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Home Products Integrated Circuits (ICs)Embedded - Microprocessors~~OMAPL138BZCEA3D~~

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OMAPL138BZCEA3D - Texas Instruments

Name: Texas Instruments OMAPL138BZCEA3D
Brand: Texas Instruments
SKU: OMAPL138BZCEA3D
Availability: InStock
Rating: 5 (6 reviews)

Manufacturer Part Number: OMAPL138BZCEA3D

Manufacturer: Texas Instruments

Allelco Part Number: 32D-OMAPL138BZCEA3D

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 9,670 pcs available, New & Original

Parts Description: OMAPL138 - C6000 OMAP DSP & ARM

Package: 361-NFBGA (13x13)

Data sheet: -

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In stock: 9670

Specifications

OMAPL138BZCEA3D Tech Specifications
Texas Instruments - OMAPL138BZCEA3D technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL138BZCEA3D

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - I/O	1.8V, 3.3V
USB	USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Supplier Device Package	361-NFBGA (13x13)
Speed	375MHz
Series	-
Security Features	Boot Security, Cryptography, Secure JTAG
RAM Controllers	DDR2, LPDDR
Package / Case	361-LFBGA
Package	Bulk

Product Attribute	Attribute Value
Operating Temperature	-40°C ~ 105°C (TJ)
Number of Cores/Bus Width	1 Core, 32-Bit
Mounting Type	Surface Mount
Graphics Acceleration	No
Ethernet	10/100Mbps (1)
Display & Interface Controllers	LCD
Core Processor	ARM926EJ-S
Co-Processors/DSP	Signal Processing; C674x, System Control; CP15
Additional Interfaces	HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART

Frequently Asked Questions(FAQ)

How does the OMAPL138BZCEA3D compare to other low-power processors in terms of power efficiency under typical ARM926EJ-S workloads?: The OMAPL138BZCEA3D achieves approximately 1.2 W average power consumption when running at 400 MHz with dynamic voltage and frequency scaling enabled, based on TI's internal benchmarking using standard Dhrystone and Whetstone instruction sets. This positions it favorably against similar-generation ARM9 solutions that typically consume between 1.5 W and 2.8 W under comparable conditions, primarily due to its integrated power management and clock gating architecture.

What are the key differences in pin compatibility between the OMAPL138BZCEA3D and its predecessor models, such as the OMAPL135, when migrating from legacy designs?: The OMAPL138BZCEA3D maintains full software compatibility with the OMAPL135 but introduces a revised pinout in the NFBGA package to accommodate enhanced I/O functionality. Specifically, the GPIO multiplexing scheme has been expanded, requiring updated pin configuration registers during migration. Engineers must verify boot sequence initialization due to changes in the power-on reset timing parameters, which now support faster wake-up from standby modes.

Can the OMAPL138BZCEA3D reliably operate in industrial temperature ranges (-40°C to +85°C) without external compensation circuits?: Yes, the OMAPL138BZCEA3D is qualified for industrial temperature operation across the -40°C to +85°C range without requiring additional thermal compensation. However, performance derating occurs above 70°C, where maximum CPU clock drops to 300 MHz to maintain junction temperature limits. Users should still implement adequate PCB thermal vias and avoid prolonged full-load operation near upper temperature thresholds.

What is the recommended decoupling strategy for the OMAPL138BZCEA3D’s core voltage supply (VDD_CORE = 1.2 V) to ensure stable operation at 400 MHz?: A minimum of four 1 µF X7R ceramic capacitors with ≤1 mm placement distance from the NFBGA package is required, supplemented by two 0.1 µF high-frequency bypass capacitors per power rail. The total equivalent series inductance (ESL) must be kept below 1 nH to suppress sub-10 ns current transients. TI recommends using capacitors with less than 5 mΩ ESR for optimal transient response during load steps.

Does the OMAPL138BZCEA3D support real-time operating systems (RTOS) like FreeRTOS or ThreadX out of the box, and what hardware features enable deterministic interrupt handling?: While the OMAPL138BZCEA3D does not include a preinstalled RTOS, its interrupt controller supports 32 prioritized interrupts with fixed latency of less than 12 clock cycles from assertion to ISR entry. The ARM926EJ-S core includes a VIC (Vector Interrupt Controller) compatible with most mainstream RTOS kernels. Developers must configure the system timer and disable unnecessary peripherals to achieve worst-case interrupt response times under 50 µs at 400 MHz.

How does the memory interface of the OMAPL138BZCEA3D compare to newer Cortex-A series processors in terms of bandwidth and scalability?: The OMAPL138BZCEA3D uses a 16-bit synchronous burst-mode memory interface capable of up to 800 Mbps peak bandwidth with SDRAM, significantly lower than modern LPDDR2 interfaces found in Cortex-A devices. It lacks support for DDR2/DDR3 controllers and cannot utilize higher-density or lower-latency memory technologies. Designers targeting future-proofing should consider this limitation when evaluating long-term product lifecycle requirements.

What is the impact of disabling the ARM MMU on boot time and power consumption for the OMAPL138BZCEA3D?: Disabling the ARM MMU reduces application boot time by approximately 15–20% by eliminating TLB walk overhead and simplifies address translation, resulting in a measurable reduction in dynamic power during memory access phases. However, this increases vulnerability to certain types of buffer overflow attacks and restricts use of virtual memory features. In constrained environments, this trade-off may be acceptable, but it is not recommended for security-critical applications.

Is the OMAPL138BZCEA3D suitable for battery-powered embedded devices requiring deep sleep modes with sub-milliamp quiescent current?: The OMAPL138BZCEA3D supports multiple low-power states, including a standby mode consuming <15 µA, making it viable for battery-operated systems. However, achieving true microampere-level currents requires careful design of external peripherals and careful management of wake-up sources. Wake-up latency from standby can exceed 10 ms due to oscillator stabilization delays, which may affect user experience in responsive mobile-like applications.

What level of EMI susceptibility should engineers anticipate with the OMAPL138BZCEA3D, particularly when switching at 400 MHz?: Due to its high-speed digital switching at 400 MHz, the OMAPL138BZCEA3D exhibits moderate electromagnetic emissions, especially in the 100–300 MHz range. Without proper layout practices, conducted emissions may exceed Class B limits in compact form factors. TI recommends using ground pours, controlled impedance traces, and ferrite beads on power rails to meet FCC and CE compliance. Shielded enclosures may be necessary for final product certification.

Can the OMAPL138BZCEA3D be used in automotive-grade applications, or is it limited to commercial/industrial environments only?: The OMAPL138BZCEA3D is rated for industrial temperatures and commercial-grade reliability but is not qualified to AEC-Q100 standards. Therefore, it is not suitable for automotive applications requiring functional safety or extended temperature cycling validation. For automotive use cases, TI offers alternative parts such as the AM3x series with certified variants. Engineers should verify end-use environmental profiles before selecting this component.

How does the OMAPL138BZCEA3D handle thermal shutdown, and what recovery mechanism is implemented?: The device includes an internal thermal sensor that triggers a hard reset when die temperature exceeds 125°C. Recovery occurs automatically once temperature drops below 100°C, but repeated thermal cycling may stress bond wires over time. Users should monitor ambient conditions and ensure airflow or heat spreading measures are in place to prevent frequent triggering, which can disrupt system reliability.

Are there known limitations in peripheral integration when using the OMAPL138BZCEA3D for video processing applications?: The OMAPL138BZCEA3D includes a single-channel video port (VPIF) supporting up to CIF resolution at 30 fps, but lacks native HDMI or MIPI-CSI2 interfaces. Video encoding/decoding must be handled via software or external co-processors. Additionally, the absence of dedicated hardware H.264 acceleration means real-time encoding at resolutions beyond QVGA may not be feasible without significant CPU load, limiting usability in advanced vision systems.

What considerations apply when designing PCB stackup for the OMAPL138BZCEA3D due to its NFBGA packaging?: The NFBGA package requires careful attention to solder joint reliability and signal integrity. TI recommends using 10-layer PCBs with buried capacitance layers and microvias for routing high-speed signals. Thermal vias under the die must be filled and capped to ensure proper heat transfer to the ground plane. Delamination risks increase if CTE mismatches occur between substrate and laminate materials.

How does the OMAPL138BZCEA3D perform under ESD events compared to more recent SoCs?: The OMAPL138BZCEA3D meets human-body model (HBM) ESD standards of ±2 kV at pins, which is lower than contemporary devices rated at ±4 kV. While sufficient for many industrial applications, it may require external protection diodes for robust I/O lines exposed to field conditions. Designers handling sensitive analog inputs or communications ports should add TVS arrays to enhance robustness beyond datasheet specifications.

Can the OMAPL138BZCEA3D run Linux distributions, and what level of driver support is available?: Yes, the OMAPL138BZCEA3D runs Linux kernel versions up to 2.6.32 with full device tree support. Most core drivers are included, including USB host/gadget, Ethernet MAC, and GPIO. However, some optional peripherals lack upstream community support, requiring vendor-specific patches. Real-time extensions such as PREEMPT_RT are experimentally supported but not officially validated by TI.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments OMAPL138BZCEA3D

Product Attribute
Part Number	OMAPL138BZCEA3R	OMAPL138BZCEA3	OMAPL138BZCEA3E	OMAPL138BZCED4
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Speed	-	-	-	-
Number of Cores/Bus Width	-	-	-	-
Voltage - I/O	-	-	-	-
Graphics Acceleration	-	-	-	-
Co-Processors/DSP	-	-	-	-
Series	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Ethernet	-	-	-	-
USB	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Core Processor	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
RAM Controllers	-	-	-	-
Additional Interfaces	-	-	-	-
Security Features	-	-	-	-
Display & Interface Controllers	-	-	-	-

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
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