About us Contact Us Submit BOM
RFQs(0)
English
Close Menu
View All

Please refer to the English Version as our Official Version.Return

Europe
France(Français) Germany(Deutsch) Italy(Italia) Russian(русский) Poland(polski) Czech(Čeština) Luxembourg(Lëtzebuergesch) Netherlands(Nederland) Iceland(íslenska) Hungarian(Magyarország) Spain(español) Portugal(Português) Turkey(Türk dili) Bulgaria(Български език) Ukraine(Україна) Greece(Ελλάδα) Israel(עִבְרִית) Sweden(Svenska) Finland(Svenska) Finland(Suomi) Romania(românesc) Moldova(românesc) Slovakia(Slovenská) Denmark(Dansk) Slovenia(Slovenija) Slovenia(Hrvatska) Croatia(Hrvatska) Serbia(Hrvatska) Montenegro(Hrvatska) Bosnia and Herzegovina(Hrvatska) Lithuania(lietuvių) Spain(Português) Switzerland(Deutsch) United Kingdom(English)
Asia/Pacific
Japan(日本語) Korea(한국의) Thailand(ภาษาไทย) Malaysia(Melayu) Singapore(Melayu) Vietnam(Tiếng Việt) Philippines(Pilipino)
Africa, India and Middle East
United Arab Emirates(العربية) Iran(فارسی) Tajikistan(فارسی) India(हिंदी) Madagascar(malaɡasʲ)
South America / Oceania
New Zealand(Maori) Brazil(Português) Angola(Português) Mozambique(Português)
North America
United States(English) Canada(English) Haiti(Ayiti) Mexico(español)
HomeProductsIntegrated Circuits (ICs)Embedded - MicroprocessorsOMAPL137CZKBT3
Image may be representation.
See specifications for product details.
Share
 Favorite
EXPRESS OPTION
Payment method

OMAPL137CZKBT3 - Texas Instruments

Manufacturer Part Number
OMAPL137CZKBT3
Manufacturer
Texas Instruments
Allelco Part Number
32D-OMAPL137CZKBT3
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,310 pcs available, New & Original
Parts Description
IC MPU OMAP-L1X 375MHZ 256BGA
Package
256-BGA (17x17)
Data sheet
OMAPL137CZKBT3.pdf

PCN Obsolescence/ EOL

Cylindrical Battery Holders.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 11310

Required fields are indicated by an asterisk (*)
Please send RFQ, we will respond immediately.

Quantity

Specifications

OMAPL137CZKBT3 Tech Specifications
Texas Instruments - OMAPL137CZKBT3 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL137CZKBT3

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - I/O 1.8V, 3.3V
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Supplier Device Package 256-BGA (17x17)
Speed 375MHz
Series OMAP-L1x
Security Features -
SATA -
RAM Controllers SDRAM
Package / Case 256-BGA
Package Tray
Product Attribute Attribute Value
Operating Temperature -40°C ~ 125°C (TJ)
Number of Cores/Bus Width 1 Core, 32-Bit
Mounting Type Surface Mount
Graphics Acceleration No
Ethernet 10/100Mbps (1)
Display & Interface Controllers LCD
Core Processor ARM926EJ-S
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
Base Product Number OMAPL137
Additional Interfaces HPI, I²C, McASP, MMC/SD, SPI, UART

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

Manufacturer Part Number

OMAPL137CZKBT3

Manufacturer

Texas Instruments

Introduction

The OMAPL137CZKBT3 is a powerful embedded microprocessor from Texas Instruments' OMAP-L1x series. It features an ARM926EJ-S core running at 375MHz, along with various co-processors and peripherals for efficient system control and signal processing.

Product Features and Performance

ARM926EJ-S core with 32-bit bus width and 375MHz clock speed

Signal processing co-processor (C674x), system control co-processor (CP15)

SDRAM memory controller

LCD display controller

10/100Mbps Ethernet, USB 1.1 and USB 2.0 interfaces

Operates over an extended temperature range of -40°C to 125°C

Product Advantages

Highly integrated system-on-chip design with a range of on-chip peripherals

Powerful ARM core coupled with dedicated co-processors for efficient system control and signal processing

Supports a wide range of operating temperatures, making it suitable for harsh environments

Extensive peripheral options for connectivity and interfacing with various system components

Key Reasons to Choose This Product

Robust and reliable performance for demanding embedded applications

Flexible peripheral set that enables integration with a wide range of system requirements

Proven track record and technical support from Texas Instruments

Cost-effective solution for applications requiring high-performance and feature-rich microprocessors

Quality and Safety Features

Surface mount package for reliable and secure board-level integration

Extended operating temperature range for use in harsh environments

Compliance with relevant industry standards and regulations

Compatibility

The OMAPL137CZKBT3 is compatible with a variety of peripheral devices and interfaces, including:

SDRAM memory

LCD displays

Ethernet networks

USB devices

I2C, SPI, UART, and other serial communication protocols

Application Areas

The OMAPL137CZKBT3 is suitable for a wide range of embedded applications, including:

Industrial automation and control systems

Automotive infotainment and telematics

Medical devices and equipment

Robotics and automation

Wireless communication systems

Product Lifecycle

The OMAPL137CZKBT3 is an obsolete product, meaning it is no longer in active production. However, Texas Instruments may still provide support and have equivalent or alternative models available. Customers are advised to contact our website's sales team for more information on available options and product lifecycle status.

Frequently Asked Questions(FAQ)

How does the OMAPL137CZKBT3 compare to other processors in the OMAP-L1x series for industrial control applications requiring 375MHz performance and 10/100 Ethernet?
The OMAPL137CZKBT3 delivers a balanced architecture combining an ARM926EJ-S core at 375MHz with dedicated C674x DSP acceleration, making it particularly effective for signal processing tasks common in industrial control systems. Unlike the OMAPL138 which features dual-core processing, the L137 provides sufficient single-threaded performance for many real-time control loops while maintaining power efficiency. Its integrated 10/100 Ethernet PHY reduces external component count compared to software-based MAC implementations on other members of the series, lowering BOM cost and board complexity in embedded networking applications.
What are the key considerations when selecting between the OMAPL137CZKBT3 and a modern Cortex-A based processor for a new embedded design targeting long-term availability?
While the OMAPL137CZKBT3 offers proven reliability and extensive peripheral integration—including USB 2.0, LCD controller, and multiple serial interfaces—modern Cortex-A processors provide significantly higher performance and software ecosystem support. However, if your application operates within the L137’s 375MHz capability and requires deterministic timing behavior from its fixed-function peripherals (such as McASP or HPI), the mature TI driver stack and absence of Linux kernel dependencies may simplify certification and maintenance. Long-term supply is also more assured due to continued industrial-grade availability, though migration paths should be evaluated against future scalability needs.
Can the OMAPL137CZKBT3 directly interface with DDR2 SDRAM modules commonly used in legacy embedded systems?
No, the OMAPL137CZKBT3 includes an internal SDRAM controller designed for synchronous DRAM (SDRAM) rather than DDR2 memory types. Attempting direct connection without proper level translation or timing adjustments would result in signal integrity issues and unreliable operation. For DDR2 compatibility, an external memory interface IC or FPGA must be used to bridge the protocol difference, increasing system cost and complexity compared to designs using onboard SDRAM compatible with the controller’s native timing parameters.
What voltage levels are required to operate the I/O pins of the OMAPL137CZKBT3 during system initialization?
The OMAPL137CZKBT3 supports two distinct I/O voltage rails: 1.8V for core logic and high-speed peripherals such as USB and McASP, and 3.3V for general-purpose digital inputs and outputs including UART, SPI, and I2C. Proper sequencing between these supplies is critical; failure to meet the specified power-up sequence can prevent successful booting. Additionally, mixed-voltage signaling across domains requires level shifters when interfacing with 5V legacy components, as the device does not tolerate absolute overvoltage conditions on any pin beyond its rated limits.
How does the operating temperature range of the OMAPL137CZKBT3 impact thermal management in automotive or aerospace environments?
With a junction temperature rating spanning -40°C to +125°C, the OMAPL137CZKBT3 meets stringent environmental requirements for harsh applications. However, sustained operation near 125°C demands careful PCB layout to minimize thermal resistance, including adequate copper pour around the 256-BGA package and avoidance of nearby heat-generating components. In automotive infotainment or aerospace telemetry systems where ambient temperatures fluctuate widely, passive cooling alone may suffice, but active thermal monitoring via GPIO-connected sensors is recommended to prevent throttling or latch-up during transient overloads.
Is there a difference in pinout or package compatibility between the OMAPL137CZKBT3 and its substitute part OMAPL137DZKBT3?
Both the OMAPL137CZKBT3 and OMAPL137DZKBT3 share identical 256-ball BGA packages with the same 17×17 mm footprint and ball pitch. They are electrically interchangeable under most design conditions, though minor variations in revision-level documentation or firmware expectations may exist. Designers should consult latest errata notes to confirm any differences in reset timing, PLL lock characteristics, or peripheral default states, especially if migrating between revisions during production. Mechanical compatibility ensures drop-in replacement without board redesign.
What role does the CP15 coprocessor play in configuring the OMAPL137CZKBT3 for secure or fault-tolerant operation?
Embedded within the ARM926EJ-S core, CP15 manages memory protection units (MPU), cache configuration, and system control registers essential for deterministic execution. On the OMAPL137CZKBT3, CP15 enables fine-grained access control over memory regions—critical for isolating RTOS tasks or preventing unauthorized writes to configuration registers. While the chip lacks hardware encryption engines, CP15’s MPU can enforce read-only policies on sensitive data areas, contributing to functional safety in medical or avionics subsystems where software isolation is mandated.
Why might an engineer choose the OMAPL137CZKBT3 over a microcontroller with integrated Ethernet for a network-connected sensor node?
The OMAPL137CZKBT3 combines a full 32-bit RISC processor capable of running a lightweight TCP/IP stack with dedicated hardware accelerators for packet handling and DMA-driven transfers. This reduces CPU load compared to microcontroller-based solutions that emulate Ethernet at higher overhead. For nodes transmitting periodic sensor data over 10/100BASE-T, the L137’s offloaded CRC calculation and automatic frame buffering improve responsiveness and battery life in edge-computing deployments, despite its higher static power consumption relative to ultra-low-power MCUs.
What precautions should be taken when using the HPI interface on the OMAPL137CZKBT3 with third-party host processors?
The Host Port Interface (HPI) on the OMAPL137CZKBT3 operates at 1.8V and uses a multiplexed address/data bus. When interfacing with 3.3V or 5V hosts, bidirectional level translation is mandatory to avoid damaging either device. Additionally, careful attention must be paid to clock domain crossing between the HPI clock and the ARM9 core’s system clock, as asynchronous handshaking protocols are not natively supported. Using FIFO buffers or synchronized handshake signals mitigates metastability risks in multi-clock environments typical in heterogeneous SoC designs.
How does the Moisture Sensitivity Level (MSL) classification of MSL 3 affect storage and handling of OMAPL137CZKBT3 devices before reflow soldering?
Classified as MSL 3, the OMAPL137CZKBT3 must be stored in dry packaging and brought to room temperature gradually before exposure to air to prevent condensation-induced popcorning during reflow. Devices must be used within 168 hours of opening unless baked per JEDEC J-STD-033 standards. In high-humidity manufacturing environments, implementing bake-out procedures or nitrogen-flush assembly lines becomes necessary to maintain reliability, particularly when deploying in consumer electronics where shelf-life logistics are less controlled than in industrial settings.
Are there limitations on the number of simultaneous USB transactions the OMAPL137CZKBT3 can support given its dual USB ports?
Yes. Despite supporting both USB 1.1 and USB 2.0 protocols through separate controllers, the OMAPL137CZKBT3 shares bandwidth across endpoints via a unified DMA engine. Concurrent high-speed bulk transfers on both ports may contend for memory bandwidth, potentially causing latency spikes or dropped packets under heavy loads. Designers should profile worst-case scenarios using actual payload sizes and prioritize endpoint scheduling in firmware to avoid saturation, especially when driving cameras or storage devices simultaneously.
What impact do the absence of SATA and GPU blocks have on multimedia application development using the OMAPL137CZKBT3?
The lack of native SATA and graphics acceleration limits the OMAPL137CZKBT3 to non-storage-intensive multimedia roles such as audio streaming or simple video capture via USB input. Without hardware-accelerated rendering, UI animations and decoding complex codecs like H.264 require significant CPU resources from the ARM926EJ-S, reducing available cycles for other tasks. For dashcam or surveillance applications, this constraint necessitates external compression chips or FPGA assistance, increasing system complexity compared to full-featured SoCs with integrated display pipelines and storage interfaces.
How does the base product number OMAPL137 differentiate from other variants like OMAPL138 or OMAPL139 in terms of DSP integration?
Unlike the OMAPL138 and OMAPL139, which include enhanced C674x+ DSP cores with additional VLIW instructions and improved floating-point units, the OMAPL137CZKBT3 features a standard C674x DSP without architectural upgrades. This makes the L137 less suitable for computationally intensive algorithms like FFTs or adaptive filtering at real-time rates. However, for basic FIR filters or sensor fusion requiring moderate math throughput, the existing DSP remains sufficient, offering a lower-cost entry point into TI’s heterogeneous computing platform.
What steps are necessary to ensure reliable operation when connecting the McASP audio interface to external CODECs on the OMAPL137CZKBT3?
The Multi-channel Audio Serial Port (McASP) on the OMAPL137CZKBT3 requires precise configuration of clock dividers and frame synchronization signals to match the CODEC’s master/slave mode and data width. Electrical compatibility must also be verified—McASP transmits/receives at 3.3V logic levels, so CODECs expecting 1.8V signaling need level shifting. Additionally, impedance matching and trace length control are crucial for high-fidelity audio; mismatches above 50Ω can cause reflections and bit errors, particularly in multi-drop configurations exceeding three devices.
How does the RoHS3 compliance status of the OMAPL137CZKBT3 affect global regulatory submissions for medical or military end products?
RoHS3 compliance ensures the OMAPL137CZKBT3 meets current European Union restrictions on hazardous substances including lead, mercury, and cadmium, simplifying CE marking for EU-bound devices. It also aligns with international equivalents like China RoHS, avoiding customs delays in Asia-Pacific markets. However, military or high-reliability medical systems may impose stricter outgassing or material requirements beyond RoHS3, necessitating additional qualification testing such as IPC-1601 or MIL-STD-883 methods to validate solder joint reliability under vibration or thermal cycling.
What are the implications of using the MMC/SD interface on the OMAPL137CZKBT3 for removable storage instead of embedded NAND flash?
The MMC/SD interface provides plug-and-play hot-swapping capability ideal for user-accessible storage expansion, but introduces wear-leveling overhead managed by the SD card itself rather than the host. Unlike raw NAND accessed via GPMC, SD cards handle block erasure transparently, simplifying software but adding latency for small random writes. In battery-powered devices, frequent SD access increases current draw and shortens lifespan; thus, the L137’s MMC controller should be paired with low-power SD cards and optimized file system caching to mitigate performance penalties.
How does the 256-BGA package influence routing complexity and signal integrity on a four-layer PCB using the OMAPL137CZKBT3?
The 17×17 mm 256-ball BGA package demands tight manufacturing tolerances due to its 0.8mm ball pitch, requiring advanced PCB fabrication techniques such as laser-drilled microvias and controlled impedance routing. On a four-layer stackup, power delivery networks must be meticulously planned with decoupling capacitors placed close to each power rail to suppress high-frequency noise from the 375MHz core switching. Differential pairs like those for Ethernet or USB 2.0 need matched lengths (<5mm skew) to maintain signal quality, increasing routing effort compared to QFP-packaged alternatives.
What design trade-offs arise when choosing between using the OMAPL137CZKBT3’s internal RAM controllers versus external SRAM for time-critical interrupt service routines?
Accessing external SRAM via the OMAPL137CZKBT3’s SDRAM controller adds latency due to address multiplexing and command overhead, potentially violating real-time deadlines in hard-interrupt contexts. Internal tightly-coupled memory (if available) or cached instruction fetches reduce this penalty but consume precious on-chip area. For ISRs requiring sub-microsecond response, designers may pre-load critical code into internal RAM banks or use the DSP’s local memory to bypass slow external accesses, accepting higher silicon cost for guaranteed timing predictability.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments OMAPL137CZKBT3

Product Attribute OMAPL137DZKBT3 OMAPL137BZKBT3 OMAPL137CZKB3 OMAPL137CZKBA3
Part Number OMAPL137DZKBT3 OMAPL137BZKBT3 OMAPL137CZKB3 OMAPL137CZKBA3
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Graphics Acceleration - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Display & Interface Controllers - - - -
Number of Cores/Bus Width - - - -
USB - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
SATA - - - -
Additional Interfaces - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Ethernet - - - -
RAM Controllers - - - -
Series - - - -
Core Processor - - - -
Security Features - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Co-Processors/DSP - - - -
Voltage - I/O - - - -
Speed - - - -

OMAPL137CZKBT3 Datasheet PDF

Download OMAPL137CZKBT3 pdf datasheets and Texas Instruments documentation for OMAPL137CZKBT3 - Texas Instruments.

PCN Obsolescence/ EOL
Cylindrical Battery Holders.pdf

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
Quality Inspection Image - 01
Quality Inspection Image - 02
Quality Inspection Image - 03
Quality Inspection Image - 04

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
Texas Instruments

OMAPL137CZKBT3

Texas Instruments
32D-OMAPL137CZKBT3

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

Allelco
About Us
History
Certifications
Recruitment
Policies
Terms & Conditions
Privacy Policy
Cookie Policy
Services
Order Tracking
Return & Replacement
Frequently Asked Questions
Contact Us
Order
Shipping & Delivering
Payment Methods
My Account
The BlogsHot PartsChange LanguageNewsSite map
Contact Us
Headquarters Address:
Room C 13/F Harvard Commercial Building
105-111 Thomson Road Wan Chai
HongKong
Service Tel: +852-91464856
Service Email: info@allelco.com
Follow us
Copyright © 2012-2025 AllelcoElec.com. All rights reserved.
0 RFQ
Shopping cart (0 Items)
It is empty.
Submit RFQ
Compare List (0 Items)
It is empty.
Feedback

Your feedback matters! At Allelco, we value the user experience and strive to improve it constantly.
Please share your comments with us via our feedback form, and we'll respond promptly.
Thank you for choosing Allelco.

Subject
E-mail
Comments
Captcha
Drag or click to upload file
Upload File
types: .xls, .xlsx, .doc, .docx, .jpg, .png and .pdf.
Max file size: 10MB