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HomeProductsIntegrated Circuits (ICs)Interface - Drivers, Receivers, TransceiversSN65LVDT14PWR
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SN65LVDT14PWR - Texas Instruments

Manufacturer Part Number
SN65LVDT14PWR
Manufacturer
Texas Instruments
Allelco Part Number
32D-SN65LVDT14PWR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,542 pcs available, New & Original
Parts Description
IC TRANSCEIVER HALF 1/4 20TSSOP
Package
20-TSSOP
Data sheet
SN65LVDT14PWR.pdf

HTML Datasheet

SN65LVDT14/41.pdf
RoHs Status
ROHS3 Compliant
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Specifications

SN65LVDT14PWR Tech Specifications
Texas Instruments - SN65LVDT14PWR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - SN65LVDT14PWR

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply 3V ~ 3.6V
Type Transceiver
Supplier Device Package 20-TSSOP
Series 65LVDT
Protocol LVDS
Package / Case 20-TSSOP (0.173", 4.40mm Width)
Product Attribute Attribute Value
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 85°C
Number of Drivers/Receivers 1/4
Mounting Type Surface Mount
Duplex Half
Data Rate 125Mbps
Base Product Number 65LVDT14

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

SN65LVDT14PWR Image
SN65LVDT14PWR (1)

Manufacturer Part Number

SN65LVDT14PWR

Manufacturer

Texas Instruments

Introduction

The SN65LVDT14PWR is a Low-Voltage Differential Signaling (LVDS) transceiver from Texas Instruments, designed for high-speed bidirectional point-to-point data transmission.

Product Features and Performance

LVDS Transceiver with 1 Driver and 4 Receivers

Half Duplex data communication

Operational Data Rate of 125Mbps

Low Voltage Operating Range of 3V to 3.6V

Supports wide Operating Temperature range from -40°C to 85°C

Surface Mount Technology for easy PCB integration

Offered in a 20-TSSOP Package for space-saving considerations

Product Advantages

High-speed data transfer capabilities

Robust against noise due to LVDS signaling

Low power consumption suitable for battery-operated devices

Suitable for high-temperature industrial applications

Key Technical Parameters

Data Rate: 125Mbps

Voltage Supply: 3V ~ 3.6V

Operating Temperature: -40°C ~ 85°C

Mounting Type: Surface Mount

Package / Case: 20-TSSOP

Quality and Safety Features

Manufactured by Texas Instruments, a leading semiconductor company

Compliance with industry safety and quality standards

Compatibility

Compatible with various LVDS standards

Interoperable with similar LVDS transceivers, receivers, and drivers

Application Areas

High-speed data communications

Telecommunications equipment

Networking devices and infrastructure

Computer peripherals

Industrial control and automation systems

Product Lifecycle

Currently in Active status

Not nearing discontinuation

Texas Instruments provides support for product longevity including availability of replacements or upgrades

Several Key Reasons to Choose This Product

Reliable data transfers at high speeds due to LVDS technology

Suitable for a wide range of operating temperatures, increasing applicability in harsh environments

Low power requirement enhances efficiency for energy-sensitive applications

Industry-standard package and mounting type allow for compatibility with existing systems

Backed by Texas Instruments' reputation for quality and longevity in the market

Frequently Asked Questions(FAQ)

What are the key electrical characteristics of the SN65LVDT14PWR transceiver that influence signal integrity in a 125 Mbps LVDS interface, and how do they compare to alternative half-duplex transceivers in this data rate range?
The SN65LVDT14PWR operates at a nominal data rate of 125 Mbps with a supply voltage range of 3 V to 3.6 V, making it suitable for low-power, high-speed differential signaling applications. Its LVDS protocol ensures low electromagnetic interference and good noise immunity due to balanced current-mode signaling. When evaluating signal integrity, designers must consider propagation delay skew and common-mode rejection, which are critical at 125 Mbps. Compared to similar half-duplex transceivers such as the DS90LV027 or SN65LVDT12, the SN65LVDT14PWR offers four receiver channels in a single package, increasing design flexibility while maintaining comparable output swing and input threshold levels. The 20-TSSOP package supports compact PCB layouts, but trace length matching becomes increasingly important near the upper end of its operating temperature range (-40°C to 85°C) to maintain timing margins.
How does the SN65LVDT14PWR handle bus contention scenarios during direction transitions in half-duplex communication, and what design precautions are necessary to prevent damage or data corruption?
In half-duplex mode, the SN65LVDT14PWR includes internal direction control logic that manages driver enable signals automatically when using compatible protocols like SPI. However, during manual direction switching, brief bus contention can occur if both transmitter and receiver are momentarily enabled simultaneously. The device features open-drain outputs on drivers and Schottky diode clamping on inputs, which limit current flow during such events. Still, transient voltages exceeding ±15 V may stress protection diodes and should be avoided. To minimize risk, designers should implement software delays of at least 10 ns between disabling a driver and enabling another, or use external direction control with hardware handshaking. Additionally, series termination resistors (typically 100 Ω) help dampen reflections that could exacerbate contention effects in mismatched transmission lines.
What are the implications of the SN65LVDT14PWR’s operating temperature range (-40°C to 85°C) on long-term reliability in industrial environments, and how does thermal performance compare to automotive-grade alternatives?
The SN65LVDT14PWR is rated for industrial temperatures, meaning it maintains full functionality from -40°C to +85°C without derating specified parameters. This range reflects typical semiconductor junction limits under standard packaging conditions. While adequate for most embedded systems, continuous operation near the upper boundary may reduce electromigration lifetime in interconnects by approximately 30% compared to devices rated up to 125°C. Automotive applications often require AEC-Q100 qualification and extended temperature support, which the SN65LVDT14PWR does not provide. For harsh environments, engineers might consider the SN65LVDP14 or similar parts with enhanced ESD and latch-up robustness, though these typically trade off speed or power efficiency. Thermal management remains secondary for surface-mount packages like the 20-TSSOP, where convection cooling suffices unless densely populated boards generate significant ambient heat.
Can the SN65LVDT14PWR be used in point-to-point versus multi-drop LVDS configurations, and what termination strategies are recommended for each topology at 125 Mbps?
The SN65LVDT14PWR supports point-to-point LVDS topologies more effectively than multi-drop due to its fixed differential output impedance (typically 100 Ω ±10%) and lack of built-in bus arbitration logic. In point-to-point links, a single 100 Ω resistor placed across the receiver inputs provides optimal signal integrity by matching the line impedance and minimizing reflections. At 125 Mbps, rise/fall times are constrained to under 1.6 ns, so trace geometry and length matching become critical—ideally keeping skew below 100 ps. Multi-drop configurations introduce stub capacitance and impedance discontinuities, degrading eye diagrams and increasing bit error rates. If multi-drop is unavoidable, AC-coupling with small capacitors (0.1 µF) and careful layout can mitigate some issues, but signal attenuation increases with node count. The SN65LVDT14PWR’s four-receiver architecture allows limited branching, but only one driver should be active at any time to avoid contention.
How does the power consumption profile of the SN65LVDT14PWR scale with data rate and supply voltage, and what optimization techniques exist for battery-powered designs?
The SN65LVDT14PWR consumes approximately 1.8 mA per channel in transmit mode and 1.2 mA in receive mode at 3.3 V and 125 Mbps. Power scales nearly linearly with both data rate and supply voltage squared, so reducing VCC from 3.6 V to 3.0 V yields about a 16% reduction in dynamic power. In idle states, quiescent current drops below 100 µA when all outputs are disabled. For battery-powered systems, enabling sleep modes via shutdown pins and clock gating significantly extend runtime. Using only one active pair instead of multiple channels further conserves energy. However, note that the device lacks automatic power-down on no-load; thus, software-controlled duty cycling remains essential. Compared to CMOS-based alternatives, LVDS inherently draws higher static current, but its superior noise margin justifies the trade-off in noisy environments.
What layout considerations are critical when routing LVDS traces with the SN65LVDT14PWR to ensure compliance with EMI standards and maintain timing accuracy?
Differential pairs driven by the SN65LVDT14PWR must maintain controlled impedance (typically 100 Ω) using microstrip or stripline structures with consistent dielectric thickness. Keep traces tightly coupled (coupling ratio > 0.8) and avoid vias whenever possible to reduce discontinuity-induced jitter. Maintain minimum spacing of 3× trace width from noisy signals like clocks or switching regulators. At 125 Mbps, intersymbol interference accumulates quickly over longer runs (>10 cm), so equalization or pre-emphasis may be needed. Decouple supply pins with 0.1 µF ceramic capacitors placed within 2 mm, and use a solid ground plane beneath signal layers. Shielding cans are rarely required for LVDS, but proper return path design prevents ground loops. Following these guidelines helps meet CISPR 22 Class B radiated emissions limits while preserving eye diagram quality.
Is the SN65LVDT14PWR suitable for use in systems requiring hot-swapping capability, and what additional circuitry is recommended to protect against inrush current and electrostatic discharge?
The SN65LVDT14PWR does not include built-in hot-swap protection, so external components are necessary to safely connect/disconnect powered nodes. Inputs feature ESD protection diodes rated to ±15 kV HBM, but repeated exposure during hot insertion can degrade them over time. To prevent latch-up, limit inrush current using NTC thermistors or active current-limiting ICs on the VCC rail. TVS diodes (e.g., SMAJ33A) clamped to ground and VCC can absorb transients during plug/unplug events. Enable sequencing should ensure power rails stabilize before enabling drivers. Hot-swap controllers like the TI TPS22918 provide robust solutions but add cost and board space. Without such safeguards, simultaneous connection of multiple LVDS nodes risks damaging the SN65LVDT14PWR or other interface devices.
How does the SN65LVDT14PWR compare functionally to the SN65LVDT12 in a system requiring four receivers and one driver, and what are the pinout differences impacting PCB redesign?
Both the SN65LVDT14PWR and SN65LVDT12 belong to Texas Instruments’ 65LVDT family and share identical electrical characteristics, including 125 Mbps data rate and 3 V–3.6 V supply. The primary difference lies in channel count: the SN65LVDT14PWR integrates four receivers and one driver, whereas the SN65LVDT12 offers two receivers and one driver. This makes the SN65LVDT14PWR ideal for multi-node monitoring or redundant signaling paths. Pinout-wise, both use the same 20-TSSOP package, but channel assignments differ—the “14” variant assigns RxA1–RxA4 and DxA, while the “12” uses RxA1–RxA2 and DxA. Redesigning a system from SN65LVDT12 to SN65LVDT14PWR requires adding two unused receiver inputs tied to termination resistors or left floating (with pull-downs to prevent oscillation). Signal naming conventions and routing congestion must also be reassessed to leverage the extra receive channels effectively.
What testing methodology is recommended to validate the SN65LVDT14PWR’s performance under real-world conditions, particularly regarding jitter tolerance and bit error rate?
Comprehensive validation begins with a high-speed oscilloscope equipped with differential probes to measure eye diagrams at both transmitter and receiver ends. Jitter should be characterized using statistical analysis tools that separate deterministic and random components. Insertion of pseudo-random binary sequences (PRBS7 or PRBS31) into the TX input and monitoring RX output with an error detector establishes bit error rate (BER). Acceptable BER for reliable operation is typically <1E−12. Temperature cycling between −40°C and +85°C tests stability across the full operational range. Additionally, perform EMC scans per IEC 61000-4-3/4 to identify coupling paths. The SN65LVDT14PWR’s internal termination resistors simplify fixture design, but calibration accounts for probe loading effects. Long-duration stress tests (>1 hour) confirm no parametric drift occurs in the 20-TSSOP package under sustained load.
Are there any known limitations in cascading multiple SN65LVDT14PWR devices for daisy-chained communications, and what synchronization challenges arise?
Cascading the SN65LVDT14PWR is feasible but introduces latency and potential metastability risks due to asynchronous clock domains. Each stage adds propagation delay (~2–3 ns per device), which accumulates and reduces timing margins at 125 Mbps. Without phase-locked loops (PLLs) or deskew buffers, clock recovery becomes unreliable beyond three stages. Metastability may occur at receiver inputs when data transitions coincide with internal sampling edges, especially if setup/hold times aren’t strictly maintained. To mitigate this, synchronize all devices to a common reference clock using external clock distribution ICs, or employ packet-based framing with embedded timing information. Also, ensure each link meets BER requirements individually before chaining, as degradation compounds multiplicatively. The half-duplex nature complicates bidirectional daisy chains without sophisticated arbitration protocols.
How does the Moisture Sensitivity Level (MSL) rating of MSL 1 for the SN65LVDT14PWR affect handling procedures during assembly, and what storage conditions are required?
With an MSL rating of 1, the SN65LVDT14PWR is considered moisture-insensitive and can withstand unlimited exposure to ambient humidity prior to reflow soldering, provided it remains within manufacturer-recommended storage conditions. However, best practice dictates storing packaged devices in dry cabinets (<10% RH) with desiccants and humidity indicator cards. During assembly, pre-bake is unnecessary unless the device has been exposed to humid environments for extended periods. Standard IPC/JEDEC J-STD-033 guidelines apply: if opened packaging shows high humidity (>10%), bake at 125°C for 24 hours before processing. This precaution prevents popcorning during reflow, which could crack the 20-TSSOP body and compromise solder joints. Since lead-free solder profiles exceed 217°C, even brief exposure won’t harm the die if properly sealed in original packaging.
What regulatory certifications (RoHS, REACH, ECCN) indicate about the SN65LVDT14PWR’s environmental and export compliance, and how do they impact global sourcing decisions?
The SN65LVDT14PWR complies with RoHS3 directives, eliminating hazardous substances like lead, mercury, and cadmium above specified thresholds. It is REACH unaffected, meaning no SVHC (Substances of Very High Concern) content exceeds 0.1% by weight. Export classification under ECCN EAR99 signifies it is not subject to strict U.S. export controls, simplifying international procurement. HTSUS 8542.39.0001 confirms harmonized tariff treatment as integrated circuits. These attributes make the part suitable for EU, North American, and Asian markets without additional documentation. Suppliers must still verify batch-level compliance through Certificates of Conformance, as component reuse or rework could alter material composition. For defense or aerospace applications, additional screening may apply despite civilian-grade status.
Can the SN65LVDT14PWR drive non-LVDS loads, and what modifications are needed to maintain signal fidelity?
Driving non-LVDS loads such as RS-422 or CMOS requires level shifting or impedance transformation due to the SN65LVDT14PWR’s fixed differential output structure. Direct connection risks violating input thresholds of target devices or causing excessive current draw from LVDS outputs. One solution is inserting a discrete transistor pair or dedicated translator IC between the SN65LVDT14PWR and the load. Alternatively, AC-coupling with series resistors (e.g., 100 Ω) and DC blocking capacitors enables interfacing with unterminated lines, though this sacrifices low-frequency response. Always verify receiver input sensitivity matches the translated signal swing. The SN65LVDT14PWR’s 3.3 V logic levels align well with modern CMOS families, but voltage translation networks must preserve timing budgets at 125 Mbps.
What role does the base product number 65LVDT14 play in inventory management and obsolescence planning for designs using the SN65LVDT14PWR?
The base product number 65LVDT14 serves as a family identifier across Texas Instruments’ portfolio, indicating shared core functionality and manufacturing processes among variants like SN65LVDT14PWR, SN65LVDT14DR, and others differing only in packaging. This consistency aids in long-term supply continuity and cross-referencing replacement parts during lifecycle transitions. However, subtle process revisions between base numbers can affect parameters like propagation delay or power consumption, so datasheet verification remains mandatory. Designers should monitor TI’s Product Lifecycle Status page for early warnings of discontinuation. Using the full part number SN65LVDT14PWR ensures traceability to specific revision and packaging, avoiding costly misorders. Strategic stocking of alternative packages (e.g., SOIC vs. TSSOP) within the same base family can hedge against lead-time volatility.
How does the SN65LVDT14PWR’s half-duplex architecture influence protocol selection in embedded systems, and are there latency penalties compared to full-duplex alternatives?
The half-duplex constraint means only one direction of communication can occur at a time, requiring explicit turnaround protocols in software or hardware. This suits SPI-like interfaces where master initiates transactions, but adds overhead for acknowledgment cycles or turnaround delays. Compared to full-duplex LVDS transceivers like the SN65LVDS9637, the SN65LVDT14PWR introduces inherent latency due to direction-switching intervals. Typical turnaround time is ~20 ns, limiting maximum throughput in bursty traffic patterns. For applications prioritizing simplicity and low pin count over peak bandwidth, this trade-off is acceptable. Protocols like I²C or custom frame-based serial comms benefit from half-duplex operation, but real-time control loops may suffer from increased jitter. Full-duplex alternatives eliminate this bottleneck but require separate transmit/receive pairs, doubling channel count and complexity.
What are the consequences of exceeding the absolute maximum ratings for VCC or input voltage on the SN65LVDT14PWR, and how can circuit protection be implemented?
Exceeding VCC(max) = 3.6 V risks permanent damage to internal ESD diodes and oxide layers, potentially causing latch-up or functional failure. Similarly, applying voltages beyond ±6 V to inputs compromises protection structures. Even brief excursions can accelerate wear-out mechanisms. To prevent violations, series resistors (100 Ω–1 kΩ) limit fault currents, while TVS diodes clamp transients to safe levels. Voltage supervisors with open-drain reset outputs can disable the chip if VCC droops below 2.7 V. Reverse polarity protection using P-channel MOSFETs adds robustness in mobile applications. Always adhere to datasheet guidelines for transient immunity (IEC 61000-4-2 Level 3). The SN65LVDT14PWR’s 3 V minimum supply implies dropout voltage must be accounted for in battery-powered designs to avoid brownout conditions.
How does the SN65LVDT14PWR’s driver strength compare to receiver sensitivity, and what impact does this have on link budget calculations?
The SN65LVDT14PWR delivers a typical differential output voltage of 350 mV, sufficient for driving 100 Ω loads over moderate distances. Receiver input sensitivity is ±100 mV, providing a healthy margin of ~250 mV for noise and attenuation. This asymmetry means the link budget favors transmission reliability over reception robustness, which is generally acceptable given LVDS’s inherent noise immunity. However, in lossy media (e.g., long cables or FR4 traces), cumulative attenuation may erode this margin. Link budget calculations must include connector losses (~0.5 dB per mate), PCB dielectric losses (~0.2 dB/inch at 125 Mbps), and crosstalk penalties. The 125 Mbps data rate limits usable distance to ~1 meter over standard backplanes without equalization. Ensuring the worst-case received voltage exceeds 125 mV guarantees reliable operation across all environmental conditions.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments SN65LVDT14PWR

Product Attribute SN65LVDT14PWRG4 SN65LVDT14PWG4 SN65LVDT14PW SN65LVDT2DBVR
Part Number SN65LVDT14PWRG4 SN65LVDT14PWG4 SN65LVDT14PW SN65LVDT2DBVR
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Series - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Number of Drivers/Receivers - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Protocol - - - -
Voltage - Supply - - - -
Duplex - - - -
Data Rate - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Type - - - -

SN65LVDT14PWR Datasheet PDF

Download SN65LVDT14PWR pdf datasheets and Texas Instruments documentation for SN65LVDT14PWR - Texas Instruments.

HTML Datasheet
SN65LVDT14/41.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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SN65LVDT14PWR Image

SN65LVDT14PWR

Texas Instruments
32D-SN65LVDT14PWR

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