus Width: 32-Bit

Speed: 375MHz

Ethernet: 10/100Mbps

USB: USB 1.1 and USB 2.0

Voltage I/O: 1.8V, 3.3V

Operating Temperature Range: 0°C ~ 90°C (TJ)

Mounting Type: Surface Mount

Quality and Safety Features

Robust BGA package for secure mounting

Tested across a wide range of temperatures for reliability

Compatibility

Suitable for various SDRAM modules

Interface support for HPI, I2C, McASP, MMC/SD, SPI, UART

Connects with common industrial communication interfaces

Application Areas

Industrial automation

Control systems

Medical devices

Embedded computing applications

Product Lifecycle

Current Product Status: Active

Not nearing discontinuation

Availability of replacements or upgrades is generally supported by Texas Instruments

Several Key Reasons to Choose This Product

Integrated DSP for high-efficiency signal processing capabilities

Flexible I/O voltage supports a variety of peripherals

Wide operating temperature range suitable for industrial environments

Multiple interfaces for easy integration into existing systems

Manufactured by a renowned and reliable semiconductor company, Texas Instruments

Active product status ensures ongoing support and availability

OMAP-L1x series offers performance and power efficiency advantages

Frequently Asked Questions(FAQ)

How does the OMAPL137DZKB3 compare to other processors in the OMAP-L1x series in terms of core architecture and clock speed for industrial control applications?: The OMAPL137DZKB3 features an ARM926EJ-S core operating at 375MHz, which is a mid-tier configuration within the OMAP-L1x family. While it shares the same 32-bit architecture and ARMv5TE instruction set across the series, the 375MHz clock speed positions it between lower-clock-speed variants like the 200MHz OMAPL132 and higher-performance options. This frequency enables sufficient throughput for real-time signal processing and moderate multitasking in embedded systems such as motor controllers or data acquisition units, where deterministic response times are critical but extreme computational throughput is not required.

What are the key differences between the OMAPL137DZKB3 and modern Cortex-A based SoCs when considering legacy system migration?: Unlike contemporary Cortex-A series processors optimized for high-throughput application processing with Linux support and rich multimedia capabilities, the OMAPL137DZKB3 uses the older ARM926EJ-S core designed for real-time control tasks. It lacks hardware virtualization, NEON SIMD extensions, and advanced power management found in newer architectures. However, its deterministic execution, simpler memory model, and integrated peripherals—such as McASP, HPI, and multiple UARTs—make it suitable for legacy industrial automation upgrades where predictability outweighs raw performance. The absence of floating-point unit (FPU) also means software-based math routines may be needed, increasing code complexity compared to ARMv7/ARMv8 designs.

Can the OMAPL137DZKB3 drive a standard TFT LCD panel directly, and what interface considerations apply?: Yes, the OMAPL137DZKB3 includes a dedicated LCD controller capable of interfacing with standard parallel RGB or composite video outputs from legacy displays. However, due to its 1.8V I/O voltage domain and limited drive strength, external level shifters or buffers may be required when connecting to 3.3V or 5V LVCMOS-compatible panels. Additionally, frame buffer memory must be allocated from the available SDRAM controller, which competes with DSP and general CPU access; thus, careful memory partitioning is necessary to avoid bandwidth bottlenecks during refresh cycles.

What impact does the 256-BGA packaging have on thermal performance and PCB layout for the OMAPL137DZKB3?: The 256-pin BGA package (17×17 mm²) presents significant challenges for thermal dissipation due to its small surface area and dense pin array. With junction-to-ambient thermal resistance typically exceeding 25°C/W under natural convection, passive cooling may be insufficient in compact enclosures. Designers should implement thermal vias beneath the component, connect them to an internal ground plane, and consider airflow or heat sinks. PCB stackup also plays a role: using thicker dielectric layers reduces thermal conductivity but improves electrical isolation, requiring trade-offs in impedance control and manufacturing cost.

Is it feasible to use the OMAPL137DZKB3 in a battery-powered portable device given its power characteristics?: While the OMAPL137DZKB3 consumes relatively low static power (~100mW typical), dynamic power scales quadratically with clock frequency and depends heavily on activity factors. At full 375MHz operation, peak current can exceed 300mA, making continuous high-load scenarios impractical for long-duration battery operation without aggressive clock gating or sleep modes. The presence of dual USB PHYs and active Ethernet MAC further increases leakage and switching losses. For portable applications, designers must employ dynamic voltage/frequency scaling via CP15 co-processor registers and disable unused peripherals to extend runtime beyond several hours.

How reliable is the C674x DSP block in the OMAPL137DZKB3 for real-time digital filtering in noisy environments?: The integrated C674x fixed-point DSP supports single-cycle 32×32 multiply-accumulate operations and offers deterministic execution for algorithms like FIR, FFT, or PID control loops. Its separation from the ARM926EJ-S core avoids pipeline stalls caused by memory contention, enhancing timing predictability. However, shared access to SDRAM and certain peripheral buses introduces potential jitter if not properly arbitrated via EDMA or software scheduling. In electrically noisy environments, proper decoupling, grounding, and signal shielding are essential to prevent metastability issues during high-speed transfers between DSP and ARM subsystems.

What development tools and RTOS support exist for the OMAPL137DZKB3?: Texas Instruments provides Code Composer Studio (CCS) with built-in support for the ARM926EJ-S core and C674x DSP, including debug probes and profilers tailored for heterogeneous multicore debugging. Popular RTOSes such as TI-RTOS, FreeRTOS, and Integrity RTOS offer ported kernels that leverage the CP15 co-processor for memory protection and interrupt prioritization. However, toolchain maturity lags behind modern Cortex platforms, and third-party middleware for networking or file systems may require custom adaptation due to legacy driver models and limited POSIX compliance.

Should the OMAPL137DZKB3 be used in safety-critical systems requiring certification?: The OMAPL137DZKB3 lacks built-in safety mechanisms such as lockstep cores, ECC memory protection, or functional safety diagnostics mandated by standards like ISO 26262 or IEC 61508. Its single-core architecture cannot guarantee fault containment, and the absence of redundant execution paths limits diagnostic coverage. For certified systems, external watchdog timers, periodic self-tests, and architectural mitigation strategies would be required, significantly increasing validation effort. Therefore, it is generally unsuitable for ASIL-rated automotive or medical applications without extensive additional design work.

How does the Moisture Sensitivity Level (MSL) of 3 affect assembly and storage of OMAPL137DZKB3 components?: Classified as MSL 3, the OMAPL137DZKB3 must be stored in moisture barrier bags with desiccant and humidity indicator cards, and reflow soldering must occur within 168 hours of opening the package. Exceeding this window risks popcorning during reflow due to trapped moisture expanding rapidly above 150°C. Manufacturers often recommend baking the device at 125°C for 24–48 hours before assembly if shelf life exceeds MSL guidelines. This constraint necessitates rigorous inventory turnover and documentation practices in high-volume production environments.

What are the implications of the RoHS3 compliance status for global market deployment of products using the OMAPL137DZKB3?: RoHS3 compliance ensures adherence to EU Directive 2015/863, extending restrictions beyond lead, mercury, cadmium, hexavalent chromium, PBBs, PBDEs to include four phthalates (DEHP, BBzP, DBP, DIBP). This affects material selection in connectors, adhesives, and cables associated with the OMAPL137DZKB3 system. While the chip itself meets these limits, full product conformance requires verification of all subassemblies. Non-compliance could result in customs rejection or market withdrawal in regulated regions, particularly impacting consumer electronics or medical devices where end-use matters.

How does the absence of SATA interface influence storage options when integrating the OMAPL137DZKB3 into embedded systems?: Without native SATA support, the OMAPL137DZKB3 relies on slower alternatives like SD/MMC via the embedded multimedia card interface, USB 2.0 host ports, or external bridge chips. These solutions offer lower data rates—typically <480Mbps over USB 2.0 or <25MB/s over SDIO—making them inadequate for large sequential writes or high-bandwidth logging applications. For mass storage needs, designers often pair the processor with NAND flash managed through GPMC or use compressed file systems to reduce transfer volume, trading flexibility against performance and complexity.

What are the best practices for managing shared bus arbitration between the ARM926EJ-S and C674x cores accessing common memory?: Effective arbitration requires minimizing contention by allocating separate memory regions for each core’s exclusive use whenever possible. When overlap is unavoidable, TI recommends leveraging the Enhanced DMA Controller (EDMA) to offload data movement and schedule transfers during idle windows. Software mutexes implemented in shared RAM must account for cache coherency issues, as the ARM926EJ-S lacks hardware cache snooping. Alternatively, disabling caches or using non-cacheable memory regions simplifies synchronization but sacrifices speed. Profiling bus utilization with CCS trace tools helps identify hotspots and optimize access patterns.

Why might a designer choose the OMAPL137DZKB3 despite its aging architecture?: The decision often stems from legacy design reuse, cost constraints, or availability of specialized IP blocks not present in newer parts. The OMAPL137DZKB3 integrates both ARM9 and DSP cores on-die, eliminating the need for discrete chips and reducing board space and BOM count. Its mature ecosystem, including proven reference designs and long-term supply commitments from TI, appeals to industrial OEMs seeking stable platforms with minimal revalidation effort. Additionally, its deterministic behavior suits control-loop intensive tasks where Linux overhead or unpredictable latency in modern SoCs would degrade performance.

How does the 10/100Mbps Ethernet MAC integrate with external PHYs, and what layer 2 considerations apply?: The OMAPL137DZKB3 includes a Media Independent Interface (MII) compliant with IEEE 802.3, supporting direct connection to standard RMII or RGMII PHYs via a few GPIO pins. However, RGMII is unavailable, limiting speed to Fast Ethernet only. Proper termination, skew management, and signal integrity routing are critical near high-speed traces to avoid packet loss. Since the MAC lacks advanced features like VLAN tagging or hardware checksum offload, higher-layer protocols must handle segmentation and error detection, increasing CPU load during heavy network traffic.

What role does the CP15 co-processor play in system initialization and low-level configuration of the OMAPL137DZKB3?: The CP15 co-processor manages critical system controls including cache enable/disable, MMU setup, exception vector base address, and auxiliary control bits such as branch prediction and write buffer state. During boot, it configures memory protection domains and enables instruction/data caching after external memory initialization. Misconfiguration here can lead to crashes or security vulnerabilities, especially if untrusted code executes before full privilege levels are established. Debuggers and bootloaders frequently manipulate CP15 registers to tailor system behavior, underscoring the need for precise datasheet adherence during bring-up phases.

Can the OMAPL137DZKB3 support dual-role USB functionality simultaneously with host and device modes?: No, the OMAPL137DZKB3 contains two independent USB modules—one compliant with USB 1.1 and another with USB 2.0—but each operates in either host or device mode determined by firmware configuration. Switching roles dynamically requires resetting the port controller and reinitializing drivers, which introduces latency and complicates real-time applications. Simultaneous host-device operation is not supported, so external hubs or multiplexers would be needed if both modes are required concurrently, adding cost and complexity to the design.

What precautions should be taken when prototyping with the OMAPL137DZKB3 on breadboards or perfboards?: Due to high pin density and sensitive analog signals (e.g., PLL reference clocks), breadboarding is strongly discouraged. Instead, use breakout boards with controlled impedance traces and decoupling capacitors placed within 5mm of each power pin. The 1.8V core voltage demands tight regulation (±2%), so linear regulators or LDOs with low noise output are preferable over switching supplies. Additionally, bypass capacitors must span all power rails (1.8V, 3.3V, I/O) to suppress high-frequency transients that can destabilize PLLs or cause logic errors.

How does temperature range (0°C to 90°C) affect operational stability in outdoor vs. industrial environments?: The specified operating junction temperature of 90°C implies robust silicon quality, but ambient temperatures outside this range risk premature failure or erratic behavior. In direct sunlight or enclosed cabinets, internal self-heating from the 375MHz core and active peripherals can push die temperatures above 100°C even at 50°C ambient, violating specs. Conversely, cold starts below 0°C may delay oscillator startup or alter timing margins due to slower transistor switching. For extended reliability, designers should derate operating conditions, monitor die temperature via thermal sensors, and ensure adequate ventilation or thermal relief in mechanical designs.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments OMAPL137DZKB3

Product Attribute
Part Number	OMAPL137DZKBT3	OMAPL137DZKBA3	OMAPL137CZKBT3	OMAPL137CZKB3
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
RAM Controllers	-	-	-	-
Ethernet	-	-	-	-
Number of Cores/Bus Width	-	-	-	-
USB	-	-	-	-
Speed	-	-	-	-
Core Processor	-	-	-	-
Security Features	-	-	-	-
Co-Processors/DSP	-	-	-	-
Display & Interface Controllers	-	-	-	-
SATA	-	-	-	-
Graphics Acceleration	-	-	-	-
Voltage - I/O	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Series	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Additional Interfaces	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C

OMAPL137DZKB3 Datasheet PDF

Download OMAPL137DZKB3 pdf datasheets and Texas Instruments documentation for OMAPL137DZKB3 - Texas Instruments.

PCN Design/Specification: Cylindrical Battery Holders.pdf
PCN Assembly/Origin: 2.73KHz.pdf
PCN Packaging: 2.73KHz.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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OMAPL137DZKB3

Texas Instruments
32D-OMAPL137DZKB3

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OMAPL137DZKB3 - Texas Instruments

Specifications

Environmental & Export Classifications

Parts Introduction

Manufacturer Part Number

Manufacturer

Introduction

Product Features and Performance

Product Advantages

Key Technical Parameters

Quality and Safety Features

Compatibility

Application Areas

Product Lifecycle

Several Key Reasons to Choose This Product

Frequently Asked Questions(FAQ)

Parts with Similar Specifications

OMAPL137DZKB3 Datasheet PDF

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

Solid diode for power rectification. Works well in switching circuits.

Compact FPGA with good performance. Suitable for basic signal processing tasks.

Reliable I/O expander. Works well in embedded control applications.

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

Write a Review

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Delivery Time

Delivery Cost

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OMAPL137DZKB3

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Please refer to the English Version as our Official Version.